Programmes After Market Services (PAMS) Technical Documentation NHB–3 Series Transceiver Chapter 4 SYSTEM MODULE
PAMS Technical Documentation NHB–3 System Module DB6 CHAPTER 4 – SYSTEM MODULE CONTENTS Page No System Module DB6 Baseband Block Introduction Technical Summary Interconnection Diagram Technical Specifications Control Signals Connector to UIF Module System Connector X100 Internal Signals and Connections Functional Description Clocking Scheme Diagram Circuit Description Reset and Power Control Diagram Watchdog System Diagram Power Distribution Diagram CTRLU PWRU Introduction Block Description DSPU Introduct
PAMS Technical Documentation RF Blocks Technical Summary Technical Specification Power Distribution Diagram Functional Description RF Characteristics Transmitter Synthesizer Block Diagram of Receiver Section Connections between RX and TX (Version: 6.
PAMS Technical Documentation NHB–3 System Module DB6 System Module DB6 Baseband Block Introduction The baseband block is designed for a handportable phone, that operates in the DCS1900 system. The purpose of the baseband module is to control the phone and process audio signals to and from the RF block. The module also controls the user interface. Technical Summary All functional baseband blocks are mounted on a single 6–layer printed circuit board. This board contains also RF parts.
PAMS Technical Documentation NHB–3 System Module DB6 Interconnection Diagram RF RFI UIF–module ear mic 12 bit parallel + 8 x control 32K x 16 SRAM DSP AUDIO sio UIM CARD READER A14:0, D15:0 sio sio UIF–module ext mem ASIC A5:0, D15:0 LCD DRIVER LCD A4:0 A19:16 D7:0 xmic xear dbus A19:0,D7:0 System connector PSL+ CHRGR M2 BUS Interface A12:0,D7:0 A17:0,D7:0 A14:0,D7:0 E2PROM 8K X 8 1024K x 8 FLASH 32K x 8 SRAM io io io ext mem sio sio MCU FLASH LOAD Technical Specifications
PAMS Technical Documentation NHB–3 System Module DB6 In power off mode only the circuits needed for power up are powered. This means that only power up block inside the PSL+ is powered. The power key on the flex is pulled up with a pull up resistor inside the PSL+. The local mode is used for alignment and testing. Supply Voltages and Power Consumption Pin/Conn. Symbol Notes VBATT/sys VBATT • min/typ/max 5.3 /6.0 /8.6 V sw limit • min/typ/max 4.5 /6.0 /8.9±0.3 V hw limit • min/typ/max 4.5 /6.0 /7.3±0.
PAMS Technical Documentation NHB–3 System Module DB6 Pin/Con Symbol Notes 6/sys HOOK_RXD2 • Flash loading data • min/typ/max 0 /0.2 /0.7 V Input low level • min/typ/max 3.6 /4.65 /4.8 V Input high level 7/sys PHFS TXD2 • Power control for PHF–1 • min/typ/max 0 /0.2 /0.7 V Output low, power off • min/typ/max 3.6 /4.65 /4.8 V Output high, power on • Flash loading acknowledgedata • min/typ/max 0 /0.2 /0.7 V Output low level • min/typ/max 3.6 /4.65/4.
PAMS Technical Documentation NHB–3 System Module DB6 Pin/Con Symbol Notes 10/UIF UIF5 • Keyboard row read. LCD driver register select • min/max 0 /0.7 V Output/Input low • min/max 4.5 /4.8 V Output/Input high 11/UIF UIF6 • Enable strobe for LCD driver • min/max 0 /0.7 V Output/Input low • min/max 4.5 /4.8 V Output/Input high 12/UIF MIC ENA • min/max 0 /0.7 V Output low, microphone bias on • Floating, microphone off 13–16/ UIF COL(0:3) • Keyboard columns • min/max 0 /0.
PAMS Technical Documentation NHB–3 System Module DB6 Pin/Con Symbol Notes BTYPE/ sys BTYPE • A pullup in phone. 47 kΩ resistor series with 100 kΩ resistor and transitor C–E paraller connection • min/typ/max 0.88 /0.98 /1.09 V 400mAh/15kΩ (pull resistor in the battery pack) • min/typ/max 1.02 /1.13 /1.25 V 500 mA/18kΩ • min/typ/max 1.86 /2.02 /2.20 V 950 mA/47kΩ battery don‘t be in accessorylist • min/typ/max 2.03 /2.20 /2.37 V, 1100 mAh/56 kΩ • min/typ/max 2.22 /2.39 /2.
