Programmes After Market Services TME-3 Series Transceivers Data Module RL7 Issue 4 12/03 Nokia Corporation.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation [This page left intentionally blank] Page 2 Nokia Corporation.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table of Contents Page No Glossary of Terms .......................................................................................................... 5 Functional Description of TME-3.................................................................................. 7 Circuit Description .......................................................................................................7 GSM Data Module RL7........................
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Special Operation: ................................................................................................... 28 Data Module RL7 Parts List ........................................................................................ 29 Table of figures Page No Fig 1 Block diagram of RL7 module ...................................................................................8 Fig 2 TME-3 RS-232 mode ............................
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Glossary of Terms ASIC Application Specific Integrated Circuit BB Baseband CSP Chip Scale Package DB Dual band DCS1800 Digital Cellular system at 1800 MHz DSP Digital Signal Processor EMC Electromagnetic compatibility EMI Electromagnetic Interference FBUS Asynchronous Full Duplex Serial Bus GSM Global System for Mobile communications HSCSD High Speed Circuit Switched Data LNA Low Noise Amplifier M2M System Con
TME-3 Data Module RL7 Page 6 Company Confidential PAMS Technical Documentation UEM Universal Energy Management UI User Interface UPP Universal Phone Processor VCXO Voltage Controlled Crystal Oscillator VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator. Nokia Corporation.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Functional Description of TME-3 Circuit Description The Data module baseband blocks provide the MCU, DSP, external memory interface and digital control functions in the UPP ASIC . Power supply circuitry, charging, audio processing and RF control hard ware are in the UEM ASIC.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Block Diagram Figure 1: Block diagram of RL7 module Ostrich Production test pattern R&D test structures TEST Voltage input P O W E R SIM I N T E R F A C E UI VBAT UEM UPP AIF_3V3 VCCAM Internal antenna RFBB VBATRF F L A S H External antenna connector RF VBB AIF GENIOUART FBUS MBUS ANALOG/ DIGITAL AUDIO I/O UPP ASIC provides the MCU, DSP, external memory interface and digital control functions.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 The baseband supports external microphone inputs and speaker outputs. Input and output signal source selection and gain control is performed by the UEM according to control messages from the UPP. Analog and digital PCM audio are routed to M2M system connector. EMC shielding for baseband is implemented using metal lids. On the other side the module is shielded with PWB grounding.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Figure 2: TME-3 RS-232 mode Voltage input TME-3 M2M RS-232 adapter DAU-12 RS-232 Application mode In application mode TME-3 is connected to a user specific application. The mechanical and electrical interface between application and TME-3 is the M2M system connector. The application can be powered through M2M system or the application can deliver power to TME-3.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Secondly, it can be specified from which phone number the text message templates are allowed. Thirdly, a password can be used that is entered whenever a text message template is sent to the Nokia 30. Internal operation modes A simplified flow chart of the internal operation modes of TME-3 below.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Nominal and maximum ratings Table 1: s Parameter Absolute Maximum Rating Supply voltage maximum VBB 15 V DC input voltage (any signal pin *) -0.5 to 5.5V* DC output source or sink current (any signal pin) +/- 10 mA Operating temperature range -10...+55 °C Storage temperature range -40...+85 °C DC Characteristics Table 2: Supply voltage Pin / Conn. Line Symbol Minimum Typical / Nominal Maximum Notes X100 VBB 6.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 M2M system connector M2M system connector X101 is described below: Figure 5: M2M system connector X101 The M2M system connector is 50 pin male connector. Connector connects the TME-3 to an external applications, for example to the data-adapter. Connection can be made by female type socket or ribbon cable connector.
TME-3 Data Module RL7 OUTPUT5 Company Confidential PAMS Technical Documentation GND 41 42 CTS RI 43 44 GND Reserved 45 46 Reserved GND 47 48 Reserved Reserved 49 50 GND OUTPUT4 in numbering of the M2M system connection Odd pins are on the left side of the connector, i.e. 1, 3, 5, 7, etc. Even numbers on the right side of the connector, i.e. 2, 4, 6, 8, etc. Pin 1 is at left top, pin 50 right bottom.
