Programmes After Market Services NPE-4 Series Cellular Phones 3 - Audio System Original ãNokia Corporation.
NPE-4 3 - Audio System PAMS Technical Documentation Table of Contents Description Page No. 4 Introduction ...................................................................................................................................... Abbreviations .................................................................................................................................... 4 Technical overview .....................................................................................................
NPE-4 3 - Audio System PAMS Technical Documentation Description Page No. List of Figures (continued) Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Sketch of buzzer acoustic design .......................................................................... Mechanical buzzer asssembly ................................................................................ Typical buzzer frequency response ..................................................................
NPE-4 3 - Audio System PAMS Technical Documentation Introduction This Chapter specifies the Audio hardware for the NPE-4 program.
HEADSET / LOOPSET Original ãNokia Corporation. HP 1 HP 3 Boomer +8.2 dB EARPIECE HeadInt HP 2 CARK-91 MIC FBUS Rx FBUS Tx MBUS HookInt HFCM HF EARN EARP MIC3N MIC3P MIC2N MIC2P MIC1N MIC1P BUZZO Anti-alias filter M A VIBRA D SC DAC Vibra Driver PWM -30 - 0dB 0-22.5dB Buzzer Driver PWM MUX EARDATA MICDATA CBUS FBUS Rx FBUS Tx A D Figure 1.
NPE-4 3 - Audio System PAMS Technical Documentation Part List All involved key parts are listed in the following table. As seen in the table there is only one vendor for some of the audio and vibration key components.
NPE-4 3 - Audio System PAMS Technical Documentation DC Characteristics The audio relevant supply voltages are shown in the following table: Table 2: Supply Voltages Line Symbol Vana Minimum TYP. / Nominal Maximum Unit 2.7 2.78 2.86 V 80 mA 0,005 VBAT Vflash1 Vflash2 (Mic bias buffer) Min. due to regulator stability 3.1 (SW) (2.9 (HW)) 3.6 5.1 (SW) (5.4 (HW)) V (Buzzer and Vibra driver). Min and max due to SW cut off. 2.7 2.78 2.86 V (DLR3, HEADINT and HOOKINT pull up) 0.
NPE-4 3 - Audio System PAMS Technical Documentation echo canceling. In case of BT audio the BT accessory and the phone is connected by both an ACL and SCO air link. ACL is used for connection commands and SCO for the actual audio transmission. In both cases the BT module (in accessory and phone) receives the audio signal. In the phone this signal is routed from BT module over LPRF to DSP where it follows the regular audio path through out the rest of the system.
NPE-4 3 - Audio System PAMS Technical Documentation Deviations in gain performance: Transmit gain absolute accuracy: -1.0 / 0.0 dB Transmit gain variation (temperature, supply): +/- 0,7 dB Transmit gain variation with frequency (300 – 3000 Hz): +/- 0,5 dB Transmit gain variation with signal level (> -50 dBm0): +/- 0,5 dB (<-50 dBm0: +/- 1.
NPE-4 3 - Audio System PAMS Technical Documentation Earpiece Acoustic Design The earpiece is sealed to the front cover (IMD window) with a rubber gasket. The gasket is fixed inside the A-cover by the vibra motor assembly. The Earpiece and gasket is designed to seal perfectly against the front cover. There is no well defined leakage as known from the NPE-3 project. This is done to have a better performance in the frequency area from 2 – 3.
NPE-4 3 - Audio System PAMS Technical Documentation Figure 3. Mechanical assemply of Earpiece and Vibra Specified frequency response curve for the NPE-4 design (mechanics and Audio): SPL Response [dBPa] 30 20 10 0 -10 -20 -30 100 1000 10000 Frequency [Hz] Typical Response Upper Limit Lower limit Figure 4. Earpiece frequency response - ERP corrected – non DSP corrected Original ãNokia Corporation.
NPE-4 3 - Audio System PAMS Technical Documentation Absolute Sensitivity (Low leak): 26 dBPa/V ±3dB @ 1kHz. (0 dB on Figure 4. Earpiece frequency response - ERP corrected – non DSP corrected) Figure 5. DAI receiving frequency response, B4.0 Earpiece Electrical Interface Earpiece circuit includes pads for earpiece together with 2 ferrite beads (Common mode filter), 2 capacitors (900 MHz cut-off filter) and two varistors for ESD protection placed near the Earpiece.
