CC Technical Documentation RM-11 Series Transceivers System Module Issue 1 02/2004 Confidential ©2004 Nokia Corporation
RM-11 System Module CC Technical Documentation Contents Page Introduction.................................................................................................................... 4 BB Hardware Characteristics ......................................................................................4 Technical Summary .....................................................................................................5 Functional Description ........................................................
RM-11 System Module CC Technical Documentation BB_RF Interface Connections ...................................................................................26 RF Functional Description .........................................................................................28 Circuit Diagrams and PWB Layout ........................................................................ 28 Receiver...................................................................................................................
RM-11 System Module CC Technical Documentation Introduction This chapter describes the system module for the RM-11 transceiver. The baseband module includes the baseband engine chipset, the UI components, and the acoustic components. The RM-11 is a hand-portable, dual-band CDMA 800/1900 with AMPS. It has been designed using a DCT4 generation baseband (UEM/UPP) and RF module. RM-11 includes a template cutter and user-customizable template front and back covers.
RM-11 System Module CC Technical Documentation Technical Summary The baseband module is implemented using two main ASICs — the Universal Energy Management (UEM) and the Universal Phone Processor (UPP). The baseband module also contains an audio amplifier for MIDI support and a 128-Mbit Flash/ 8-Mbit SRAM combo IC. EMC shielding is implemented using a metallized plastic frame. On the other side, the engine is shielded with PWB ground openings.
RM-11 System Module CC Technical Documentation Sleep Mode The phone enters Sleep mode when both the MCU and the DSP are in stand-by mode. Both processors control sleep. When the SLEEPX low signal is detected, the UEM enters Sleep mode. In this mode, the VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All RF regulators — with the exception of VR2 and VR3 — are disabled in sleep mode.
RM-11 System Module CC Technical Documentation RM-11 BB Functional Blocks Passive color STN 4096 colors 128/8 Mbit UEMK VGA Figure 2: Baseband block assembly RM-11 BB functional blocks are listed below: • UEM and UPP • Battery • LED driver • LCD display • RF IF block • Memory module • Keyboard (UI module) • External audio connector • IrDa interface • Vibra • FM radio • System connector (Tomahawk) • PWB strategy Issue 1 02/2004 ©2004 Nokia Corporation Confidential Page 7
RM-11 System Module CC Technical Documentation • EMC strategy • Test interface UEM and UPP The UEM contains a series of voltage regulators to supply both the baseband module and the RF module. Both the RF and baseband modules are supplied with regulated voltages of 2.78 V and 1.8 V. The UEM contains six linear LDO (low drop-out) regulators for the baseband and seven regulators for RF circuitry. The RF regulator VR1 uses two LDOs and a charge pump. The VR1 regulator is used by the RF module.
RM-11 System Module CC Technical Documentation Battery BLD-3 Li-ion (inbox battery) is used as the main power source. The BLD-3 has a capacity of 780 mAh. Table 1: BLD-3 characteristics Description Value Nominal discharge cut-off voltage 3.1V Nominal battery voltage 3.7V Nominal charging voltage 4.2V Maximum charger output current 850mA Minimum charger output current 200mA Cell pack impedance -20 ... 0 oC 180mΩ max Cell pack impedance 0 ... +20 oC 150mΩ max Cell pack impedance +20 ...
RM-11 System Module CC Technical Documentation Temperature and capacity information is needed for charge control. These resistors are connected to the BSI and BTEMP pins of the battery connector. The phone has 100 kW pull-up resistors for these lines so that they can be read by A/D inputs in the phone. For safety reasons, the phone software will shut the phone off if it senses a temperature of 38oC or higher on the BTEMP line.
RM-11 System Module CC Technical Documentation UEM VCHAR VCHARin VCHARout Over Temp. Detection VBATT Vmstr Switch Driver Current Sensing/ Limit Ctrl Logic VBATT WatchDog + Comp - VBATTlim Figure 5: UEM charging circuitry Charger Detection Connecting a charger creates voltage on the VCHAR input to the UEM. When the VCHAR input voltage level rises above the VCHDET+ threshold, the UEM starts the charging process.
RM-11 System Module CC Technical Documentation Charger Interface Protection In order to ensure safe operation with all chargers and in misuse situations, the charger interface is protected using a transient voltage suppressor (TVS) and a 1.5A fuse. The TVS device used in RM-11 is rated for 16 V@175 W. Figure 6: Charger interface diagram Table 4 includes the values for the TVS. Table 4: Charger interface TVS characteristics Characteristic Value Breakdown voltage (VBR) 17.8Vmin (at IT 1.
