PAMS Technical Documentation NSE–5 Series Transceivers Chapter 2 System Module Issue 1 07/99
NSE–5 System Module PAMS Technical Documentation Contents Page No System Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slide Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slide Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAMS NSE–5 Technical Documentation System Module 4–wire PCM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Speech Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alert Signal Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAD2PR1 . . . . . . . . . . . . . . . . . . . . . . . .
NSE–5 System Module PAMS Technical Documentation List of Figures. Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. System Connector – module . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Connector – detailed. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAMS NSE–5 System Module Technical Documentation System Connector This section describes the electrical connection and interface levels between the baseband, RF and UI parts. The electrical interface specifications are collected into tables that cover a connector or a defined interface.
NSE–5 System Module PAMS Technical Documentation IBI connector (6 pads) B side view 14 8 Fixing pads (2 pcs) DC Jack PCB 7 1 Microphone Bottom acoustic ports BB connector (6 pads) ÁÁ ÁÁ ÁÁ ÂÂÂÂÂÂ A B Charger pads (3 pcs) Cable locking holes (3 pcs) A side view Figure 2. System Connector – detailed. Table 1. System connector signals. Pin Name Function Description 1 V_IN Bottom charger contacts Charging voltage. 2 L_GND DC Jack Logic and charging ground.
PAMS NSE–5 System Module Technical Documentation Table 1. System connector signals. (continued) Pin Name Function Description 12 FBUS_RX Bottom & IBI connectors Serial data in. 13 FBUS_TX Bottom & IBI connectors Serial data out. 14 L_GND Bottom charger contacts Logic and charging ground. DC Connector The electrical specifications in NO TAG shows the idle voltage produced by the acceptable chargers at the DC connector input.
NSE–5 System Module PAMS Technical Documentation Table 2. Mic signals of the system connector NA NA MICN mouted in slide 0 2 12.5 mV Connected to COBBA_GJP MIC2N input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value – 16 dB. MICP mounted in slide 0 2 12.5 mV Connected to COBBA_GJP MIC2P input. The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB.
PAMS NSE–5 System Module Technical Documentation Table 3. System/IBI connector Pin IB- Name Function pin 8 Yes XMIC Analog audio input (from accessory to phone) Min Typ Max 2.0 2.2 100 1 2.0 Headset microphone input (from accessory to 100 phone) hone) 2.2 2.
NSE–5 System Module PAMS Technical Documentation Table 3. System/IBI connector (continued) Pin IB- Name Function pin Min Typ Max 13 0.1 0.8 V 1.7 2.8 V Yes FBUS Serial _ _TX da data a out u (f (from phone to accessory) 47 kW 220 kW 11 Yes FBUS Serial _RX RX data d t in i (from accessoryy to phone) h ) Yes MBUS Bidirecti tional l serii al bus FLAS H_CL K Flash serial data clock (f (from accessory to phone) Page 2 – 10 Output low voltage @ IOL 4 mA (ref.
PAMS NSE–5 System Module Technical Documentation Table 3. System/IBI connector Pin IB- Name Function Min Typ Max pin 2, – L_GN Logic and 0 1.0 14 D charging ground (separated from phone GND by EMI components) 4,5 – CHRG Charger _CTR ccontrol _C L (f (from phone to accessory – VIN Fast charger h (from accessory to phone) hone) Ground current V 1.7 2.
NSE–5 System Module PAMS Technical Documentation VBB Baseband 47k 220k PC–Board HOOKDET MAD + 100n 220k HEADDET R01 + 100n CCONT EAD VBB AGND + C01 VBB SW01 AGND 2k2 10 C03 47k 47R HF COBBA –GJP AUX OUT XEAR C02 100MHz LGND 10k 33R 27p PD2 2k2 10u 1u HFCM MIC1N MIC1P MIC3N MIC3P AGND AGND 100R 2k2 100n 2k2 100n AGND 100R XMIC L01 SGND Z01 27p 100n 27p 330R 100n AGND AGND AGND R01= 100R C01=33uF C02=1000pF C03=22pF L01=MMZ2012Y6 01BT/TDK Note 1: Grey resi
PAMS NSE–5 System Module Technical Documentation Battery Connector The BSI contact on the battery connector is used to detect when the battery is removed with power switched on enabling the SIM card operation to shut down first. The BSI contact in the battery pack should be shorter than the supply power contacts to give enough time for the SIM shut down. No metal in these areas! old connector type 1 3 4 2 B side view. phone Figure 4.