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Pin Notes UIF5 10 Line for keyboard read and LCD–controller data/instruction register selection UIF6 11 LCD–controller enable strobe MIC_ENA 12 Microphone bias enable COL(0:3) 13–16 Lines for keyboard write CALL_LED 17 Call led enable MICP 18 Microphone (positive node) MICN 19 Microphone (negative node) EARP 20 Earpiece (negative node) EARN 21 Earpiece (positive node) BUZZER 22 PWM signal buzzer control XPWRN
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Pin Notes HOOK_RXD2 6 HOOK–indication. The phone has a 100k pull–up resistor. Data to flash from flash programmer. PHFS_TXD2 7 Hands–free device power on/off. Data to flash programming device. VCHAR 8,16 Battery charging voltage. EAR_HFPWR 10 External audio output to accessories or handsfree speaker. 100kW pull–down in HP to turn on the junction box. DSYNC 11 DBUS–data bit sync clock.
PAMS Technical Documentation NHB–3 System Module DB6 Signal Name Function Notes TXL Transmitter low power enable, ”0” = low power, ”1” = normal power ASIC–>RF RFC 26 MHz clock to ASIC CLKIN RF –> ASIC Signal Name Functions Notes AFC Automatic frequency control voltage RFI –> RF TXC TX transmit power control voltage, AGC control in receiving RFI –> RF TXQP,TXQN differential TX quadrature signal RFI –> RF TXIP,TXIN differential TX inphase signal RFI –> RF PDATA0 front end AGC contro
PAMS Technical Documentation NHB–3 System Module DB6 Functional Description Clocking Scheme Diagram RFI Clock 13 MHz Sleep Mode: 135.4kHz DSP Clock 60.2 MHz differential sine wave RF System Clock 26 MHz RFI VCTCXO OSCIL– LATOR enable ear mouth DBUSCLK 512kHz DBUSSYNC 8kHz AUDIO CODEC ASIC UIMCLK DSP 3.25 / 1.
PAMS Technical Documentation NHB–3 System Module DB6 – 8 kHz syncronisation clock for data transfer between the DSP and the codec. – 512 kHz clock and 8 kHz sync. clock for the DBUS data transfer. The DSP has its own crystal oscillator which can be turned off and on by the ASIC. The DSP uses differential sinusoidal clock. The frequency is 60.2 MHz. The MCU generates 8 kHz clock to the codec for the control data transfer.
PAMS Technical Documentation NHB–3 System Module DB6 – PSL+ will switch power on when the battery is connected. After that the MCU will detect if power key is pressed or charger connected. If not the power will be switched off. All devices are powered up at the same time by the PSL+. It supplies the reset to the ASIC at power up. The ASIC starts the clocks to the DSP and the MCU. After about 20us the ASIC releases the resets to MCU, RFI and DSP. MCU and RFI reset is released after 256 13 MHz clock cycles.
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Description Normal operation: 1. MCU tests DSP 2. MCU updates ASIC watchdog timer (> 2Hz) 3. MCU pulses the XPWROFF input on the PSL+ (about 2Hz) Failed operation: 4. ASIC resets MCU and DSP after about 0.5 s failure 5. PSL+ switches power off about1.
PAMS Technical Documentation NHB–3 System Module DB6 CTRLU Introduction The Control block contains a microcomputer unit (MCU) and three memory circuits (FLASH, SRAM, EEPROM), a 20–bit address bus and an 8–bit data bus.
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Signal description From TBAT Battery temperature detection and vibrabattery control system con. BTYPE Battery size identification system con.
PAMS Technical Documentation NHB–3 System Module DB6 Block Description MCU – Memories: The MCU has a 20 bits wide address bus A(19:0) and an 8–bit data bus with memories. The address bits A(19:16) are used for chip select decoding. The decoding is done in the D2CA ASIC. The ASIC can address two 4 Mbit (or smaller) or one 8 Mbit flash memories. Hitachi HD647536 processor has 60kbyte internal ROM and 2kbyte RAM memories. One wait state is used in flash memory access.
PAMS Technical Documentation NHB–3 System Module DB6 CTRLU – DSPU MCU and DSP communicate through ASIC. ASIC has an MCU mailbox and a DSP mailbox. MCU writes data to DSP mailbox where DSP can only read the incoming data. In MCU mailbox the data transfer direction is the opposite. When power is switched on the MCU loads data from the flash memory to DSP‘s external memory through this mailbox. CTRLU – AUDIO CTRLU control audio selections MIC/XMIC, EAR/XEAR and those lines gains.
