User Guide

System Module LG4 and Grip Module LS4 CCS Technical Documentation
Page 36 ¤Nokia Corporation Issue 2 11/02
The baseband circuitry is located on the A-side of the board, which is shielded with a
metallized frame and ground plane of the UI-board.
Maximum height inside on B-side is 1.8 mm. Heat generated by the circuitry is con-
ducted out via the PCB ground planes and metallic B-shield
RF Frequency Plan
Figure 21: RF Frequency plan
HAGAR
PLL
26 MHz
VCTCXO
f
f/2f/4
f
3420–
3840
MHz
925–960
MHz
880–915
MHz
I–signal
1805–1880
MHz
f
f/4
f
f/2
Q–signal
I–signalI–signalI–signal
RX
TX
I–signal
Q–signal
1710–1785
MHz