User Guide

Figure 91 Functional block diagram

Helen3 processor (OMAP1710) is called also as an application ASIC in RM-1 because it is processing application

SW and handles the UI SW. It consists of OMAP3.3 and peripheral subsystems like camera-, display- and keyboard

driver blocks.

Figure 92 Helen3 high level block diagram

OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x (DSP subsystem), DMA and OMAP3.3s internal

peripherals.

Helen3s MPU subsystem is based on an ARM926EJ. MPU is able to perform most of the application operations

on the chip.

System DMA: This component is mainly used to help the MPU and DSP perform data memory transfer-specific

tasks, leaving more available MIPS for both processors.

RM-1

Nokia Customer Care System Module

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