NSE–5 System Module PAMS Technical Documentation SIM Card Connector The SIM card connector is located on the PCB. Only small SIM cards are supported. 321 456 Figure 5. Sim Card Reader Ultra phone Table 4. SIM Connector Electrical Specifications Pin Name Parameter Min 1 GND GND 0 2 VSIM 5V SIM Card 3V SIM Card 4.8 2.
PAMS NSE–5 System Module Technical Documentation Infrared Transceiver Module An infrared transceiver module is designed as a substitute for hardwired connections between the phone and a PC. The infrared transceiver module is a stand alone component. In DCT3 the module is located inside and at the top of the phone. The Rx and Tx is connected to the FBUS via a dual bus buffer. The module and buffer is activated from the MAD2_pr1 with a pull up on IRON.
NSE–5 System Module PAMS Technical Documentation Real Time Clock Requirements for a real time clock implementation are a basic clock (hours and minutes), a calender and a timer with alarm and power on/off –function and miscellaneous calls. The RTC will contain only the time base and the alarm timer but all other functions (e.g. calendar) will be implemented with the MCU software. The RTC needs a power backup to keep the clock running when the phone battery is disconnected.
PAMS NSE–5 Technical Documentation System Module Baseband Module Technical Summary The baseband architecture is basically similar to DCT3 GSM phones. DCT3.5 differs from DCT3 in the single pcb koncept and the seriel interface between MAD2PR1 and COBBA_GJP and MAD2PR1 and CCONT. In DCT3.5 the MCU, the system specific ASIC and the DSP are intergrated into one ASIC, called the MAD2PR1 chip, which takes care of all the signal processing and operation controlling tasks of the phone.
NSE–5 System Module PAMS Technical Documentation TX/RX SIGNALS RF SUPPLIES PA SUPPLY 13MHz SYSTEM CLOCK CLK COBBA SUPPLY COBBA_GJP SIM CCONT BB SUPPLY core voltage 32kHz CLK SLEEP CLOCK LCD vibra motor MAD2pr1 + MEMORIES IR VBAT CHAPS roller BATTERY NiMH LiIon AUDIOLINES BASEBAND SYSCON Figure 7. Block Diagram Power Distribution In normal operation the baseband is powered from the phone‘s battery. The battery consists of one Lithium–Ion cell.
PAMS NSE–5 System Module Technical Documentation The power management circuitry provides protection against overvoltages, charger failures and pirate chargers etc. that could cause damage to the phone. RF SUPPLIES PA SUPPLY VCOBBA VSIM CCONT PWRONX COBBA_GJP SIM CNTVR LCD MODULE VBAT RTC BACKUP VBB core voltage VBB PURX sram VBAT MAD2pr1 + MEMORIES POWER MGMT BASEBAND PWM BATTERY VIN CONNECTOR Figure 8. Baseband power distribution The heart of the power distrubution is the CCONT.
NSE–5 System Module PAMS Technical Documentation CCONT supply a core voltage to the MAD2PR1. The core voltage is by default 1.975V. RAM backup as in PDC3 phone. CCONT generates also a 1.5 V reference voltage VREF to COBBA_GJP, SUMMA. The VREF voltage is also used as a reference to some of the CCONT A/D converters and as a reference for al the other regulators.
PAMS NSE–5 Technical Documentation System Module Power Up The baseband is powered up by: 1. Pressing the power key, that generates a PWRONX interrupt signal from the power key to the CCONT, which starts the power up procedure. 2. Connecting a charger to the phone. The CCONT recognizes the charger from the VCHAR voltage and starts the power up procedure. 3. A RTC interrupt.
NSE–5 System Module PAMS Technical Documentation SLEEPX PURX CCPURX PWRONX VR1,VR6 VBB (2.8V) Vchar 1 2 3 1:Power switch pressed ==> Digital voltages on in CCONT (VBB) 2: CCONT digital reset released. VCXO turned on 3: 62 ms delay to see if power switch is still pressed. Power Up by RTC RTC ( internal in CCONT) can power the phone up by changing RTCPwr to logical ”1”. RTCPwr is an internal signal from the CCONT digital section.
