User Guide

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9 — System Module

Nokia Customer Care

Issue 1 Company Confidential Page 9–1

Summary of content (54 pages)

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RM-1 System Module Nokia Customer Care Table of Contents Baseband description...................................................................................................................................................................9–7 System module block diagram............................................................................................................................................9–7 Baseband functional description................................................................
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RM-1 System Module Nokia Customer Care Camera interface connections and electrical characteristics...................................................................................9–37 Back-up battery interface connections and electrical characteristics..................................................................9–39 RF description...........................................................................................................................................................................
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RM-1 System Module Nokia Customer Care Figure 104 Audio block diagram..............................................................................................................................................9–23 Figure 105 Internal microphone circuitry.............................................................................................................................9–24 Figure 106 External microphone circuitry (Pop-Port connects to the right side)..............................................
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RM-1 System Module Nokia Customer Care Baseband description System module block diagram The device consists of two different main modules: transceiver (1ax) and UI (1ay). The transceiver board consists of baseband and RF components The UI board consists of key domes and keypad backlights. Connection between the UI and the transceiver board is established via a board-to-board spring connector. Note: In this description, user interface HW covers display, camera, keyboard, keyboard backlight and ALS.
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RM-1 System Module Nokia Customer Care Figure 91 Functional block diagram Helen3 processor (OMAP1710) is called also as an application ASIC in RM-1 because it is processing application SW and handles the UI SW. It consists of OMAP3.3 and peripheral subsystems like camera-, display- and keyboard driver blocks. Figure 92 Helen3 high level block diagram OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x (DSP subsystem), DMA and OMAP3.3s internal peripherals.
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RM-1 System Module Nokia Customer Care The DSP subsystem is based on a TMS320C55x™ DSP core, which is responsible for intensive data computing tasks like real-time audio and video handling on application side. E.g. voice recording. Internal memory subsystem: This subsystem is composed of a single port SRAM. Secure modules: OMAP1610 contains a set of several components, including ROM, a single port SRAM, and eFUSE cells. These components enable the system to support secure applications.
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RM-1 System Module Nokia Customer Care Mode SLEEP Description SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s activity is low. There are in principle three different sleep modes: • Helen3 sleep • RAP3G sleep • Helen3 and RAP3G sleep (deep sleep) In SLEEP mode RETU’s regulators VIO, VDRAM, VSIM1, VSIM2, VAUX and Vana are in low quiescent current mode (output voltages still present but regulators will not give as much current out).
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RM-1 System Module Nokia Customer Care Figure 93 State diagram Voltage limits Parameter Description Value VMSTR Master reset threshold (RETU) 2.2V (typ.) VMSTR+ Threshold for charging, rising (TAHVO) 2.1V (typ.) VMSTR- Threshold for charging, falling (TAHVO) 1.9V (typ.) VCOFF+ Hardware cutoff (rising) 2.9V (typ.) VCOFF- Hardware cutoff (falling) 2.6V (typ.) SWCOFF SW cutoff limit ~3.2V Issue 1 Company Confidential Copyright © 2004 Nokia. All Rights Reserved.
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RM-1 System Module Nokia Customer Care The master reset threshold controls the internal reset of Retu / (Tahvo). If battery voltage is above VMSTR, UEME’s charging control logic is alive. Also, RTC is active and supplied from the main battery. Above VMSTR UEME allows the system to be powered on although this may not succeed due to voltage drops during start up. SW can also consider battery voltage too low for operation and power down the system.
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RM-1 System Module Nokia Customer Care Discrete power supplies are used to generate 2.8V for BT, 1.5V for the camera module, 1.3V/1.5V for Helen3 and 18V for backlight LEDs. The device supports both 1.8V/3V SIM cards which are powered by RETU / VSIM1. RETUs VSIM2 is used to power RS MMC 1.8V only. USB accessories which needs power from the device are powered by TAHVO / VOUT. Because LED driver in TAHVO is not used, the external SMPS is used instead.
