PAMS Technical Documentation NSM–3 Series Transceivers UI Module Issue 1 12/1999 Nokia Mobile Phones Ltd.
NSM–3 UI Module PAMS Technical Documentation CONTENTS UI Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Module Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bottom Connector signals . . . . . . . . . . . . . . . . . . . . . . . . . . .
NSM–3 UI Module PAMS Technical Documentation UI Module Introduction UI module is implemented on same PCB board with BB–module and RF– module. UI HW part are LCD, backlighting, audio parts, IR, keyboard, power key and vibra. Buzzer Keys 8 1 5 LCD 2 BASEBAND 2 3 IR 1 1 LED Vibra BB Interface Signal IRONX FBUS_RX FBUS_TX Parameter Min Max Unit 0 0.3 x VBB V 0.7 x VBB VBB 0 0.3 x VBB IR receive no pulse 0.7 x VBB VBB IR transmit pulse 0.
NSM–3 UI Module PAMS Technical Documentation Signal Parameter Min Typ Max Unit V Notes PWRONX Power on signal 0 0.7 x VBB 0.3 x VBB VBB ROW5/ LCDCD LCD command / data 0 0.7 x VBB 0.3 x VBB VBB Keyboard matrix row 5 LCD driver code/ data selection SCL Serial clock for LCD 0 0.7 x VBB 0.3 x VBB VBB LCD driver serial clock SDA Serial data for LCD 0 0.7 x VBB 0.3 x VBB VBB LCD driver serial data LCDEN LCD enable 0 0.7 x VBB 0.
NSM–3 UI Module PAMS Technical Documentation Pin 4 5 Line Symbol LCDCDX LCDCSX Parameter Minimum Control/display data flag input Chip select input 6 OSC External clock for LCD 7 GND Ground 8 VOUT DC/DC voltage converter output 9 LCDRSTX Reset Typical / Nominal Maximum 0 0.3xVBB 0.7xVBB VBB 0 0.3xVBB 0.7xVBB VBB 30.4 32.0 33.6 0 Unit Notes Control Data Active kHz Connected to VBB on PCB V 9 9 0 0.3xVBB 0.
NSM–3 UI Module PAMS Technical Documentation Bottom Connector signals Name Min Typ Max 2.2 Unit kΩ Input AC impedance 1 Vpp Maximum signal level 1.47 1.55 V Mute (output DC level) 2.5 2.9 V Unmute (output DC level) 100 600 µA Bias current 350 mV Maximum signal level XMICP, XMICN 60 XEARP, XEARN 47 Ω Output AC impedance (ref. GND) 10 µF Series output capacitance Ω Load AC impedance to GND (Headset) kΩ Load AC impedance to GND (Accessory) 1.
NSM–3 UI Module PAMS Technical Documentation Functional Description Audio control The audio control and processing is taken care by the COBBA–GJP, which contains the audio (and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals. MAD COBBA Bias + EMC Preamp Premult. DSP MIC2 MICP/N Pre & LP MIC1 XMICP/N MIC3 EMC + Acc. Interf. MCU Multipl. A D XEARP/N Buzzer Driver in UISWITCH HFCM Amp Multipl.
NSM–3 UI Module PAMS Technical Documentation 2.8 V 2.8 V Baseband 100k 100k MAD HeadDet CCUT HookDet 100k CCONT 220k EAD 33k 100k AUXOUT 10k 10k 470R PData(2) 10k 10k 100R 10 CTIM HF XEARP CHAPS 470R 10 XEARN HFCM COBBA 33k 33n 2k2 100R XMICP MIC1P MIC1N 33n 33n 100R 2k2 XMICN MIC3N 1k MIC3P 33n Analog audio accessory detection In XEARP signal there is a 100 k pullup and 33k pulldown in the transceiver for HeadDet.
NSM–3 UI Module PAMS Technical Documentation will assume that some accessory is connected. In XMICN signal there is a 1.2 kW pulldown in transceiver and serial 1.2 kW from AUXOUT to XMICP. The XMICN is connected to transistor which is then connected to the HookDet line (in MAD). External accessory notices powered–up phone by detecting voltage in HeadDet line.
NSM–3 UI Module PAMS Technical Documentation inputs and earphone outputs. In the XMICN line there is a 1.0 kW pulldown in the transceiver. The PPH–1 has a low resistance pullup compared to the transceiver pulldown. When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a powered PPH–1 is connected, the XMICP is pulled up.
NSM–3 UI Module PAMS Technical Documentation Keyboard Matrix size is 5 row and 5 columns. Scanning is used for keyboard reading. Rows and columns is connected to MAD interface. Keyboard Matrix ROW/COL 0 1 2 3 4 0 SLIDE SWT Side Key Send End/Mode Side Key 1 NC Soft left Up Down Soft Right 2 NC 1 4 7 * 3 NC 2 5 8 0 4 PWR switch 3 6 9 # NC = Not Connected Issue 1 12/1999 Nokia Mobile Phones Ltd.
NSM–3 UI Module PAMS Technical Documentation Power Key Micro switch is used as a power key on UI module. Circuitry includes micro switch and two diodes which is needed for MAD interface. Power key is connected to CCONT. Power switch is active in LOW state. Power key is connected to ROW4. Backlighting Switching circuits for backlighting are placed on UI module. Display and keyboard lighting is connected together.
PAMS Technical Documentation NSM–3 UI Module Buzzer Alerting tones and/or melodies as a signal of an incoming call are generated with a buzzer that is controlled with a PWM signal by the MAD via UISWITCH. Also keypress and user function response beeps are generated with the buzzer. The buzzer is a SMD device and is placed on the mother board. Target for SPL is 100dB (A) at 5cm. Issue 1 12/1999 Nokia Mobile Phones Ltd.
NSM–3 UI Module PAMS Technical Documentation Speaker Speaker circuit includes pads for speaker and 2 capacitors, 2 ferrites for EMC protection. Speaker is sealed to A–cover with gasket and UI PCB with supporting light guide. With that the frequency response is more constant. Speaker does not need holes for PCB. This gives reliable sound quality for the phone and it can be estimated in several environments. Arrangement is a leak tolerant speaker.
NSM–3 UI Module PAMS Technical Documentation Microphone The internal microphone is placed B–cover. Microphone is OMNI directional. The microphone requires a bias current to operate. The bias current is generated from VCOBBA supply with a transistor. EMC protection parts are implemented on motherboard. Pin Name X300/2 X300/1 Typ Max Unit Notes MICP 0.55 4.1 mV Connected to COBBA MIC2N input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB.
NSM–3 UI Module PAMS Technical Documentation Vibra Alerting Device A vibra alerting device is used for giving silent signal to the user of an incoming call. Vibra is located in the phone. The vibra is controlled with a PWM signal by the MAD via UISWITCH. Signal Parameter M300 / 1 Ivibra Typ Max Unit 1.0 1.1 2.0 V 115 140 mA 8000 12000 rpm Rated load current Rated load speed Page 16 Min 7000 Nokia Mobile Phones Ltd.
NSM–3 UI Module PAMS Technical Documentation IR Module An infrared transceiver module is designed to substitute an electrical cable between the phone and a PC. The infrared transceiver module is a stand alone component capable to perform infrared transmitting and receiving functions by transforming signals transmitted in infrared light from and to electrical data pulses running in two wire asynchronous databus. IR is located left bottom corner of the product.
NSM–3 UI Module PAMS Technical Documentation The FBUS cannot be used for external accessory communication, when the infrared mode is selected. Infrared communication reserves the FBUS completely. Page 18 Nokia Mobile Phones Ltd.