Company Confidential TME-3 Data Module RL7 PAMS Technical Documentation SIM connector SIM connector X200 interface supports both 1.8V and 3V SIM cards. Note that 5V SIM cards are not supported.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Functional Description POWER TME-3 operates with external DC wall power supply without a battery. The DC voltage can be supplied either trough the DC jack or the M2M system connector. TME-3 has a wide supply range high efficiency synchronous switched mode step-down converter, which regulates the input voltage down to normal battery voltage level (3.6V).
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Six I/O pins from UPP port1, which is normally used for keyboard, are used for led control. Leds are buffered with digital transistors. shows the allocation of led control pins.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation The audio control and processing is done by the UEM, which contains the audio codec. The UPP contains MCU and DSP blocks, handling and processing the audio data signals. The baseband supports one external microphone input and one external earphone output or alternatively digital PCM lines. Audio Interfaces TME-3 has two different audio types, digital and analog audios.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 RF Module This RF module executes all RF functions of the module. RF circuitry is located on one side (B-side) of the PCB. EMC leakage is prevented by three metal shields. The first one includes the Bluetooth module. The second block includes the PA, antenna switch, LNAs and dual RX SAW. The last block include the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters. Maximum height inside on RF-shields is 3 mm.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation DC characteristics Regulators The transceiver comprises a multifunction power management IC on baseband section, which contains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher for charge pump. Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and VrefRF02 are used as the reference voltages for HAGAR RF-IC, VrefRF01 (1.35V) for bias reference and VrfeRF02 (1.35V) for RX ADC's reference.
Company Confidential TME-3 Data Module RL7 PAMS Technical Documentation Power Distribution Diagram Figure 11: Power Distribution SOURCE VR1 VR2 VR3 LOAD 4.75 V +/- 3.2 % 10 mA 2.78 V +/- 3 % 100 mA 2.78 V +/- 3 % 20 mA Charge pump in HAGAR TX IQ modulator, pow er control opamp in Hagar VCTCXO VCTCXO buffer in Haga r VR4 2.78 V +/- 3 % E-GSM & DCS LNA 50 mA RX mixer in Hagar DTOS in Hagar VR5 2.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation RF characteristics Main RF characteristics are listed in the table below: Item Values (E-GSM / GSM1800) Receive frequency range 925... 960 MHz / 1805...1880 MHz Transmit frequency range 880... 915 MHz / 1710...
Issue 4 12/03 Balanced SAW Balanced SAW MMIC LNA MMIC LNA Dual SAW Nokia Corporation.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Frequency synthesizers VCO frequency is locked with PLL into stable frequency source, which is a VCTCXO-module. VCTCXO is running at 26 MHz. Temperature drifting is con trolled with AFC voltage. VCTCXO is locked into frequency of the base station. AFC is generated by baseband with a 11 bit conventional DAC. 13MHz VCTCXO can also be used if multislot operations is not needed.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 tion. The LNA amplified signal is fed to 2nd RX bandpass RF-SAW filters. Both 2nd RX bandpass RF-SAW filters comprise un-bal/bal configuration to get the balanced (balanced) feed for Hagar. Discrete LNAs have three gain levels. The first one is max. gain, the second one is about 30dB(GSM1800) and -25dB(EGSM900) below max. gain and the last one is off state. The gain selection control of LNAs comes from HAGAR IC.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation by 2 or by 4 depending on system mode. There are separate outputs one for EGSM and one for GSM1800. In EGSM branch there is a SAW filter before PA to attenuate unwanted signals and wideband noise from the Hagar IC. The final amplification is realized with dual band power amplifier. It has two different power chains one for EGSM and one for GSM1800.
