PAMS Technical Documentation NSB–6 Series Transceivers UI Description Issue 1 06/2000 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation CONTENTS UI Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Module Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAMS Technical Documentation NSB–6 UI Description This page intentionally left blank. Issue 1 06/2000 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation UI Description Introduction UI module is implemented on same PCB board with BB–module and RF– module. UI HW part are LCD, backlighting, audio parts, IR and vibra. Buzzer Keys 8 1 5 LCD 2 BASEBAND 2 3 IR 1 1 LED Vibra BB Interface Signal IRONX FBUS_RX FBUS_TX Parameter Max Unit 0 0.3 x VBB V 0.7 x VBB VBB 0 0.3 x VBB IR receive no pulse 0.7 x VBB VBB IR transmit pulse 0.
NSB–6 UI Description PAMS Technical Documentation Signal Parameter Min Max Unit 0 0.7 x VBB 0.3 x VBB VBB V 0 0.7 x VBB 0.3 x VBB VBB Keyboard matrix row 5 LCD driver code/ data selection SCL 0 0.7 x VBB 0.3 x VBB VBB LCD driver serial clock SDA 0 0.7 x VBB 0.3 x VBB VBB LCD driver serial data LCDEN 0 0.7 x VBB 0.3 x VBB VBB LCD driver chip select LCDRSTX 0 0.7 x VBB 0.3 x VBB VBB LCD driver reset GND 0 0 BUZZER 0 0.3 x VBB PWM low level 0.
NSB–6 UI Description Pin 5 PAMS Technical Documentation Line Symbol LCDCSX Parameter Minimum Chip select input 6 OSC External clock for LCD 7 GND Ground 8 VOUT DC/DC voltage converter output 9 LCDRSTX Reset Typical / Nominal Maximum 0.7xVBB VBB 0 0.3xVBB 0.7xVBB VBB 30.4 32.0 33.6 0 Unit Notes Data Active kHz Connected to VBB on PCB V 9 9 0 0.3xVBB 0.7xVBB VBB Active 1 Display Driver Viewing trought LCD cell Page 6 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation Functional Description Audio control The audio control and processing is taken care by the COBBA–GJP, which contains the audio (and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals. MAD COBBA Bias + EMC Preamp Premult. DSP MIC2 MICP/N Pre & LP MIC1 XMICP/N MIC3 EMC + Acc. Interf. MCU Multipl. A D XEARP/N Buzzer Driver in UISWITCH HFCM Amp Multipl.
NSB–6 UI Description PAMS Technical Documentation 2.8 V 2.8 V Baseband 100k 100k MAD HeadDet CCUT HookDet 100k CCONT 220k EAD 33k 100k AUXOUT 10k 10k 470R PData(2) 10k 10k 100R 10m CTIM HF XEARP CHAPS 470R 10m XEARN HFCM COBBA 33k 33n 2k2 100R XMICP MIC1P MIC1N 33n 33n 100R 2k2 XMICN MIC3N 1k MIC3P 33n Combined headset and system connector audio signals, does not include EMC parts.
NSB–6 UI Description PAMS Technical Documentation erly the system connector must be assembled otherwise the transceiver will assume that some accessory is connected. In XMICN signal there is a 1.0 kW pulldown in transceiver and serial 1040 W from AUXOUT to XMICP. The XMICN is connected to transistor which is then connected to the HookDet line (in MAD). External accessory notices powered–up phone by detecting voltage in HeadDet line.
NSB–6 UI Description PAMS Technical Documentation inputs and earphone outputs. In the XMICN line there is a 1.0 kW pulldown in the transceiver. The PPH–1 has a low resistance pullup compared to the transceiver pulldown. When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a powered PPH–1 is connected, the XMICP is pulled up.
NSB–6 UI Description PAMS Technical Documentation Keyboard Matrix size is 5 row and 5 columns. Scanning is used for keyboard reading. Rows and columns is connected to MAD interface. Keyboard Matrix ROW/COL 0 1 2 3 4 0 SLIDE SWT Side Key Send End/Mode Side Key 1 NC Soft left Up Down Soft Right 2 NC 1 4 7 * 3 NC 2 5 8 0 4 PWR switch 3 6 9 # NC = Not Connected Issue 1 06/2000 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation Power Key Micro switch is used as a power key on UI module. Circuitry includes micro switch and two diodes which is needed for MAD interface. Power key is connected to CCONT. Power switch is active in LOW state. Power key is connected to ROW4. Backlighting Switching circuits for backlighting are placed on UI module. Display and keyboard lighting is connected together.
PAMS Technical Documentation NSB–6 UI Description Buzzer Alerting tones and/or melodies as a signal of an incoming call are generated with a buzzer that is controlled with a PWM signal by the MAD via UISWITCH. Also keypress and user function response beeps are generated with the buzzer. The buzzer is a SMD device and is placed on the mother board. Target for SPL is 100dB (A) at 5cm. Issue 1 06/2000 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation Speaker Speaker circuit includes pads for speaker and 2 capacitors, 2 ferrites for EMC protection. Speaker is sealed to A–cover with gasket and UI PCB with supporting ring. With that the frequency response is more constant. Speaker does not need holes for PCB. This gives reliable sound quality for the phone and it can be estimated in several environments. Arrangement is not a leak tolerant speaker.
NSB–6 UI Description PAMS Technical Documentation Microphone The internal microphone is placed to slide. Microphone is OMNI directional. The microphone requires a bias current to operate. The bias current is generated from VCOBBA supply with a transistor. EMC protection parts are implemented partly in slide and partly on motherboard. Pin Name X300/2 X300/1 Typ Max Unit Notes MICP 0.55 4.1 mV Connected to COBBA MIC2N input.
NSB–6 UI Description PAMS Technical Documentation Vibra Alerting Device A vibra alerting device is used for giving silent signal to the user of an incoming call. Vibra is located in the phone. The vibra is controlled with a PWM signal by the MAD via UISWITCH. Signal Parameter M300 / 1 Ivibra Typ Max Unit 1.0 1.1 1.2 V 115 140 mA 8000 12000 rpm Rated load current Rated load speed Page 16 Min 7000 E Nokia Mobile Phones Ltd.
NSB–6 UI Description PAMS Technical Documentation IR Module An infrared transceiver module is designed to substitute an electrical cable between the phone and a PC. The infrared transceiver module is a stand alone component capable to perform infrared transmitting and receiving functions by transforming signals transmitted in infrared light from and to electrical data pulses running in two wire asynchronous databus. IR is located left bottom corner of the product.
NSB–6 UI Description PAMS Technical Documentation The FBUS cannot be used for external accessory communication, when the infrared mode is selected. Infrared communication reserves the FBUS completely. Page 18 E Nokia Mobile Phones Ltd.