PAMS NSE–5 System Module Technical Documentation Sleep Mode In the sleep mode all the regulators except the baseband VBB, Vcore and the SIM card VSIM regulators are off. Sleep mode is activated by the MAD2PR1 after MCU and DSP clocks have been switched off. The voltage regulators for the RF section are switched off and the VCXO power control, VCXOPwr is set low. In this state only the 32 kHz sleep clock oscillator in CCONT is running.
NSE–5 System Module PAMS Technical Documentation Startup Charging When a charger is connected, the CHAPS is supplying a startup current minimum of 130mA to the phone. The startup current provides initial charging to a phone with an empty battery. Startup circuit charges the battery until the battery voltage level is reaches 3.0V (+/– 0.1V) and the CCONT releases the PURX reset signal and program execution starts.
PAMS NSE–5 System Module Technical Documentation VCH VCH
NSE–5 System Module PAMS Technical Documentation VCH Vpor (Standard Charger) Droop depends on load & C in phone VLIM Istart off due to VCH
PAMS NSE–5 System Module Technical Documentation SWITCH ON OFF ON OFF ON PWM (1Hz) SWITCH ON PWM (32Hz) Battery Identification Different battery types are identified by a pulldown resistor inside the battery pack. The BSI line inside transceiver has a 100k pullup to VBB. The MCU can identify the battery by reading the BSI line DC–voltage level with a CCONT (N100) A/D–converter.
NSE–5 System Module PAMS Technical Documentation The battery identification line is used also for battery removal detection. The BSI line is connected to a SIMCardDetX line of MAD2 (D200). SIMCardDetX is a threshold detector with a nominal input switching level 0.85xVcc for a rising edge and 0.55xVcc for a falling edge. The battery removal detection is used as a trigger to power down the SIM card before the power is lost. The BSI contact in the battery pack is made 0.
PAMS NSE–5 System Module Technical Documentation Supply Voltage Regulators The heart of the power distrubution is the CCONT. It includes all the voltage regulators and feeds the power to the whole system. The baseband digital parts are powered from the VBB regulator which provides 2.8V baseband supply. The baseband regulator is active always when the phone is powered on. The VBB baseband regulator feeds MAD and memories, COBBA digital parts and the LCD driver in the UI section.
NSE–5 System Module PAMS Technical Documentation Audio Control The audio control and processing is taken care by the COBBA–GJP, which contains the audio and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals. Slide EMI MAD COBBA Preamp Premult. Bias + EMI DSP MIC2 Pre & LP System Connector MIC1 EMI+ACC Interf. MCU Multipl. MIC3 A D XMIC SGND XEAR Buzzer Driver Circuit HFCM Amp Multipl.
PAMS NSE–5 Technical Documentation System Module The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is single ended with a dedicated signal ground SGND. Input and output signal source selection and gain control is performed inside the COBBA–GJP asic according to control messages from the MAD2.
NSE–5 System Module PAMS Technical Documentation VBB Baseband 47k 220k PC–Board HOOKDET MAD + 100n 220k HEADDET R01 + 100n CCONT VBB EAD AGND + C01 VBB SW01 AGND 2k2 C03 47k 10 47R XEAR H F C02 LGN D COBBA– GJP 10k AUXOUT 33R 100MHz 27p PD2 10u HFC M MIC1 N MIC1 P MIC3 N MIC3 P AGND 2k2 1u AGNDAGND 2k2 100n 2k2 100n 100R XMI C 100R SGN D L01 Z01 27p 100n 27p 330R 100n AGND AGND AGND R01= 100R C01=33uF C02=1000pF C03=22pF L01=MMZ2012Y6 01BT/TDK Note 1: Gr
PAMS NSE–5 System Module Technical Documentation Analog Audio Accessory Detection In XEAR signal there is a 47 k pullup in the transceiver and 6.8 k pull–down to SGND in accessory. The XEAR is pulled down when an accessory is connected, and pulled up when disconnected. The XEAR is connected to the HookDet line (in MAD), an interrupt is given due to both connection and disconnection. There is filtering between XEAR and HookDet to prevent audio signal giving unwanted interrupts.
