User Guide

NMM-3 Company Confidential
4 - Service Tools CCS Technical Documentation
Page 4-18 Copyright  2003 Nokia Corporation Issue 1 (11/2003)
Company Confidential
6.1 Profile Measurement Method on PWBs for Rework Station
Needed equipment: Product PWB, CSP component, 3 pcs. K-type thermocouples, data
logger, e.g. Datapaq, glue or Kapton tape.
Thermocouples should be placed in 3 positions on product: one on top of component sur-
face, one between component and PWB and one beneath the PWB.
To start, drill holes from beneath the PWB under the BGA . The temperature for the pro-
file is measured using K-type thermocouple between the component and the PWB. Insert
thermocouple probes through the hole so that the probe is properly located between the
PWB and component.
To attach thermocouple to PWB surface (solder land) or on small component, use small
amounts of high melting point solder. The melting point of the solder must be higher
than 260 °C. To attach thermocouple on top of a component, use a small amount of
appropriate, temperature resistant glue or heat resistant tape (Kapton).
6.2 Measuring procedure
• To start, adjust PWB with thermocouples to rework station and connect
the thermocouple cables to datalogger.
• Choose right heating profile. Start profile and wait when profiling will
end.
• Download information to Pc. Analyzed information and compare it
against to specification.
• Make temperature adjustment in rework station if needed and repeat
profile again.
• Analyzed information.
6.3 Sample Profile
The following profile is a made for an 6620 (RH-20) PA component and meets the speci-
fication requirements.
Example of thermocouple attachment