Company Confidential TME-3 Data Module RL7 PAMS Technical Documentation Interfaces and Connectors Antenna The TME-3 uses an internal or external dual band antenna. User Interface Features The TME-3 does not include a display. All UI functions are performed by Leds located in the A-cover.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Normal Operation: Table 9: Normal Operation: LED 1 LED 2 Status LED Description * * Green In service * * Green blink Call on * * Green blink Incoming call * * Green/Red blink Message received / Voice mail in box * * Red blink Message arriving and memory is full *) Application module controllable in M2M System mode Special Operation: Table 10: Special Operation: LED 1 LED 2 Status LED Description Green/Red
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Data Module RL7 Parts List 0201802 RL7 RF/Syst Module EDMS Issue: 5.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type C124 2610043 Bottom M 8 CHIPTCAP 680U R 4V0 7.3X4.3X3.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type C218 2320805 Top H 2 Chipcap X5R 100N K 10V 0402 0402C C219 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C220 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C221 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C C222 2320481 Top F 5 Chipcap X5R 1U K 6V3 0603 0603C C223 2320805 Top G 2 Chipcap X5R 100N K 10
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type C303 2320805 Top K 5 Chipcap X5R 100N K 10V 0402 0402C C305 2320805 Top K 2 Chipcap X5R 100N K 10V 0402 0402C C320 2320778 Bottom J 5 Chipcap X7R 10% 16V 0402 0402C C321 2320778 Bottom J 4 Chipcap X7R 10% 16V 0402C C322 2320778 Top I 5 Chipcap X7R 10% 16V 0402C C323 2320805 Top H 2 Chipcap X5R 100N K 10V 0402
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type C607 2314001 Top G 9 Chipcap NP0 470P J 6V3 0402C C608 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C C609 2320562 Top I 8 Chipcap 5% NP0 0402C C610 2320562 Top I 8 Chipcap 5% NP0 0402C C611 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C C612 2320778 Top I 9 Chipcap X7R 10% 16V 0402C C613 2320805 Top H 9 Chip
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type C705 2320548 Top F 7 Chipcap 5% NP0 0402C C706 2320604 Top F 7 Chipcap 5% NP0 0402C C707 2320518 Top F 8 Chipcap +-0.
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type D100 4341053 Bottom I 4 6*BUFFER 1.65V 74LVC07A TSSOP_14 D101 4341053 Bottom F 3 6*BUFFER 1.
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type L205 3203741 Top I 2 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM L500 3646091 Top E 9 CHIP COIL 6N8 J Q27/800M 0402 0402L L501 3646067 Top G 9 CHIP COIL 18N J Q29/800M 0402 0402L L502 3646091 Top D 9 CHIP COIL 6N8 J Q27/800M 0402 0402L L503 3646065 Top D 9 CHIP COIL 12N J Q31/800M 0402 0402L L550 3646053 Top E 8 CHI
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type R110 1430726 Bottom A 4 Resistor 5% 63mW 0402R R111 1430740 Bottom A 4 Resistor 5% 63mW 0402R R112 1430726 Bottom C 4 Resistor 5% 63mW 0402R R113 1430740 Bottom C 4 Resistor 5% 63mW 0402R R114 1430726 Bottom B 4 Resistor 5% 63mW 0402R R115 1430740 Bottom B 4 Resistor 5% 63mW 0402R R116 1430754 Bottom E 3
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type R157 1430911 Top I 2 Resistor 1% 63mW 0402R R158 1430911 Top J 3 Resistor 1% 63mW 0402R R159 1430911 Top I 2 Resistor 1% 63mW 0402R R160 1430911 Top I 3 Resistor 1% 63mW 0402R R161 1430911 Top I 3 Resistor 1% 63mW 0402R R162 1430726 Bottom H 2 Resistor 5% 63mW 0402R R163 1430726 Bottom G 2 Resistor 5% 6
Company Confidential PAMS Technical Documentation TME-3 Data Module RL7 Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type R651 1430907 Top J 6 CHIPRES 0W06 11K F 0402 0402R R652 1430700 Top K 7 Resistor 5% 63mW 0402R R660 1430762 Top J 8 Resistor 5% 63mW 0402R R661 1430774 Top K 8 Resistor 5% 63mW 0402R R700 1620121 Top G 7 RES NETWORK 0W06 2X220R J MNR02_SR 0404 R701 1620121 Top F 7 RES NETWORK 0W06 2X220R J MNR02_SR 0404 R703
TME-3 Data Module RL7 Company Confidential PAMS Technical Documentation Table 11: Parts list RL7_11 Item Code Side Coordinates Part data Part name, type V109 4110074 Bottom O 1 SCH DI 40V 3A SOD6 V110 4110078 Top M 4 SLHDIx2 70mA SOT323 V111 4211321 Bottom M 3 MFET FDS6912A N 30V 6A 0R035 SO8N2 V112 4211391 Top K 1 MFET P FDC6323L SWITCH 3-8V TSOP_6 V114 4110074 Bottom M 5 SCH DI 40V 3A SOD6 V115 4110078 Top E 2 SLHDIx2 70mA SOT323 V120 4110078 Bottom K