NSE–5 System Module PAMS Technical Documentation PCMDClk PCMSClk PCMTxData PCMRxData sign extended 15 14 13 sign extended MSB 12 MSB 11 10 LSB 0 LSB The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is single ended with a dedicated signal ground SGND.
PAMS NSE–5 Technical Documentation System Module A vibra alerting device is used for giving a silent signal to the user of an incoming call. The device is controlled with a VibraPWM output signal from the MAD2PR1. The vibra alert can be adjusted either by changing the pulse width or by changing the pulse frequency. The vibra device is inside the phone, but a special vibra battery can also be used.
NSE–5 System Module PAMS Technical Documentation – FLEXPOOL (DAS00308 FlexPool Specification) – SERRFI (DAS00348 COBBA_GJP Specifications) The MAD2PR1 operates from a 13 MHz system clock, which is generated from the 13Mhz VCXO frequency. The MAD2PR1 supplies a 6,5MHz or a 13MHz internal clock for the MCU and system logic blocks and a 13MHz clock for the DSP, where it is multiplied to TBD MHz DSP clock.
PAMS NSE–5 System Module Technical Documentation Table 10.
NSE–5 System Module PAMS Technical Documentation Table 10.
PAMS NSE–5 System Module Technical Documentation Table 10.
NSE–5 System Module PAMS Technical Documentation Table 10.
PAMS NSE–5 System Module Technical Documentation Table 11. COBBA_GJP pin list Name Type 1 MIC1P I Positive high impedance input for microphone. 2 VSA5 P Negative analog power supply for PCM ADC 3 VSUBA P Audio Codec substrate contact 4 MIC3N I Third negative high impedance input for microphone. 5 MIC3P I Third positive high impedance input for microphone.
NSE–5 System Module PAMS Technical Documentation Table 11. COBBA_GJP pin list (continued) Name Type 31 VSA3 P Negative analogue power supply. 32 RxRef O Rx path internal reference buffered output. 33 VDA1 P Positive analogue power supply for the receivers. 34 RxInN I Negative receive input. 35 RxInP I Positive receive input. 36 VSA1 P Negative analogue power supply for the receivers. 37 ResetX I Master system reset. 38 PData(0) O PData(0).
PAMS NSE–5 System Module Technical Documentation Table 11. COBBA_GJP pin list (continued) Name Type Description 62 MIC2N I Second negative high impedance input for microphone. 63 MIC2P I Second positive high impedance input for microphone. 64 MIC1N I Negative high impedance input for microphone. Table 12. CCONT 3V Pin assignment Pin 1 Symbol RSSI Type I 2 ICHAR I 3 MODE_SEL I High Z / GND Mode select High Z=normal mode GND=RAM_Bck 4 VR3/RAM_bck O 0V/2.
NSE–5 System Module PAMS Technical Documentation Table 12. CCONT 3V Pin assignment (continued) Pin Symbol Type State In Reset Description 21 VBAT P 22 VR6 O 23 GROUND P 24 SLEEPX I ”1” Control VR1 regulator (CNTVR1) 25 VR1 O 2.
PAMS NSE–5 System Module Technical Documentation Table 12. CCONT 3V Pin assignment (continued) Pin Symbol Type State In Reset Description 48 SLCLK O 49 DATACLK I High Z MAD2PR1 bus clock 50 DATASELX I High Z MAD2PR1 bus enable 51 DATA_IN/OUT I/O High Z MAD2PR1 Bus serial data 52 CCONTINT O ”0” CCONT interrupt output 53 TEST I GND Test Pin (Ground =>normal operation) 54 PURX O ”0” Power up reset signal 55 VBB O 2.
NSE–5 System Module PAMS Technical Documentation Memories The MCU program code resides in an external program memory, size is16Mbits. MCU work (data) memory size is 1Mbits. A special block in the flash is used for storing the system and tuning parameters, user settings and selections, a scratch pad and a short code memory.
PAMS NSE–5 System Module Technical Documentation MCU Memory Requirements The MCU memory requirements are shown below. Table 13. HD945 Memory Requirements Product Device Organization Access Time ns Wait States Used Remarks DCT3.5 ROM 2Mx16 100 1 2.8V/2.8V Read/Write DCT3.5 SRAM 256Kx8 85 1 120ns @ 2.8V Read/Write Flash Programming The system connector can be used as a flash prom programming interface for flash memories for updating (i.e. re–programming) the flash program memory.