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RM-1 System Module Nokia Customer Care Figure 95 System start-up timing Clocking scheme In BB5.0, two main clocks are provided to the system: 38.4MHz RF clock produced by VCTCXO in RF section and 32.768kHz sleep clock produced by RETU with an external crystal. RF clock is generated only when VCTCXO is powered on by RETU regulator. Regulator itself is activated by SleepX signals from both RAP3G and Helen3. When both CPUs are on sleep, RF clock is stopped.
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RM-1 System Module Nokia Customer Care Figure 96 Clocking scheme Bluetooth Bluetooth provides a fully digital link for communication between a master unit and one or more slave units. The system provides a radio link that offers a high degree of flexibility to support various applications and product scenarios. Data and control interface for a low power RF module is provided. Data rate is regulated between the master and the slave. The device Bluetooth is based on CSR's BC3 BT ASIC.
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RM-1 System Module Nokia Customer Care Figure 97 SIM interface Retu handles SIM card detection and the detection method is based on the BSI line. Due to location of the SIM card removal of the battery causes quick power down of the SIM IF. The Retu SIM1 interface supports both the 1.8V and 3.0V SIM cards. SIM interface voltage is first 1.8V when the SIM card is inserted and if the card does not response to the ATR (Answer To Reset) 3V interface voltage is used.
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RM-1 System Module Nokia Customer Care Figure 99 MMC interface The basic multimedia card concept is based on the following communication signals CLK, CMD and DAT. With each cycle of the CLK signal one bit transfer on the DAT and CMD line is done. The maximum CLK frequency is 20MHz (specified in multimedia card specification). Maximum used CLK frequency at the time is 16MHz. CMD is a bi-directional command channel used for card initialization and data transfer commands.
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RM-1 System Module Nokia Customer Care For service purposes the device SW can be forced into local mode by using pull down resistors connected to the BSI line. See Also • Battery connector and interface connections & electrical characteristics (Page 9–33) Camera interface The device uses a Mirage- X camera module. Mirage-X is a 1.3Mpixel camera with sensor resolution of 1280 x 960. The following figure shows the block diagram where CCP bus is used to transfer image data from camera to engine.
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RM-1 System Module Nokia Customer Care User interface Display interface Display module mechanical concept Figure 102 General diagram of the LCD module Display features: • 65536 colours • Partial display function Power saving by pausing display process on part of the screen.
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RM-1 System Module Nokia Customer Care Keyboard The device keyboard is connected to the main PWB with a board-to-board connector. The keymatrix has six rows and four columns. The voice key on the main PWB and the navigation key are connected to the same keymatrix.
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RM-1 System Module Nokia Customer Care ALS calibration is not possible in the service points. It is replaced by using selected phototransistors as spare parts. Figure 103 ALS HW implementation Table 8 ALS resistor values Symbol Value R1 5 kOhm R2 R3 15 kOhm 30 kOhm R4 R5 R6 R7 NTC-res 50 kOhm 470 kOhm 100 kohm 470 kohm 47 kOhm ASICs RAP3G ASIC RAP3G ASIC is a 3G Radio Application Processor. RAM memory is integrated into RAP3G.
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RM-1 System Module Nokia Customer Care • Vibra interface • Digital interface (CBUS) Tahvo EM ASIC Tahvo EM ASIC includes the. following functional blocks: • • • • • • Core supply generation Charge control circuitry Level shifter and regulator for USB/FBUS Current gauge for battery current measuring External LED driver control interface Digital interface (CBUS) Device memories RAP3G memories NOR flash and SDRAM Modem memory consists of 64 Mbit SDRAM and 64 Mbit NOR flash memories.
