User Guide

Nokia Customer Care System Module
Company Confidential RH-21
Issue 2 07/2004  2004 Nokia Corporation. Page 37
Test Pattern for Production Tests
General Information About Testing
Phone operating modes
Phone has three different modes for testing/repair. Modes may be selected with suitable
resistors connected to BSI- and BTEMP- lines as follows:
RIP
Signal
name
Connected
from - to
Batt Conn
I/O
Signal Properties
A/D Levels-Freq./
Timing resolution
Description / Notes
GND Glo-
bally
Batt - Global GND
VBAT Batt + Vba
tt
3.0-4.2V DC Battery Voltage
BSI UEM Ana
Ana
0-2.7V Pull
down res
Battery Size Indicator Resis-
tor, 100 kohm pull up to
2.78V(VFLASH)
BTEMP UEM Btemp NTC Resistor, 100
kohm pull up to
2.78V(VANA)
RIP
Signal
name
Connected
from - to
UI
I/O
Signal Properties
A/D Levels-Freq./
Timing resolution
Description / Notes
2FBUSTX /
FDLTX
Test
Point
UEM Out Dig 0/2.7V Fbus asynchronous serial
data output / FDL
3 FBUSRX /
FDLRX
Test
Point
UEM In Dig 0/2.7V Fbus asynchronous serial
data input / FDL RxData
6VPP Test
Point
Mem-
ory
Out Ana 0/5/12V External Flash Program-
ming Voltage for Flash
Memory
7MBUS /
FDLCLK
Test
Point
UEM In/
Out
Dig 0/2.7V 9k6bit/s Mbus bidirectional asyn-
chronous serial data bus/
FDL Clock
8GND Test
Point
BB Ground
Mode BSI- resistor BTEMP- resistor Remarks
Normal 68 k 75K
Local 560_ (<1k_) whatever