User Guide
Nokia Customer Care System Module
Company Confidential RH-30/RH-31
Issue 2 11/2004 © 2004 Nokia Corporation. Page 37
Memory block
For the MCU UPP includes ROM, 8 kbytes, that is used mainly for boot code of MCU. To
speed up the MCU operation small 4 kbyte cache is also integrated as a part of the MCU
memory interface. For program memory 8Mbit (512k x 16bit) PDRAM is integrated. RAM
block can also be used as data memory and it is byte addressable. RAM is mainly for MCU
purposes but also DSP has also access to it if needed.
In addition to UPP integrated RAM RH-30/RH-31 baseband has also UPP external SRAM.
This is implemented in combo memory (single package with stacked ICs, 64Mbit flash + 4
Mbit SRAM).
MCU code is stored into external flash memory. Size of the flash is 64Mbit (4M x 16bit)
The RH-30/RH-31 baseband supports a burst mode flash with multiplexed address/data
bus. Access to the flash memory is performed as 16–bit access. The flash has Read While
Write capabilities which makes the emulation of EEPROM within the flash easy.
Security
The phone flash program and IMEI codes are software protected using an external secu-
rity device that is connected between the phone and a PC.
Clock distribution
Figure 16: Clock Distribution Diagram
UPP
CTSI
UEM
VCTCXO
26MHz
HELGA
PLL
MCU
DSP
SLICER
VR3
26 MHz
26 MHz
32 kHz
SLEEPX
32 kHz
RFBUSCLK 13MHz
CBUSCLK 1MHz
DBUSCLK 13MHz
LCDCLK max. 6.5MHz
SIMCLK max. 3.25MHz
HELGO
VCTCXO
26 MHz










