User Guide

TME-3 Company Confidential
Data Module RL7 PAMS Technical Documentation
Page 18 Nokia Corporation. Issue 4 12/03
The audio control and processing is done by the UEM, which contains the audio codec.
The UPP contains MCU and DSP blocks, handling and processing the audio data signals.
The baseband supports one external microphone input and one external earphone output
or alternatively digital PCM lines.
Audio Interfaces
TME-3 has two different audio types, digital and analog audios. Those lines are multi-
plexed in M2M system connector, so there is only one physical audio interface.
Figure 9: Audio control diagram
Audio type selection is made by the audioselect signal from UPP genio pin 28. Audio lines
are multiplexed and demuxed by using NC7SB3157 and these components are controlled
by the audioselect signal
Earpiece electrical interface
Earpiece circuit includes two ferrite beads, two capacitors (27 pF -> 900 MHz cut-off fil-
ter) and two varistors for EMC protection. Earphone lines from the M2M system is con-
nected to the differential output (EARP and EARN) in the UEM audio codec.
Microphone electrical interface
The microphone electrical circuit includes EMI/ESD protections which is placed near
the M2M system connector. MICB1 is connected to MIC1P via 1kΩ resistor.
DEMUX 2/4
MIC-
MIC+
PCMDCLK
PCMSCLK
AIF 23
AIF 25
MUX 4/2
EAR-
EAR+
PCMRX
PCMTX
AIF 26
AIF 28
AUDIOSELECT
AUDIOSELECT