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RM-1 System Module Nokia Customer Care • 16mm dynamic speaker • electret microphone module In addition to the audio transducers, Retu also provides an output for the dynamic vibra component. All galvanic audio accessories are connected to the Pop-PortTM accessory connector. A Bluetooth audio module BC02 that is connected to RAP3G supports Bluetooth audio functionality. There is a separate application ASIC, Helen 2 (OMAP 1610) for Symbian applications.
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RM-1 System Module Nokia Customer Care Figure 105 Internal microphone circuitry External microphone Galvanic accessories are connected to the system connector (Pop-PortTM). Accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated phone accessories. External microphone circuitry is biased by Retu ASIC MicB2 bias voltage output.
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RM-1 System Module Nokia Customer Care Figure 107 Internal earpiece circuitry Internal speaker Internal speaker is used for Internal HandsFree (IHF) call mode. A dynamic 16mm speaker is connected to Retu ASIC’s outputs HFSpP and HFSpN. IHF amplifier integrated in Retu is a Digital Pulse Modulated Amplifier (DPMA). Figure 108 Internal speaker circuitry External earpiece Galvanic accessories are connected to the system connector (Pop-PortTM).
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RM-1 System Module Nokia Customer Care Figure 109 External earpiece circuitry (Pop-Port connected on the right) Vibra circuitry Vibra is used for vibra-alarm function. The vibra motor is connected to the Retu ASIC VibraP and VibraN Pulse Width Modulated (PWM) outputs. Figure 110 Vibra circuitry Pop-portTM connector Pop-PortTM connector provides a fully differential 4–wire connection. The HandsFree (HF) driver in Retu is meant for the headset. The output is driven in a fully differential mode.
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RM-1 System Module Nokia Customer Care The HF and HFCM amplifiers include a transient suppression circuitry, which prevents undesired spikes in XEarL and XEarLC outputs when switching on and off the amplifiers. The HeadInt line is pulled up to 2.7V by the internal resistor when the accessory is connected. When there is not accessory inserted, the voltage in the HeadInt line will be <0.8 V caused by internal pull down resistor in the HF line.
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RM-1 System Module Nokia Customer Care Baseband technical specifications External interfaces Name of Connection Connector reference Material Code USB X2001 5460061 Charger X2000 5400243 Headset X2001 5460061 SIM X2700 N/A RS MMC X5200 5469301 Battery connector X2070 5409255 ACI interface electrical characteristics Description Parameter Min Typ Max 1.9 2.05 Unit Notes Accessory detection Headset detection threshold 1.
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RM-1 System Module Nokia Customer Care VOUT electrical characteristics Description Vout regulator for external accessories Parameter Min VOUT 2.43 Max 2.57 Unit V Notes Max load 90mA USB IF electrical characteristics Description Parameter Min Max Unit Absolute maximum voltage on D+ and D- VD+/D- -1 4.6 V Supply voltage VBUS 4.4 5.25 V Notes USB specification revision 2.
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RM-1 System Module Nokia Customer Care FBUS interface electrical characteristics Description Parameter High-level input voltage Min Typ Max Unit VIH 0.7 x VDDSHV2 VDDSHV2 V Low-level Input voltage VIL 0 0.3 x VDDSHV2 V High-level output voltage VOH 0.8 x VDDSHV2 VDDSHV2 V Low-level output voltage VOL 0 0.22 x VDDSHV2 V tR/tF 0 25 ns Notes Helen2/3 specific (VDDSHV2 = 1.
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RM-1 System Module Description Nokia Customer Care Parameter Min Typ Max Unit Notes HSEAR P Audio out 1 Vpp 10Ω nominal serial impedance HSEAR R N Audio out 1 Vpp 10Ω nominal serial impedance Not connected in mono HSEAR R P Audio out 1 Vpp 10Ω nominal serial impedance Not connected in mono SIM IF connections Pin Signal I/O Engine connection Notes C1 VSIM Out Retu VSIM1 Supply voltage to SIM card, 1.8V or 3.0V.