NPE-4 3 - Audio System PAMS Technical Documentation Ear output specifications from the UEM specifications: Table 5: UEM Ear output specification Parameter Test condition Min Typ 2.5 Max Units Output swing @ 0dBm0, GR=-6 dB VASwing 2.36 Output voltage swing With 60 dB signal to total distortion ratio 4.0 Output resistance PDM data with 50 % pulse ratio in the DAC input 1.
NPE-4 3 - Audio System PAMS Technical Documentation Sketch of Microphone Acoustic Design Systemconector sound outlet Mic Rubber Gasket Volume System connector Connection springs Figure 7. Microphone Acoustical Design Absolute Sensitivity: -42 dBV/Pa ±3dB @ 1kHz. Figure 8. DAI Sending frequency response, B4.0 The desired microphone response is a flat line in 0 dB between 300 Hz and 4 kHz that roles off as much as possibly outside these frequencies.
PAMS Technical Documentation NPE-4 3 - Audio System Microphone Electrical Interface The microphone electrical circuit includes 2 ferrite beads for common mode noise rejection together with 2 capacitors for filtering the 900 MHz signal and two varistors for ESD protection placed near the microphone PWB spring pads. The 10 nF (C155) forms a low pas filter together with the microphone impedance to make a steeper role off at high frequencies.
NPE-4 3 - Audio System PAMS Technical Documentation UEM microphone input specification: Table 6: Microphone input specifications Parameter Symbol Min Typ Microphone amplifier input resistor RM30 30 50 Differential input voltage range for MIC1 input, G =20 dB VIN1 200 VHFCM 100 Receive Common mode input voltage range for MIC input 1.3 1.35 Max Unit kOhm 1200 m VPP m VPP Common mode voltage level VCM 1.
NPE-4 3 - Audio System PAMS Technical Documentation Buzzer Acoustic Design Buzzer Resonance Chamber Volume Sound Port Buzzer Spring Contacts A-Cover PCB Rubber gasket Figure 10. Sketch of Buzzer Acoustic Design The important parameters in this design are the front cavity and the sound portholes. Figure 11. Mechanical buzzer assemply The expected A weighted frequency response is (50 % Duty cycle). Tested in a simplified testbox. Final result expected to lay 2-4 dB below.
NPE-4 3 - Audio System PAMS Technical Documentation Buzzer Electric Interface The driver circuit is an integral part of the UEM. UEM VBATDriv 5kOhm +/- 35% VBAT 1 uF BUZZER BUZZO BUZZPWM VSADriv2 12 pF Figure 13. Buzzer driver circuit. Table 7: Buzzer driver specifications Parameter Variable Output switch resistance Rbuzzo Output peak sink current Iout VBAT Output peak sink voltage Uout VBAT Min Typ Max Unit 1.0 2.7 4.5 Ohm 120 180 350 mA 0.5 1.
NPE-4 3 - Audio System PAMS Technical Documentation When buzzer DigEna = 1 then a PWM signal is present at BUZZPWM The buzzer duty cycle is defined by: Duty Cycle = BPWMDCR (5 : 0) * 0.78125% Vibra specification A vibra alerting device is used to generate a vibration signal for an incoming call. The vibra is placed in the top of the phone. It is fastened to the A-cover by means of a rubber gasket and a lid which are pressed into the A-cover see .
NPE-4 3 - Audio System PAMS Technical Documentation Table 8: Vibra driver specifications Parameter Variable Output swhich resistance Rvibra Output average current Ivibra VBAT Output peak current Ipeak VBAT Min Typ Max Unit 1.4 4.2 7.5 Ohm 50 80 135 mA 300 mA Output frequency Fvibra 64 129 520 Hz Output duty cycle Dvibra 2.9 47 96.9 % 0.30 A 2.3 Vdc 1 uA Reverse diode peak current Iforw tp = 10 us Motor average dc Udc_motor VBAT=3.0 ... 4.5 V 1.
NPE-4 3 - Audio System PAMS Technical Documentation HDC-9P is a purely passive audio accessory. Table 10: HDC-9P interface specifications Object Specification Notes Receiver input impedance 150 Ohm +/- 25 % @ 390 mV at 1 kHz Maximum Sound pressure level 106 dB SPL at 1 mW Transmitter output impedance 2200 Ohm +/- 30 % at 1 kHz Transmitter sensitivity - 43.5 dBV/Pa +/- 3 dB at 1 kHz XMIC bias voltage 1.5 V Typical XMIC bias current 1.
NPE-4 3 - Audio System PAMS Technical Documentation from Headset to Loopset enabling the use of Loopset specific DSP tunings. The coil amplifier is supplied from MICB2 bias voltage. No voice dialling from the accessory is possible while there is no hookswhich (voice dialing have to be activated from the phone keypad).