NSE–5 System Module PAMS Technical Documentation Table 14. Flash Programming, DC connector Pin Name Parameter Min Typ Max Unit Remark 1 VIN Supply Voltage 6.8 7.8 8.8 V Supply Voltage 2 GND GND 0 0 V Supply ground 11 MBUS Serial clock from the Prommer 2.0 0 2.8 0.8 V Prommer detection and Serial Clock for synchronous communication 12 FBUS_R Serial data X from the Prommer 2.0v 0v 2.8 0.
PAMS NSE–5 System Module Technical Documentation IBI power–on by phone Phone can power the IBI accessory on by pulling the BTEMP line up by MCUGenIO4 of MAD2. BTEMP measurement is not possible during this time. The accessory is commanded back to power–off by MBUS message. VB M 3x3Ru VBAT Vibra 10k 4k7 VREF BSI 100n 10n 100n 220k 100k 22k 10k BTEMP RT 47k NTC BTEMP 1k CCONT R214 2k2 GND VIBRAPWM MAD C105 10n MCUGenIO4 TRANSCEIVER BATTERY Figure 14.
NSE–5 System Module PAMS Technical Documentation MCU Memory Map MAD2PR1 supports maximum of 4GB internal and 4MB external address space. External memories use address lines MCUAd0 to MCUAd21 and 8–bit/16–bit databus. The BUSC bus controller supports 8– and 16–bit access for byte, double byte, word and double word data. Access wait states (0, 1 or 2) and used databus width can be selected separately for each memory block. Table 15.
PAMS NSE–5 Technical Documentation System Module RF Module The RF module converts the signal received by the antenna to a baseband signal and vice versa. It consists of a conventional superheterodyne receiver and a transmitter for each band and also two frequency synthesizers for the required mixing. The architecture contains two integrated circuits, a CRFU3_D1 and a SUMMA. They are both BiCMOS ASICs, which is a suitable technology for integration of RF functions.
NSE–5 System Module PAMS Technical Documentation RF Frequency Plan 13 MHz RX VCTCXO TXI TXQ 13 MHz 116 MHz IQ–Mod 58 MHz 232 MHz IQ–Mod Divider System PLL VHF VCO 71 MHz SUMMA PLL UHF 464 MHz VCO 1942–2067 MHz 232 MHz 116 MHz 1942–2017 MHz f 116 MHz 187 MHz f/2 1992–2067 MHz CRFU3 1006–1031 MHz 1805–1800 MHz Page 2 – 52 935–960 MHz 890–915 MHz 1710–1785 MHz Issue 1 07/99
PAMS NSE–5 System Module Technical Documentation DC Regulators The transceiver has a multi function power management IC, which contains among other functions 7 pcs of 2.8 V regulators. All regulators can be controlled individually with 2.8 V logic directly or through a control register. However, in the chosen configuration of the CCONT, direct control is only used with VR1. The control register is used to switch off the regulators when they are not in use. The CCONT also provides a 1.
NSE–5 System Module PAMS Technical Documentation Frequency Synthesizers LO to GSM1800 LO to GSM900 Figure 16. Frequency Synthesisers Both the UHF- and the VHF-VCO are locked with PLLs to a stable frequency source, which is a VCTCXO-module (Voltage Controlled Temperature Compensated Crystal Oscillator). The VCTCXO is running at 13 MHz and is locked to the frequency of the base station by means of an AFC (Automatic Frequency Control).
PAMS NSE–5 System Module Technical Documentation storing of new data into the dividers. The UHF-synthesizer is the channel synthesizer, so each step equals the channel spacing (200 kHz). When GSM900 operation is active, a 200 kHz reference frequency is used for the phase detector. For GSM1800 operation, a 100 kHz reference frequency has to be used.
NSE–5 System Module PAMS Technical Documentation diplexer that has one common antenna input/output is used. The selection between GSM900 and GSM1800 operation modes in the CRFU3 is done with the band selection signal (BAND_SEL) from the MAD in baseband. GSM900 front–end The GSM900 receiver is a dual conversion linear receiver. The front–end, which is located in the CRFU3 RF-, is activated with the band-selection signal (BAND_SEL) set to high-state.
