User Guide

Table Of Contents
RH-51/52, RH-67/68 Company Confidential
4 - Service Tools Nokia Customer Care
Page 16 © 2004 Nokia Corporation. Issue 3 09/2004
SK-9 LGA rework kit for MicroPA (sales package)
SK-9 is used to print solder paste on mircoPA component (NMP code: 4355641) when
the component is reworked.
SK-9 consists of ST-13 stencil and RJ-21 rework jig.
Sales package includes:
ST-13 stencil: 0770848
RJ-21 rework jig: 0770849
Product code
SK-9 LGA rework kit for microPA sales package: 0274819
View of SK-9
(left ST-13, right RJ-21)
Rework procedure
Refer to SK-8.