PAMS Technical Documentation NHB–3 System Module DB6 JCONN is used to indicate that junction box is connected. DC level comes from system connector line MIC_JCONN. . . Phone can also enter minimum mode when M2BUS is connected to MIC_JCONN line. Line is connected to MCU A/D–input. Main Components Hitachi H8/536: H8/536 is a CMOS microcontroller unit (MCU) comprising a CPU core and on–chip supporting modules with 16–bit architecture. The data bus to outside world has 8 bits. 1024k*8bit FLASH memory: 150 ns.
PAMS Technical Documentation NHB–3 System Module DB6 External Signals and Connections, Outputs Signal name Signal description To XRES Master reset ASIC VL1 Logic supply voltage. Max 150 mA CTRLU,ASIC, RFI,UIF,DSPU VL2 Logic supply voltage. Max 150 mA DSPU,ASIC VA1 Analog supply voltage. Max 40 mA AUDIO,UIF VA2 Analog supply voltage. Max 80 mA RFI VREF Reference voltage 4.
PAMS Technical Documentation NHB–3 System Module DB6 Battery and charging voltages are calibrated in production; 6V is fed to the battery and charger pin and the MCU‘s A/D converter values are stored to EEPROM Main components PSL+ ASIC Generates voltages, contains power on switch, charger and battery voltage detector and watchdog. transistor BCP69–25 and Schottky STPS340U The charging current is passed through these components.
PAMS Technical Documentation NHB–3 System Module DB6 DSPU Introduction Main interfaces of the DSP: – MCU via ASIC mailbox – RFI via ASIC – ASIC – audio codec – data bus interface (DBUS) for accessories – digital audio interface (DAI) for type approval measurements Main features of the DSP block: – speech processing speech coding/decoding – RPE–LTP–LPC (regular pulse excitation long term prediction linear predictive coding) voice activity detection (VAD) for discontinuous transmission (DTX) comfort noise g
PAMS Technical Documentation NHB–3 System Module DB6 – Adjacent cell monitoring signal strength measurements neighbour timing measurements neighbour parameter reception – control functions RF controls – synthesizer control – power ramp programming – automatic gain control (AGC) – automatic frequency control (AFC) frame structure control – control of operations during a TDMA frame (with ASIC) – control of multiframe structure – channel configuration control – test functions functions for RF measurements de
PAMS Technical Documentation NHB–3 System Module DB6 Technical Description External Signals and Connections, Inputs Signal name Signal description From VL1 Logic supply voltage. Max 150 mA. PWRU VL2 Logic supply voltage. Max 150 mA. PWRU DSP1RSTX Reset for the DSP ASIC DSPCLKEN Clock enable for DSP clock oscillator circuit ASIC PCMDATRCLKX PCM data input clock.
PAMS Technical Documentation NHB–3 System Module DB6 Block Description The Control unit communicates with the DSP circuitry through a mailbox in the D2CA ASIC. The software for the external memories are loaded through this mailbox in start up. The DSP includes two serial busses. One is used for speech data transfer between the DSP and the codec. The other is used as an external data bus and it is connected to the system connector.
PAMS Technical Documentation NHB–3 System Module DB6 AUDIO Introduction The AUDIO block consists of an audio codec with some peripheral components. The codec contains microphone and earpiece amplifier and all the necessary switches for routing. The codec is controlled by the MCU. The PCM coded data comes from and goes to the DSP. Technical Specification External Signals and Connections, Inputs Signal name Signal description From VA1 Analog supply voltage. Max 40 mA.
PAMS Technical Documentation NHB–3 System Module DB6 Block Description The codec has two microphone inputs and two earphone outputs. Handportable and external audios can therefore be connected directly to the codec. The codec has internal switches to select which input or output is used. It also has microphone amplifier and earphone attenuator. Input/output selection and amplification/attenuation can be done with codec register settings. The register control is done by the MCU.
PAMS Technical Documentation NHB–3 System Module DB6 Audio Route RXQ RF RXI RFI ASIC D2CA ASIC – 12–bit A/D RFIDA (11:0) CODEC ST5080 A MIC XMI C DSP PCM OUT DSP EARPIECE XEA R PCMIN DSPDA (15:0) D2CA ASIC DSPDA (15:0) CODEC ST5080 A RFI ASIC RFIDA (11:0) TXIP TXIN TXQP TXQN RF – 8–bit D/A Main components Audio codec ST5080: Contains e.g. PCM codec, audio routing switches, microphone and earpiece amplifiers for 2 connections (internal and external devices) and DTMF generator.
