User Guide

PAMS
Technical Documentation
NSE–5
System Module
Page 2 – 32
Issue 1 07/99
Figure 13. Combined headset and system connector audio signal
XEAR
SGN
D
47R
10
100n
100n
HEADDET
H
F
HFC
M
47k
VBB
MIC1
N
MIC1
P
100n
100n
MIC3
N
MIC3
P
XMI
C
220k
MAD
100n
HOOKDET
AUX-
OUT
EADCCONT
2k2
27p
Note 1: Grey resistor are in the border of ”EMI clean” and ”dirty” areas.
Note 2: AGND is connected directly to the GND on PCB close to HF parts.
Note 3: ESD protection diodes are not shown.
Baseband
COBBA–
GJP
220k
LGN
D
+
+
+
R01
C01
C02
C03
L01
Z01
SW01
PC–Board
R01= 100R
C01=33uF
C02=1000pF
C03=22pF
L01=MMZ2012Y6
01BT/TDK
AGND
330R
27p
2k2
AGND AGND AGND
100n
AGND
PD2
AGND
1u
AGND
10u
AGND
27p
VBB VBB
10k
2k2
33R
2k2 47k
100MHz
100R
100R