User Guide

CCS Technical Documentation System Module
RH-10
Issue 1 09/2002 Nokia Corporation Confidential Page 25
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EMC
General
EMC performance of the RH-10 baseband is improved by using a shield to cover main
components of BB, such as UEM, UPP, and Flash. UEM has internal protection against
±8kV ESD pulse. BB shield is soldered into PWB and it also increases the rigidity of PWB
in the BB area, thus improving phone reliability. Shield also improves thermal dissipation
by spreading the heat more widely.
A protective metal deck is located underneath the battery and is grounded to both the
BB shield and the RF shield.
BB Component and Control I/O Line Protection
Keyboard Lines
ESD protection for keyboard signals is implemented by using metaldome detection.
Grounded keydomes are very effective for ESD protection and do not require additional
components for ESD protection -> very low cost solution. The distance from A-cover to
PWB is made longer with the spikes in the keymat. C-cover metallization also protects
keyboard lines.
C-Cover
C-cover on the UI side is metallized from inner surface (partly) and grounded to module
gnd. All those areas where plated C-cover touches PWB surface are grounded and solder
mask are opened.
PWB
All edges are grounded from both sides of PWB and solder mask is opened from these
J414
J403
J413
J402
J404
J405
J407
J415
J408
J412
J406
J409
J411
J410
UEM (D200)
UPP (D400)
PURXSLEEPX
SLEEPCLK
UEMINT
CBUSCLK
CBUSDA
CBUSENX
MBUSTX MBUSR
X
FBUSTX
FBUSRX
DBUSCLKDBUSDA
DBUSEN1X