User Guide

PAMS
UIF Module DU8
NHB–3
Technical Documentation
Original 26/97
Page 5–12
The preassembled parts are the Display Module (LCD + TAB + Heatseal), Key-
Dome assemblies (Adhesive Film + Domes) and Lightguide/Reflector assembly
The basic assembly process is as follows:
– All SMD components placed & soldered.
– KeyDome assemblies fitted by hand (alignment jig recommended) (3 as-
semblies in DU8)
– Buzzer soldered manually
– Microphone soldered manually
– Speaker wires soldered manually
– Speaker attached to flexi with speaker pad
– Speaker gasket attached to top of speaker (self–adhesive)
– Display Module soldered to flexi (alignment pins required)
– Light guide/reflector assembly stuck onto the flexi over the TAB package
– LCD folded on to the top of the light guide and stuck down
– Functional tests performed.
Limited Bending Capability:
The flexible circuits are constructed from a lamina-
tion of three layers of polyimide and two layers of copper tracks. The polyimide
has almost unlimited bending capability – but the copper tracks cannot be bent
to tight radii very often. At all times before the flexi circuit is installed into a
phone, bending of the circuit should be avoided if possible. If the flexi circuit
has already been installed into the phone, then care should be taken not to
continuously fold the flexi circuit out flat and then back to its resting position too
often.
Table 9. References to Other Construction Documents
Document Code Sheets Notes
Flexi outline 2D22779 1 Mechanical Outline Drawing
Assembly Description
Table 10. References to Other Assembly Documents
Document Drawing n:o Sheets Notes
Flexi assembly for DU8C 2C23369 1 Common with DU8 Assembly Drawing