RM-11 System Module CC Technical Documentation Coil Schottky VBAT Cin Cout V in DLIGHT En Is Ext Vovp LED Driver FB Rlcd Cx R Gnd Cosc LCD Illumination Keyboard Illumination Figure 7: Shared LED driver circuit for LCD and keyboard backlight LCD Backlight The LCD backlight consists of two white LEDs, which are integrated with the LCD module. Keyboard Illumination The keyboard light consists of six white LEDs on the UI board.
RM-11 System Module CC Technical Documentation C C C Driver R 0C 0 C 128 Top View Active area 128x128 R 128 Figure 8: Color LCD module RF Interface Block The interface between the baseband and the RF module can be divided into two categories: the digital interface and the analog interface. The digital interface is between the UPP and the RF chip. The serial digital interface is used to control the operation of the different blocks in the RF chip.
RM-11 System Module CC Technical Documentation Flash Memory Description The 128 Mbit density flash with 16-bit data access operates in both asynchronous random access and synchronous burst access (with crossing partition boundaries) and has various data protection features. Upon power up or reset, the device defaults to asynchronous read configuration. Synchronous burst read is indicated to the device by writing to the flash configuration register and can be terminated by deactivating the device.
RM-11 System Module CC Technical Documentation Internal Audio Internal Microphone The internal microphone capsule is mounted to in the UI frame. The microphone is omni-directional and is connected to the UEM microphone input (MIC1P/N). The microphone input is asymmetric and the UEM (MICB1) provides bias voltage. The microphone input on the UEM is ESD protected. Spring contacts are used to connect the microphone to the main PWB.
RM-11 System Module CC Technical Documentation UPP8M LM4855 GenIO(14) GenIO(15) GenIO(16) Enable EN Clock CLK Data DATA Figure 11: Digital interface of audio amplifier VB AT Cs = 1 uF By pass LM4855 Bias IH F Speaker out + Amplifier Phone audio Radio audio Ri n Amplifier Output Mode Select Amplifier out Rout + Amplifier Rout Lout + Radio audio Li n Amplifier Amplifier Lout Stereo Headset Di gital Volu me Control SPI GN D EN CL K DAT A Figure 12: Block diagram of audio amplifier
RM-11 System Module CC Technical Documentation External Microphone Connection The external microphone input is fully differential and lines are connected to the UEM microphone input (MIC2P/N). The UEM (MICB2) provides bias voltage. The microphone input lines are ESD protected. Creating a short circuit between the headset microphone signals generates the hook signal. When the accessory is not connected, the UEM resistor pulls up the HookInt signal.
RM-11 System Module CC Technical Documentation IrDa Interface When using transceiver with 1.8V I/O, the IrDa interface is designed into the UPP. The IR link supports speeds from 9600 bit/s to 1.152 MBit/s up to a distance of 80 cm. Transmission over the IR is half-duplex. The length of the transmitted IR pulse depends on the speed of the transmission. When 230.4 kbit/s or less is used as a transmission speed, pulse length is a maximum of 1.63ms. If the transmission speed is set to 1.
RM-11 System Module CC Technical Documentation Camera The VGA camera module is connected to the baseband (UPP) through an HW accelerator IC. And external 1.8 V regulator is used as a power supply (VDIG) for the camera module and HW accelerator, together with VFLASH2.
RM-11 System Module CC Technical Documentation System Connector (Tomahawk) The 14-pin Tomahawk bottom connector consists of charging plug socket and Tomahawk System Connector. The Tomahawk system connector includes signals for the following: Shielding GND HSEAR_R_N Power in 5V in from DKU-5 cable N DKU-5 (similar to USB) (optional) HSEAR_L_P Standard FBUS HSEAR_L_N FBUS XMIC P Accessory detection/removal and controlling XMIC N ACI (Accessory Control Interface) DATA GND 2.
RM-11 System Module CC Technical Documentation External Accessory Regulator An external LDO Regulator is needed for accessory power supply purposes. All ACI accessories require this power supply. A regulator input is connected to the battery voltage VBAT and output is connected to the Vout pin in the Tomahawk connector. The regulator ON/OFF function is controlled via the UPP.
RM-11 System Module CC Technical Documentation All edges are grounded from both sides of the PWB and a solder mask is opened from these areas. The purpose is for any ESD pulse to face a ground area when entering the phone (i.e., between mechanics covers). All holes in the PWB are grounded and plated through holes. Keyboard The keyboard PWB layout consists of a grounded outer ring and either a trefoil pattern grid (matrix) or an inner pad.
RM-11 System Module CC Technical Documentation System Connector The immunity strategy concerning the bottom connector lines is to shield all lines to this part in order to prevent radiation in the phone itself when an external accessory is connected, and to prevent radiated fields from disturbing the lines as well. Appropriate discrete filters close to the bottom connector are implemented for EMC and ESD protection.
RM-11 System Module CC Technical Documentation microphone if it is not properly isolated from the chassis using rubber or some other soft material. Connection wires to the internal microphone and earphone should be as short as possible to reduce the interference caused by internal signals. ESD protection has to be implemented on each external connection that is accessible during normal operation of the phone.