PAMS Technical Documentation NHB–3 System Module DB6 ASIC Introduction The ASIC takes care of the following functions: – interface between MCU and UIF – interface between MCU, DSP and RFI – hardware accelerator functions to DSP – clock generation and disable/enable – RF controls – UIF interface – Timers – M2BUS interface – UIM interface Technical Specification External Signals and Connections, Inputs Signal name Signal description From VL1 Logic supply voltage. Max 150 mA.
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Signal description From BATDET Battery on place detection, if line go to ”0”, ASIC have interrupt and drive UIM card down.
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Signal description To PCMCOSYCLKX Bit sync clock, inverted DSPU DCLK DBUS data clock System conn DSYNC DBUS bit sync clock System conn DBUSCLK DBUS data clock DSPU DBUSSYNC DBUS bit sync clock DSPU UIMCLK UIM data clock UIF VUIM UIM power control UIF ROMSELX Chip select for the FLASH memory CTRLU EROMSELX Chip select for the EEPROM memory CTRLU BENA Power supply to headset adapter System conn RAMSELX Chip se
PAMS Technical Documentation NHB–3 System Module DB6 Interface to the MCU is done with 8 bit data bus ,5 bit lower address bus, 4 bit upper address bus, RSTRBEX, WSTROBEX, IRQX and NMI. ASIC is in the same memory space as MCU memories. The ASIC generates chip selects from the address bits A16–19. There is also M2BUS detector and netfree counter on the ASIC. Netfree interrupt IRQX occurs if no activity is detected in M2BUS in about 3ms. NMI is used to wake up the MCU from sleep mode.
PAMS Technical Documentation NHB–3 System Module DB6 The ASIC takes care of the interface between the DSP and the RFI: TX modulator, RX filter, TX and RX sample buffers and controlling state machine. The interface to RFI is done using 12 bit data bus, 4 bit address bus, RDX and WRX. There is data acknowledge (DAX) from RFI to ASIC. Also in this block are the serial RF synthesizer interface (SCLK, SDAT) and the digital RF control signals (RXPWR, TXPWR, TXP, SYNTHPWR).
PAMS Technical Documentation NHB–3 System Module DB6 RFI Introduction The RFI block consists of the RFI ASIC and its reference voltage generator. This block is an interface between the RF and baseband sections.
PAMS Technical Documentation NHB–3 System Module DB6 Signal name Signal description To TXQP,TXQN differential TX quadrature signal RF TXIP,TXIN differential TX inphase signal RF PDATA0 front end AGC–data RF External Signals and Conections, Bidirectional Signal name Signal description To/From RFIDA(11:0) 12–bit data bus ASIC Block Description The RFI provides A/D conversion of the in–phase (RXI) and quadrature (RXQ) signals in receive path.
PAMS Technical Documentation NHB–3 System Module DB6 Definitions and Abbreviations UIF . . . . User Interface module EAR . . . Ear phone MIC . . . . Microphone SIO . . . . Serial Input/Output IO . . . . . Input/Output DSP . . . Digital Signal Prosessor LCD . . . . Liquid Crystal Display MCU . . . Micro Controller Unit UIM . . . . User Identity Module MRP . . . Mouth Reference Point HP . . . . . Hand Portable HFJ . . . . Hands Free Junction (box) LSP . . . . Loud SPeaker ASIC . . .
PAMS Technical Documentation NHB–3 System Module DB6 RF Blocks Technical Summary The RF module carries out all the RF functions of the transceiver. This module works in the DCS1900 system . The RF module is constructed on a 1.0 mm thick FR4 six–layer Printed Wire Board. Components are located on both sides of the PWB. All components with height less than 2 mm are on side one and higher components are on side two.
PAMS Technical Documentation NHB–3 System Module DB6 100 % for SYNTHPWR. In IDLE–mode activities are 0.4 %, 0.0 % and 1.77 % respectively. The current of each block is controlled independently and for example TXPWR and RXPWR are not on at the same time. Regulators There is one regulator IC in the RF unit. The regulator IC CRFCONT is an RF power supply circuit basically intended for digital handportable phones. It has 8 separate linear regulators and power on/off switches for RF–circuitry.
