User Guide

CCS Technical Documentation System Module
NPM-2NX
Issue 1 07/02 ãNokia Corporation Page 11
DIGITAL IF
Data transmission between the UEM and the UPP is implemented using two serial con-
nections, DBUS (programmable clock) for DSP and CBUS (1.0MHz GSM and 1.08MHz
TDMA) for MCU. UEM is a dual voltage circuit, the digital parts are running from 1.8V
and the analog parts are running from 2.78V.
AUDIO CODEC
The baseband supports two external microphone inputs and one external earphone out-
put. The inputs can be taken from an internal microphone, a headset microphone or from
an external microphone signal source through headset connector. The output for the
internal earpiece is a dual ended type output, and the differential output is capable of
driving 4Vpp to earpiece with a 60 dB minimum signal to total distortion ratio. Input and
output signal source selection and gain control is performed inside the UEM Asic accord-
ing to control messages from the UPP. A buzzer and an external vibra alert control sig-
nals are generated by the UEM with separate PWM outputs.
UI DRIVERS
UEM has dedicated single output drivers for buzzer, vibra, IR, display LEDs and keyboard
LEDs. These generate PWM square wave to devices.
IR interface
The IR interface is integrated to UEM and data transfer is done via TXD and RXD paths.
UEM supports data speeds up to 115.2kbit/s.
IR module integrates a sensitive receiver and a built-in power driver. IR module itself
supports speeds from 9.6kbit/s to 1.152Mbit/s. UEM supports speeds up to 115.2 kbit/s.
Vflash1 supplies IR module except transmit LED. Transmit LED is supplied from VBAT and
maximum current is limited by serial resistor. TXD and RXD lines are connected to UEM
and shutdown is controlled by UPP through level-shifter V350.
AD CONVERTERS
There is 11-channel analog to digital converter in UEM. Some channels of the AD con-
verter aren't used in NPM-2NX (LS, KEYB1-2). The AD converters are calibrated in the
production line
SIM
The SIM interface is the electrical interface between the Subscriber Identify Module Card
(SIM card) and mobile phone (via UEM device). The UEM device contains power up/down,
port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers
logic for SIM.
Technical information
UEM package is 168-pin CSP package with 150 signal pins, 16 thermal pins and 2 kelvin
pins. Package size is 12mm x 12mm with max. thickness of 1.23mm. Solder ball diameter
is 0.4mm +-0.05mm and ball pitch is 0.8mm.