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RM-1 System Module Nokia Customer Care Pin Signal I/O <- Engine connection Helen2/3 MMC2_CLK Notes 5 CLK 6 Vss2 7 DAT <-> Helen2/3 MMC2_DAT0 Bi-directional data bus - MMCDET -> Helen2/3 btwake1(in) [P10] MMC card detect GND External clock for the MMC card, Max 20 MHz Ground Charger connector and charging interface connections & electrical characteristics Figure 112 Charger connector Table 10 Charging interface connections Pin Signal I/O 1 Vchar In 2 Charge GND Engine connec
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RM-1 System Module Description Nokia Customer Care Parameter Min Max Unit Notes Threshold for charging, rising (TAHVO) VMSTR+ 2.1 V Typical value Threshold for charging, falling (TAHVO) VMSTR- 1.
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RM-1 System Module Nokia Customer Care Name of Connection Connector reference Material Code ALS V4400 486B033 Vibra M2100 6800057 Microphone B2100 5140265 Earpiece B2101 5140251 IHF speaker B2102 5140253 Notes Ambient Light Sensor UI module connector and IF connections Figure 114 UI connector Table 14 User interface connections Pin 1 Signal I/O GND Engine connection GND 2 LED+ <- N2301 VLEDOUT2 3 Col2 -> Helen3 Kbc_2 -> 4 LED- R2305 + V2300 -> Helen3 Discrete Backlig
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RM-1 System Module Nokia Customer Care Pin Signal I/O Engine connection 9 Row1 -> Helen3 Kbr_1 10 Row6 -> Helen3 Kbr_6 11 Row0 -> Helen3 Kbr_0 12 Col0 -> Helen3 Kbc_0 13 Row5 -> Helen3 Kbr_5 14 Row4 -> Helen3 Kbr_4 15 GND 16 Col3 Notes Voice switch connection GND -> Helen3 Kbc_3 Keyboard interface electrical characteristics Description High-level input voltage Parameter Min Typ Max Unit Notes VIH 0.65* VDDS VDDS 0.
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RM-1 System Module Nokia Customer Care Display connector and interface connections Figure 115 Display connector Table 15 Display interface connections Pin 1 2 Signal I/O Engine connection Notes GND WRX -> Helen3 Lcdwrx Write Enable (active low) 3 GND 4 D0 <-> Helen3 Lcdda0 Data 5 D1 <-> Helen3 Lcdda1 Data 6 D2 <-> Helen3 Lcdda2 Data 7 D3 <-> Helen3 Lcdda3 Data 8 GND <- Retu VIO Interface voltage <- Retu VAUX Core voltage 9 VDDI 10 VDD 11 GND LEDin 12 13
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RM-1 System Module Nokia Customer Care Pin Signal I/O Engine connection D/CX 16 Notes <- Helen3 Lcdcmd Data/ Command select (high=data, low =command) 17 GND 18 D7 <-> Helen3 Lcdda7 Data 19 D6 <-> Helen3 Lcdda6 Data 20 D5 <-> Helen3 Lcdda5 Data 21 D4 <-> Helen3 Lcdda4 Data 22 TE -> Helen3 Te Tearing Effect <- Helen3 Lcdrdx Read Enable (active low) <- Helen3 Gpio_60 Reset (active low) RDX 23 RESX 24 Camera interface connections and electrical characteri
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RM-1 System Module Nokia Customer Care Pin Signal 8 9 10 Engine connection Notes GND3 Ground line corresponding to ExtClk CLK+ Ccpclkp Differential serial clock, positive node VCtrl Camera module activating signal Ccpclkn Differential serial clock, negative node -> CAMVCTRL 11 I/O CLK- Helen3 <- Helen3 -> Helen3 12 VDD <- Retu VAUX Camera Analog Voltage 13 Strobe -> R2013 / R2014 Cam_strobe Strobe timing pulse 14 Ground line corresponding to VDDI GND2 Table 17 Camera
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RM-1 System Module Nokia Customer Care Table 18 Camera supply voltage characteristics Description Parameter Min Typ Max Unit Camera analog voltage VDD 2.37 2.5 2.63 V Camera digital voltage VDDI 1.4 1.5 1.65V V Notes Table 19 Camera control IF electrical characteristics Description Parameter Min Typ. Max Unit Notes SDA, SCL, Vctrl, ExtClk VIH 1.5 1.8 VDD V High-level input voltage SDA, SCL, Vctrl, ExtClk VIL 0 - 0.54 V Low-level input voltage SDA VOL 0 - 0.
