User Guide

RH-17
Troubleshooting — RF CCS Technical Documentation
Page 18 Nokia Corporation Confidential Issue 1 04/2003
(pad M2) and at UEM: RXID (pad C11), TXID (pad A12). Bus interface name is RFCONVDA
(5:0).
Test 11 ST TX Q DP
Description
To verify that the Tx/Rx Q lines between UPP and UEM are intact.
Explanation of Result
Pass or Fail
Manual Verification
In Phoenix, put phone in Local Mode. Next, BB Self Tests - select
ST_TX_IQ_DP_LOOP_TEST, then Run.
Troubleshooting
Connections tested are CBUS see Test 7. Connections tested at UPP: RXQD (pad N4),
TXQD (pad N2), and at UEM: RXQD (pad A14), TXQD (pad B12). Bus interface name is
RFCONVDA (5:0).
Test 12 ST MIF Loopback
Description
The purpose of this test is to verify that the Tx/Rx IQ paths inside the MFI block of the
UPP are intact. DSP will swt IQSTWrap in MFI Control Register. Next, DSP will set six of
the TX and Rx buffers to be the same. Sets Serial-Parallel bypass switches On. DSP will
write a varying pattern to both halves of the Tx buffer, then read Rx buffer and verify
data written is data received.
NOTE: This test does not test the connectivity between any two points in the HW (nodes
inside of a chip do not qualify for connectivity). This test ascertains the cause of the UEM
IQ Loopback Selftest failure, and determines whether the UPP or the UEM or the connec-
tion between them caused the UEM IQ to Loopback Selftest fail.
Explanation of Result
Pass or Fail
Manual Verification
In Phoenix, put phone in Local mode: Next, BB Self Tests - select
ST_MFI_IQ_LOOPBACK_TEST, then Run.
Troubleshooting
Connections tested are UPP only. If this test passes and Test 11 fails, then the problem is
in UEM. If both Test 11 and Test 12 fail, the problem is in UPP.