PAMS Technical Documentation NHB–3 System Module DB6 Functional Description Receiver The receiver is a triple conversion receiver. The received RF signal from the antenna is fed via a duplex filter to the receiver unit. The signal is amplified by a discrete low noise preamplifier. The gain of the amplifier is controlled by the AGC control line (PDATA0). The nominal gain of 14 dB is reduced in the strong field condition about 36 dB. After the preamplifier the signal is filtered by ceramic filter.
PAMS Technical Documentation NHB–3 System Module DB6 Transmitter The TX intermediate frequency is modulated by an I/Q modulator contained on transmitter section of CRFRT IC. The TX I and Q signals are generated in the RFI interface circuit and they are fed differentially to the modulator. Modulated intermediate signal is amplified or attenuated in temperature compensated controlled gain amplifier (TCGA). The output of the TCGA is amplified and the output level is typically –10dBm.
PAMS Technical Documentation NHB–3 System Module DB6 First Mixer The first mixer is a single balanced passive diode mixer. The local signal is balanced by a printed circuit transformer. The mixer down converts the received RF signal to IF signal. First IF Amplifier The first IF amplifier is a bipolar transistor amplifier. First IF Filter The first IF filter is a microstripline filter. The IF filter rejects some spurious and blocking signal coming from the front end of the receiver.
PAMS Technical Documentation NHB–3 System Module DB6 TRANSMITTER Modulator Circuit, TX part of CRFRT The modulator is a quadrature modulator contained in Tx–section of CRFRT IC. The I– and Q– inputs generated by RFI interface are DC–coupled and fed via buffers to the modulator. The local signal is divided by two to get accurate 90 degrees phase shifted signals to the I/Q mixers. After mixing the signals are combined and amplified with temperature compensated controlled gain amplifier (TCGA).
PAMS Technical Documentation NHB–3 System Module DB6 and the control voltage (TXC) and controls voltage controlled amplifier (in CRFRT) and the power amplifier. The control circuit is a part of CRFRT. SYNTHESIZER Reference Oscillator The reference oscillator is a discrete VCXO and the frequency is 26 MHz. The oscillator signal is used for a reference frequency of the synthesizers and the clock frequency for the base band circuits.
Original 26/97 –4 V +6 V +4.5V +6 V CRFCONT BIAS Batt.volt.
PAMS Technical Documentation Connections between RX and TX (Version: 6.
PAMS Technical Documentation NHB–3 System Module DB6 Block Diagram Original 26/97 Page 4–48
PAMS Technical Documentation NHB–3 System Module DB6 Block Diagram of System Section Original 26/97 Page 4–49
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of CTRLU Section Original 26/97 Page 4–50
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of PWRU Section Original 26/97 Page 4–51
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of DSPU Section Original 26/97 Page 4–52
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of Audio Section Original 26/97 Page 4–53
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of ASIC Section Original 26/97 Page 4–54
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of RFI Section Original 26/97 Page 4–55
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of Receiver Section Original 26/97 Page 4–56
PAMS Technical Documentation NHB–3 System Module DB6 Circuit Diagram of Transmitter Section Original 26/97 Page 4–57
PAMS Technical Documentation NHB–3 System Module DB6 Layout Diagram of DB6 side 1 Original 26/97 Page 4–58
PAMS Technical Documentation NHB–3 System Module DB6 Layout Diagram of DB6 side 2 Original 26/97 Page 4–59
PAMS Technical Documentation NHB–3 System Module DB6 Parts List of DB6 (EDMS Issue: 3.