PAMS NSE–5 Technical Documentation System Module external. Because it is an active mixer it also amplifies the IF-signal. Buffering of the local signal is integrated too. The first local signal is generated by the VHF-synthesizer. There is a balanced discrete LC-bandpass filter in the output of the first mixer which e.g. attenuates the critical spurious frequencies 161 MHz and 277 MHz and also the 151,5 MHz half-IF. It also matches the impedance of 187MHz output to the input of the following stage.
NSE–5 System Module PAMS Technical Documentation Transmitter Figure 18. Transmitter Block Diagram The transmitter consists of an IQ-modulator that is common for the GSM900 and the GSM1800 chain, two image rejection upconversion mixers, two power amplifiers and a power control loop. Common transmitter part The I- and Q-signals are generated by the COBBA in baseband. After the post filtering (RC-network) they are fed into the IQ-modulator in the SUMMA.
PAMS NSE–5 Technical Documentation System Module The output of the upconverter is single–ended and requires an external matching. The next stage is the TX interstage filter, which attenuates unwanted frequency components from the upconverter further. These unwanted component mainly originates from LO-leakage and insufficient suppression of the image frequency in the upconversion. The interstage filter attenuates wideband noise too. The filter is a bandpass SAW-filter.
NSE–5 System Module PAMS Technical Documentation To ensure enough power gain in the GSM1800 TX chain the TX signal then passes through the buffer (pre amplifier). The buffer is driven into saturation to compensate for variations in CRFU3 output level and ripple in the first TX interstage filter and to ensure constant input level at the GSM1800 PA. The next stage is the second TX interstage filter, which attenuates unwanted frequency components from the buffer.
PAMS NSE–5 Technical Documentation System Module TXC–voltage as function of time has a raised cosine form (cos4 - function). This shape reduces the switching transients, when the power is pulsed up and down. Because the dynamic range of the detector is not wide enough to control the power (actually RF output voltage) over the whole range, there is a control signal named TXP (TX power enable) to work under detected levels.
NSE–5 System Module PAMS Technical Documentation AFC function In order to maintain the clock of the transceiver, i.e. the 13 MHz VCTCXO, locked to the frequency of the base station an AFC (Automatic Frequency Control) is used. The AFC reduces variations in the frequency of the VCTCXO due to temperature drift. The AFC voltage is generated by baseband with an 11 bit DAC in the COBBA. There is a RC-filter in the AFC control line to reduce the noise from the converter.
PAMS NSE–5 Technical Documentation System Module Interfacing The interfacing between RF and BB is comprised of the signals stated below.
NSE–5 System Module PAMS Technical Documentation User Interface The UI module includes the following:– – LEDs for backlight – Plastic Window – Dust Seal, – LCD adhesive, – Light Guide – Reflector, – Connector – LCD cell (GD50) with display driver – ON/OFF key – Speaker Connections The module is delivered as a single assembly, (refer to disassembly section). Figure 19.
PAMS NSE–5 Technical Documentation System Module LEDs LEDs for the backlight of the LCD via the lightguide are mounted on the back side of the module’s FPC. There are 4 specially designed LEDs placed with a chip in the upper part of the LED. Figure 20. Mounting of LEDs for backlight. Seen from underside. Plastic Window The window is mounted on top of the LCD module. It snaps into the lightguide in three places. If a broken window needs replacing, it is replaced together with the dust seal.
NSE–5 System Module PAMS Technical Documentation Connector The connector makes a mechanical connection between light guide and LCD, so the LCD can be clicked onto the light guide. Also it makes electrical connection between LCD cell and PCB. The connector is not attached to the PCB, but the 14 pin connector contains springs and makes the contact. Light Guide The Lightguide houses and connects the LCD module to the PCB and backlights the display.
PAMS NSE–5 System Module Technical Documentation The figure below, shows the code marking for the light guide. YWWE ID code Y W W E Factory code Week Year Figure 22. Marking specification for the light guide UI Module Connection to main PCB Table 17. Module interface Pin 1 Signal Symbol Temp Sensor LDCDCX 2 Parameter Minimum Temperature at LCD for compensation of contrast and brightness. Reference to GND tsas Control/display data flag input.