PAMS Technical Documentation NPE-4 3 - Audio System Carkit - 112 The carkit consists of the following components HFW-1 Bluetooth junctionbox which replaces HFU-2 in the Cark-91 setup CUW-2 Remote control Button, earpiece volume and hookswhich And all the components mentioned in Carkit-91 apart from HFU-2 and HSU-1. Bluetooth carkit developed in the Tomahawk project.
NPE-4 3 - Audio System PAMS Technical Documentation XAUDIO(11:0) GENIO(0) Figure 15. External Microphone Interface See Table 13. Microphone input specifications, external audio for the input specifications for the external microphone. The external audio interface microphone electrically circuit includes 2 ferrite beads for common mode rejection together with 2 capacitors for filtering the 900 MHz signal.
NPE-4 3 - Audio System PAMS Technical Documentation Connections for MIC3 are grounded near the UEM and not as shown in Figure 15. External Microphone Interface connected to MIC2 lines. Table 13: Microphone input specifications, external audio Parameter Symbol Min Microphone amplifier gain for MIC 2 / Handsfree MicG2 Microphone amplifier gain for MIC 2 / Headset Typ Max Unit 0 22,5 dB MicG2 22.
NPE-4 3 - Audio System PAMS Technical Documentation Filtering in the boomer circuit: Highpass: -3dB point = 234 Hz Lowpass: -3dB point = 3386 Hz The 15 Ohm with a load of 150 Ohm reduce the output level with approximately 0.8 dB. XEAR circuit includes 1 ferrite bead HF filter, 1 capacitor (900 MHz cut-off filter) and one 10 nF capacitor (C?? (R161)) placed near the system connector for EMC purposes.
NPE-4 3 - Audio System PAMS Technical Documentation Table 14: UEM HF output specifications Parameter Test condition Offset voltage Min Typ -50 Common voltage level for HF output (HF and HFCM) VCMHF Pull down resistor value in HF output RPD Pull down swhich resistance in HFCM output RSW Max Unit 50 mV 0.75 0.8 0.85 V 3 10 25 kOhm 400 Ohm HEADINT and HOOKINT are ‘interrupts input’ in UEM. Headint is used to identify the type of accessory that is connected to the system connector.
NPE-4 3 - Audio System PAMS Technical Documentation The configuration for the bottom connector is shown in the following figure. Rubber boot Microphone 2 3 Solderable element, 2 pcs 4 8 13 Contact 1 DC-jack 2,3,4 Contact 5 14 Contacts 8...13 Contact 14 Microphone port Cable/Cradle connector guiding/fixing hole, 3 pcs Figure 17.
NPE-4 3 - Audio System PAMS Technical Documentation Table 15: System connector pin assignment Pin Name Min Typ Max Unit Notes 1 Vpp Maximum signal level 0 1.55 V Mute (output DC level) 2.5 2.9 V Unmute (output DC level) 100 600 µA Bias current from UEM 2 Vpp Microphone signal (Gain 0 dB) Connected to UEM MIC3P + MIC2P input 9 SGND 330 W Resistance to phone ground, return path for XMIC. When the DLR-3 datacable is connected, SGND swhiches to be a supply line for the cable (2.
NPE-4 3 - Audio System PAMS Technical Documentation Accessory Detection, Identification and Control Accessory Detection Accessories are detected when the XMIC signal is loaded with either DLR3, Loopset or Headset. The interrupt is generated by pulldown resistors in the respective accessories. Carkit 91 is detected via communication on the MBUS line. BT accessories are connected after BT connectivity is chosen in UI. Communication with UEM is done over the CBUS lines.
PAMS Technical Documentation NPE-4 3 - Audio System Accessory Control Headset and Loopset In the HDC-9P the headset-button is electrically connected across the XEAR and L-GND lines. When the Headset button is activated, XEARP is short-circuited to L-GND and a HOOKINT interrupt is detected in the UEM. This is used to lift the receiver, to put it down or initiate voice call. HDW-1 is a Bluetooth Headset.
NPE-4 3 - Audio System PAMS Technical Documentation Control circuit HFU-2 HFS-12 26 dB Audio Interface System connector MBUS HFM-8 30 dB UEM MBUS MCC-1 External audio sheet System connector MBUS MBUS EMI Filter Figure 18. Carkit audio interface. Block diagram. CARK-64 This carkit is a passive kit and is just a holder for the phone. No detection is done anywhere. CARK-112 This is a Bluetooth carkit.