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RM-1 System Module Nokia Customer Care Table 21 Back-Up battery electrical characteristics Description Back-Up Battery Voltage Parameter Vback Min Typ Max 0 2.5 2.7 Unit V RF description Introduction to receiver functionality Receiver functions are implemented in RF ASIC N7501. The receiver is a linear direct conversion receiver consisting of separate front ends (LNA and demodulator) for each supported system. After the demodulators, the signal paths are combined to one common BB path.
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RM-1 System Module Nokia Customer Care The antenna switch module is followed by integrated LNAs residing in N7501. The LNAs are followed by demodulators which downconvert the signal to baseband I and Q signals. After the down conversion mixer, the Rx chain is similar to WCDMA Rx. Channel select filter is set to 115 kHz in the GSM mode. In the GSM mode, the DC compensation is carried out before the reception slot.
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RM-1 System Module Nokia Customer Care Figure 116 WCDMA transmitter WCDMA power control WCDMA Tx power control is accomplished by the two VGA amplifier stages in N7500 Tx ASIC. The VGAs have a common temperature compensation circuit and one voltage mode analogue input for gain control (TXC). The gain of VGA amplifier chain is controlled by a DA converter in BB. The same DA converter is shared by GSM Tx power control function. It is required that phone can measure its output power in high power levels.
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RM-1 System Module Nokia Customer Care The DCDC converter limits the lowest supply voltage to 1.5 V. At highest power levels the DCDC converter output settles nominally to 3.2 V. Figure 117 Block diagram of DCDC converter and WCDMA PA GSM transmitter An analogue IQ modulated signal is received to N7501 from digital BB. The signal is first low pass filtered with filter corner frequency set to approximately 200 kHz. After the filter, the signal is routed to the GSM modulator.
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RM-1 System Module Nokia Customer Care Figure 118 GSM transmitter GSM power control A closed control loop comprise an integrated power detector (in PA module) and an error amplifier. The error amplifier resides in N7501, and it controls the transmitter power of GSM. Detector output from the PA gives a DC level proportional to the output power. The DC voltage is fed to the negative input of the error amplifier, where it is compared to the level of the reference signal, TXC.
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RM-1 System Module Nokia Customer Care Figure 119 GSM/EDGE power control topology and control signals Figure 120 Power control signal usage in GSM (GMSK) and EDGE (8PSK) transmission. Timings are not shown accurately Issue 1 Company Confidential Copyright © 2004 Nokia. All Rights Reserved.
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RM-1 System Module Nokia Customer Care GSM PA module A single GSM/EDGE PA module contains two separate amplifier chains, one for EGSM900 and another for GSM1800/1900. Both amplifiers have a battery supply connection and two bias current inputs. The bias current for final amplifier stage is adjusted according the power level in use in order to optimise efficiency. The bias currents are also used as on/off switching signals for PAs.
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RM-1 System Module Nokia Customer Care Figure 121 Phase locked loop in N7500 and N7501 (PLL) Reference oscillators As a reference oscillator for the frequency synthesizers a 38.4MHz VCTCXO (voltage controlled temperature compensated crystal oscillator) is used. The output signal of the VCTCXO is directly connected to both N7500 and N7501 where it’s used as synthesizer reference.