NSE–5 System Module PAMS Technical Documentation Table 17. Module interface Pin Signal 5 Symbol Parameter (continued) Minimum Typical / Nominal Maximum Unit / Notes tscyc 250 ns tshw 100 ns tslw 100 ns 6 SPKR_n Speaker connection 7 ON/ OFF_key ON/OFF key connection. Referenced to GND 8 LED– LED negative connection. 60 mA 9 LED+ LED positive connection. 60 mA 10 ESD–GND GND GND 0 V 11 GND GND 0 V GND VDD Supply voltage. 12 0 2.7 VDD 2.8 100 V 3.
PAMS NSE–5 Technical Documentation System Module Parts Lists System Module (O201180) (EDMS V2.
NSE–5 System Module R145 R146 R147 R148 R149 R150 R200 R201 R300 R301 R304 R306 R350 R351 R352 R353 R354 R355 R357 R358 R400 R401 R402 R403 R404 R405 R406 R407 R408 R409 R410 R411 R412 R413 R414 R500 R501 R502 R503 R504 R505 R506 1430762 1430762 1430754 1430762 1430778 1430726 1430804 1430804 1430804 1430700 1430796 1430812 1430693 1430693 1430778 1430754 1430693 1430693 1430762 1430804 1430748 1430748 1430714 1430748 1430754 1430714 1430714 1430730 1430730 1430744 1430744 1430730 1430744 1430778 1430714
PAMS NSE–5 Technical Documentation R507 R508 R509 R510 R511 R512 R513 R514 R515 R516 R601 R602 R603 R604 R605 R606 R607 R608 R609 R610 R611 R612 R614 R615 R616 R618 R619 R700 R701 R702 R703 R704 R705 R706 R707 R708 R709 R710 R711 R712 R713 R714 1430718 1430718 1430726 1430700 1430744 1430744 1430744 1430700 1430744 1430726 1430700 1430728 1430754 1430754 1430754 1430832 1430738 1430722 1430700 1430700 1430746 1430746 1430690 1430832 1430832 1430772 1430710 1430764 1430744 1430778 1430734 1430754 1430762
NSE–5 System Module R715 R716 R717 R718 R719 R720 R721 R722 R723 R724 R725 R726 R727 R728 R729 R730 R731 R732 R733 R734 R735 R736 R737 R739 R740 C100 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C112 C113 C114 C115 C116 C117 1430788 1430740 1430734 1430734 1430724 1430718 1430734 1430754 1430754 1430754 1430770 1430778 1430754 1430754 1430790 1430772 1430762 1620103 1430792 1430830 1430772 1430804 1430742 1430772 1430792 2320584 2320546 2320481 2320546 2320544 2320620 2320546 2320546 2320805 2320481
PAMS NSE–5 System Module Technical Documentation C118 C119 C120 C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C134 C135 C136 C137 C138 C139 C140 C141 C142 C143 C144 C145 C146 C147 C148 C149 C150 C151 C152 C153 C154 C155 C156 C157 C158 C159 2320546 2320620 2320620 2320805 2610003 2320783 2320584 2320546 2320779 2610003 2310793 2320546 2320560 2320546 2320546 2320546 2610003 2320481 2320805 2320481 2320546 2610003 2320805 2320481 2320481 2312401 2611715 2610003 2320620 2320546 2610003 2
NSE–5 System Module C160 C161 C162 C163 C164 C165 C166 C167 C168 C169 C170 C171 C172 C173 C174 C175 C176 C200 C201 C202 C203 C204 C300 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310 C311 C312 C350 C351 C352 C353 C354 C355 C356 2320805 2610003 2320546 2320546 2320546 2320546 2320584 2320584 2320546 2320546 2320546 2320546 2320546 2320546 2320546 2320546 2320546 2320783 2320620 2320620 2320546 2320546 2320584 2320620 2320620 2320805 2320620 2320620 2320620 2320620 2320481 2320481 2320481 2320481 2320805
