User Guide

NSM–5
UI section
PAMS Technical Documentation
Page 6
Issue 1 02/2002
 Nokia Corporation
Bottom Connector signals
Name Min Typ Max Unit Notes
XMICP,
XMICN
2.2 kΩ Input AC impedance
XMI
C
N
1 Vpp Maximum signal level
1.47 1.55 V Mute (output DC level)
2.5 2.9 V Unmute (output DC level)
100 600 µA Bias current
60 350 mV Maximum signal level
XEARP,
XEARN
47 Ω Output AC impedance (ref. GND)
XEARN
10 µF Series output capacitance
16 300 Ω Load AC impedance to GND (Headset)
6.8 kΩ Load AC impedance to GND (Accessory)
1.0 Vpp Maximum output level (no load)
22 626 mV Output signal level
10 kΩ Load DC resistance to GND (Accessory)
16 1500 Ω Load DC resistance to GND (Headset)
2.8 V DC voltage (100k pull–up to VBB)
HEADDET 21 uA When accessory is not connected
An external headset device is connected to the system connector XMIC
and XEAR lines, from which the signals are routed to COBBA MIC3 mi-
crophone inputs and HF earphone outputs.