RM-11 System Module CC Technical Documentation BB_RF Interface Connections The BB and RF parts are connected together without a physical connector. Rip # Signal Name DAMPS, GSM1900 Connected from--- to RFICCNTRL(2:0) BB I/O Signal Properties A/D--Levels---Freq./ Timing resolution RF IC Control Bus from UPP to RF IC (TACO) 0 RFBUSCLK UPP RFIC In Dig 0/1.8V 1 RFBUSDA UPP/RFIC RFIC I/O Dig (0: <0.4V 1: >1.
RM-11 System Module CC Technical Documentation Rip # Signal Name DAMPS, GSM1900 Connected from--- to RFCLK (not BUS -> no rip #) VCTCXO > RFCLK BB I/O Signal Properties A/D--Levels---Freq./ Timing resolution Description / Notes System Clock From RF To BB, original source VCTCXO, buffered (and frequency shifted, WAM only) in RF IC (TACO) UPP In Ana 800mVpp typ (FET probed) RFIC 19.2 19.
RM-11 System Module CC Technical Documentation VRF Globals instead of Bus Regulated RF Supply Voltages from UEM to RF. Current values are of the regulator specifications, not the measured values of RF VR1 A UEM RFIC Out Vreg 4.75 V +- 3 % 10 mA max. UEM, charge pump + linear regulator output. Supply for UHF synth phase det …. VR1 B UEM RFIC Out Vreg 4.75 V +- 3 % 10 mA max. UEM, charge pump + linear regulator output. VR2 UEM RFDiscr./ RFIC Out Vreg 2.78 V +- 3 % 100 mA max.
RM-11 System Module CC Technical Documentation but the interference free operation in the field. In this receiver structure, linearity lies heavily on the mixer design. The second order distortion requirements of the mixer are set by the 'half IF' suppression. A fully balanced mixer topology is required. Additionally, the receiver third order IIP tends to depend on active mixer IIP3 linearity due to high LNA gain.
RM-11 System Module CC Technical Documentation For proper AMPS-mode receiver (duplex) sensitivity, the IF signal is filtered in a strip-filter before up-conversion. The upconverter mixer is actually a mixer with a LO and output driver that is able to deliver about +6dBm linear output power. The mixer is inside the RF IC. Note that in this point, the term “linear” means -33dB ACP. The required LO power is about -6dBm. The LO signal is fed from the RF IC.
RM-11 System Module CC Technical Documentation The coupler’s insertion loss is -0.42dB (max) at the cellular band and -0.48dB (max) at the PCS band. Typical values for insertion losses are about -0.2dB. The filtering performance of the diplexer is taken into account in system calculations. Antenna Circuit The antenna circuit stands for duplex filters and diplexer. The cellular band duplex filter is a band pass type SAW filter with typical insertion loss at about -2.0dB.
RM-11 System Module CC Technical Documentation Table 8: 800 MHz digital TX (Continued) Power level RF power at external Antenna Pad (dBm) Tuning target tolerant (dB) Testing limits (dB) 9 -0.7 +/-0.5 +/-2.0 10 -4.7 +/-0.5 +/-2.0 Table 9: CDMA 1900 TX Power level RF power at external Antenna Pad (dBm) Tuning target tolerant (dB) Testing limits (dB) 2 26.3*** +/- 0.25 0.5/-0.5 3 23.3 +/-0.5 +/-2.0 4 19.3 +/-0.5 +/-2.0 5 15.3 +/-0.5 +/-2.0 6 11.3 +/-0.5 +/-2.0 7 7.
RM-11 System Module CC Technical Documentation • RSSI channel compensation • RSSI temperature compensation RF Frequency Plan The RM-11 frequency plan is shown in Figure 25. A 19.44 MHz VCTCXO is used for the UHF and VHF PLLs and as a baseband clock signal. All RF locals are generated in PLLs. TX I TX IF CELL 173.6 MHz PCS 208.1 MHz TX VHF LO CELL PCS 346.2 MHz 416.2 MHz 1 0° 2 90 ° CELL 824.04 - 848.97 MHz 30 kHz Steps PCS 1850.00 - 1909.95 MHz 50 kHz Steps CELL 869.04 - 893.
RM-11 System Module CC Technical Documentation Table 10: Regulator circuit information (Continued) Page 34 Regulator name Output voltage (V) Regulator Max current (mA) RF total 1GHz RF total 2GHz IPA1, IPA2 2.7 max 1 +/- 10% 3 +/- 4% 3.5 +/- 4% 5 +/- 3% 1.3 - 5.0 1.3 - 3.7 VREFRF01 1.35 +/- 0.5% 0.12 0.05 0.05 VFLASH1 2.