PAMS NSE–5 System Module Technical Documentation C400 C401 C402 C403 C404 C405 C500 C501 C502 C503 C504 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C528 C529 C530 C600 C601 C602 C603 C604 C605 C606 2320620 2320620 2320620 2320546 2320546 2320546 2320546 2320546 2320520 2320546 2320536 2320620 2320538 2320546 2320546 2320560 2320620 2312401 2320538 2320536 2320536 2320091 2611691 2312401 2320538 2320620 2320560 2320538 2320620 2320620 2320091 2
NSE–5 System Module C607 C608 C609 C610 C611 C612 C613 C614 C615 C616 C617 C618 C619 C621 C622 C623 C624 C625 C626 C627 C628 C629 C630 C631 C632 C633 C634 C635 C636 C637 C638 C639 C640 C641 C642 C643 C645 C646 C647 C700 C701 C702 2320538 2320520 2320522 2320530 2320546 2320805 2320546 2320532 2320584 2320546 2320556 2320556 2320524 2320546 2320564 2320805 2320805 2320584 2320546 2320526 2320526 2320526 2320526 2320536 2320584 2320546 2320526 2320546 2320534 2320532 2320518 2320534 2320536 2320546 2320532
PAMS NSE–5 System Module Technical Documentation C703 C704 C705 C706 C707 C708 C709 C710 C711 C712 C713 C714 C715 C716 C717 C718 C719 C720 C721 C722 C723 C724 C725 C726 C727 C728 C729 C730 C731 C732 C733 C734 C735 C736 C737 C738 C739 C740 C741 C742 C743 C744 2320546 2320534 2320572 2320584 2320584 2320556 2320556 2320584 2320602 2320530 2320568 2320546 2320620 2320584 2320526 2320584 2320568 2320562 2320584 2312401 2320550 2320536 2320546 2320538 2320538 2320620 2320546 2320620 2320584 2320584 2320584 2
NSE–5 System Module C745 C746 C747 C748 C749 C750 C751 C752 C753 C754 C755 C756 L100 L102 L103 L400 L500 L501 L502 L503 L504 L505 L600 L601 L602 L603 L604 L605 L606 L607 L608 L609 L610 L611 L612 L613 L614 L615 L616 L617 L700 L701 2320524 2320570 2320546 2320091 2320516 2312401 2320546 2320564 2320564 2320620 2320564 2320620 3203701 3203701 3203701 3203701 4551005 3641521 3645185 4551007 3645167 3645121 3643037 3643037 3645009 3645009 3645057 3645017 3645193 3645181 3645121 3645229 3645229 3645001 3645179
PAMS NSE–5 Technical Documentation L702 L703 L704 L705 L706 L707 L708 L709 B100 G700 G701 G702 F100 Z100 Z101 Z102 Z103 Z104 Z500 Z501 Z502 Z503 Z504 Z505 Z600 Z601 Z602 Z603 Z700 Z701 Z702 T600 V100 V101 V102 V103 V104 V105 V106 V107 V108 V109 3641601 3641622 3641622 3645161 3641324 3645029 3641541 3645195 451X083 4350149 4510229 4350155 5119019 3640035 3640035 3640035 3640035 3640035 451P047 455P003 4511087 4550071 4512097 4550071 4511049 4511015 451H129 4511087 451H138 4510009 4511085 3640413 4113601
NSE–5 System Module V110 V111 V112 V113 V350 V351 V400 V401 V402 V403 V404 V405 V406 V407 V408 V409 V410 V500 V701 V702 D100 D300 D301 D302 D303 D304 D305 D306 D350 D700 N100 N101 N200 N350 N500 N501 N502 N503 N600 N700 S416 X100 4210100 4210100 4110601 421J133 4210052 4210102 4864389 4864389 4864389 4864389 4864389 4864389 4200836 4100278 4200836 4200836 4110601 4110079 4219908 4210100 434X061 4370489 4340585 434L153 4340585 4340187 4340187 4340451 4340369 4340451 4370467 4370165 437L228 4860031 4350173
PAMS NSE–5 Technical Documentation X101 X102 X200 X501 A600 A601 A602 5469069 5469069 5469061 5429007 9517025 9517024 9510420 854270 Issue 1 07/99 System Module SM, batt conn 2pol spr p3.5 100V2A SM, batt conn 2pol spr p3.5 100V2A SM, system conn 6af+3dc+mic+jack SM, coax conn m sw 50r 0.
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