Programmes After Market Services (PAMS) Technical Documentation NHB–3 Series Transceiver NHB–3 Series Transceiver Chapter 5 UIF MODULE GU8
PAMS Technical Documentation NHB–3 UIF Module DU8 CHAPTER 5 – UIF MODULE DU8 CONTENTS Page No Introduction Technical Outline Mechanics Electronics List of Submodules and Mechanical Parts Technical Specifications Maximum Ratings DC Characteristics Control Signals AC Characteristics External Signals and Connections Mechanical Characteristics Functional Description Circuit Description DU8C Circuit Description Keyboard scanning and display driver control Keyboard and display illumination Audio Circuitry LCD M
PAMS Technical Documentation NHB–3 UIF Module DU8 Introduction NOTE! UIM (User Identity Module) = SIM (Subscriber Identity Module) DU8C UI–module ismade for HD851 project. It is used also in HD851EFR product. UI–module is based on GSM/PCN UI–module DU8. Two capacitors pads added for 18pF capacitors (2320041) from microphone pins to ground. Reason why capacitors are added is noise to microphone audio in certain situations. Also some changes are done for reability and productivity reasons.
PAMS Technical Documentation NHB–3 UIF Module DU8 1 30 DU8C Style Flexi Figure 1.
PAMS Technical Documentation NHB–3 UIF Module DU8 List of Submodules and Mechanical Parts Module Submodule / Part Material code Notes DU8C Euro/USA Display Module 4850038 Common part DU8C Earphone Gasket 9450133 Common part DU8C Lightguide Assembly 9460074 Common part DU8C Mic Rubber 9460075 Common part DU8C Reflector 9480061 Common part DU8C Speaker Pad 9480062 Common part DU8C Buzzer Gasket 9480078 Common part DU8C Keydome Film Assembly 9795002 Main keyboard DU8C Key
PAMS Technical Documentation NHB–3 UIF Module DU8 Control Signals Table 2. Control Signals Pin / Conn. Line Symbol 12 / X4 4 / X4 17 / X4 Minimum Typical / Nominal Maximum Unit / Notes MIC_ENA Mi E bl Mic_Enable – 0 3 Volts Mic Enabled VA1–0.4 VA1 VA1+3 Volts Mic Disabled BACKLIGHT K and Key d LCD lilight ht VA1–1.0 – VA1 Volts Lights On 0 – 2.0 Volts Lights Off CALL_LED C ll indicator Call i di t VA1–1.0 – VA1 Volts LED On 0 – 0.
PAMS Technical Documentation NHB–3 UIF Module DU8 Table 4. BUZZER 2.7kHz Minimum Other AC Specifications Typical/Nominal Buzzer Maximum 90 dB (S.P.L.) NOTES Level measured 30 cm from the buzzer with pulse ratio 50/50 External Signals and Connections Table 5. To Radio Module Signal Name Pin / Conn. Notes VL1 1 Logic supply voltage 4.
PAMS Technical Documentation NHB–3 UIF Module DU8 1 . . . . 30 Figure 2. UIF Connections: Order of Pin Numbering Table 6. To LCD Module Pin Signal Name Notes 1 GND Ground 2,3 OSC1, OSC2 Oscillation terminals 4–8 V1–V5 LCD driving power source 9 V5OUT Negative voltage converter output 10–11 C1, C2 4.
PAMS Technical Documentation NHB–3 UIF Module DU8 Mechanical Characteristics Table 8. Mechanical Characteristics Module Name Dimensions (mm) (W x H x D) Weight (g) Bare Flexi cir- 50 x 141 x 0.3mm except 5 cuit in areas with partial thinning or thickening. (refer to mechanical drawings for more detail. DU8C module <3.6 deep at LCD <4.2 deep at earpiece <6.
PAMS Technical Documentation NHB–3 UIF Module DU8 transistors are all wired together and supplied by emitter follower V40. The led current is fixed by the values of R44 and R45 and the ratio of R51 to R52. The current is about 5 mA/ each LED. Note that on DU9 flexis, the 17th led is driven from an additional transistor. The display illumination operates in a similar way to the keyboard drivers, two transistors are used to drive eight leds.
PAMS Technical Documentation NHB–3 UIF Module DU8 For correct operation of the display, dc voltages between –VL1 and VL1 need to be generated and fed back to the driver chip, at pins 4 to 8 inclusive (of X1). The exact voltages depend on the relative values of the resistors R21, R37, R38, R39, R40 and R33. The display driver is connected to the radio module with a 4 bit data bus.
PAMS Technical Documentation NHB–3 UIF Module DU8 The preassembled parts are the Display Module (LCD + TAB + Heatseal), KeyDome assemblies (Adhesive Film + Domes) and Lightguide/Reflector assembly The basic assembly process is as follows: – All SMD components placed & soldered.
PAMS Technical Documentation NHB–3 UIF Module DU8 Flexi Assembly for UIF Module DU8 Original 26/97 Page 5–13
PAMS Technical Documentation NHB–3 UIF Module DU8 Assembly Parts of UIF Module DU8 ITEM Q’TY 1 ..... 2 ..... 3 ..... 4 ..... 5 ..... 6 ..... 7 ..... 8 ..... 9 ..... 10 . . . . 11 . . . . 12 . . . . 13 . . . . 14 . . . . 1 1 1 1 1 1 1 1 1 1 1 1 1 1 CODE . . . . . 9855011 . . . . . 4850038 . . . . . 9460074 . . . . . 9480061 . . . . . 9795002 . . . . . 9795006 . . . . . 9480078 . . . . . 514H001 . . . . . 9450133 . . . . . 9480062 . . . . . 9460075 . . . . . 514H002 . . . . . 514H003 . . . . .