PAMS Technical Documentation R176 R177 R178 R179 R180 R181 R182 R183 R184 R185 R186 R190 R191 R192 R193 R194 R195 R196 R197 R198 R199 R210 R230 R231 R232 R233 R234 R235 R236 R237 R238 R239 R240 R241 R245 R246 R247 R248 R249 R250 R251 R252 R253 R254 R255 R256 R257 R260 1430726 1430726 1430726 1430726 1430762 1430726 1430726 1430734 1430726 1430726 1430726 1430726 1430754 1430754 1430754 1430754 1430754 1430754 1430754 1430804 1430804 1430754 1430804 1430804 1430842 1430796 1430778 1430762 1430762 1430762 14
PAMS Technical Documentation R261 R262 R263 R264 R265 R267 R270 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R511 R512 R513 R514 R515 R516 R517 R521 R522 R523 R524 R525 R531 R532 R533 R534 R535 R541 R543 R544 R545 R546 R547 R548 R549 R550 R551 R552 R553 R554 R555 1430784 1430804 1430760 1430792 1430792 1430778 1430754 1430784 1430722 1430740 1430778 1430772 1430710 1430804 1430804 1430774 1430754 1430770 1430832 1430740 1430710 1430762 1430726 1430722 1430744 1430770 1430764 1430734 1430734 1430710 14
PAMS Technical Documentation R556 R557 R558 R559 R560 R561 R562 R563 R564 R565 R566 R567 R568 R569 R570 R571 R572 R573 R574 R576 R577 R578 R579 R580 R584 R585 R586 R601 R602 R603 R701 R702 R703 R704 R705 R710 R712 R713 R714 R715 R727 R728 R729 R737 R738 R739 R740 R741 1430770 1430730 1430732 1430740 1430764 1430778 1430754 1430728 1430738 1430748 1430754 1430728 1430734 1430748 1430726 1430762 1430276 1430778 1430734 1430788 1430792 1430794 1430778 1430790 1430310 1430762 1430762 1430762 1430762 1430762 14
PAMS Technical Documentation R742 R743 R744 R745 R747 R748 R749 R750 R751 R755 R756 R757 R758 R765 R766 R767 R768 R780 R781 R782 R783 R784 R785 R790 R791 R792 R800 R801 R802 R803 R804 R805 R806 R807 R808 R809 R811 R820 R821 R822 R823 R824 R825 R827 R828 R829 R830 R840 1430774 1430762 1430762 1430754 1430710 1430754 1430740 1430770 1430778 1430762 1430754 1430730 1412279 1430762 1430754 1430728 1420200 1430762 1430726 1430770 1430744 1430726 1430754 1430700 1430718 1430770 1430778 1430796 1430796 1430762 14
PAMS Technical Documentation R841 R842 R843 R844 R845 R846 R847 C040 C041 C109 C110 C111 C112 C113 C114 C115 C116 C117 C118 C119 C120 C121 C122 C123 C124 C125 C126 C127 C140 C141 C142 C160 C170 C171 C172 C173 C175 C176 C177 C178 C180 C181 C182 C183 C185 C186 C187 C188 1430770 1430770 1430832 1430734 1430700 1430710 1430718 2320544 2320544 2320544 2320110 2312410 2320744 2320110 2320110 2611668 2611668 2611668 2320110 2320110 2611668 2611668 2312410 2320560 2320560 2320560 2320560 2320110 2320110 2312410 23
PAMS Technical Documentation C195 C196 C197 C198 C200 C201 C202 C203 C210 C211 C220 C221 C230 C231 C232 C233 C234 C235 C236 C237 C239 C240 C241 C250 C251 C252 C253 C254 C255 C256 C257 C258 C259 C260 C261 C262 C263 C264 C265 C266 C267 C268 C269 C270 C271 C272 C276 C277 2320544 2320560 2320560 2320560 2310791 2310791 2310791 2310791 2310791 2310791 2320544 2320544 2310791 2310791 2310791 2310791 2320598 2320598 2320544 2320544 2320560 2320560 2320560 2320560 2320560 2320560 2320560 2320560 2320110 2320560 23
PAMS Technical Documentation C278 C279 C280 C282 C283 C286 C287 C290 C291 C296 C500 C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C521 C522 C523 C524 C525 C526 C527 C528 C531 C532 C533 C534 C535 C536 C541 C542 C543 C544 C545 C546 2610100 2310791 2320560 2610100 2310791 2310791 2610100 2310791 2610100 2320560 2320544 2320520 2320544 2320560 2320544 2320544 2320544 2320520 2320756 2320544 2320544 2320520 2320516 2320516 2320516 2320756 2320560 2320520 2320530 2320744 23
PAMS Technical Documentation C547 C551 C552 C553 C554 C555 C557 C558 C559 C560 C561 C562 C563 C564 C565 C566 C567 C569 C570 C571 C572 C573 C574 C575 C580 C601 C602 C603 C604 C605 C607 C608 C609 C610 C701 C702 C703 C704 C705 C710 C711 C712 C714 C715 C717 C720 C721 C725 2320544 2320534 2320560 2320560 2320560 2320560 2320560 2320560 2320752 2320752 2320560 2320075 2320578 2320560 2310791 2320558 2310791 2320756 2320756 2320756 2310791 2320564 2320728 2320530 2320744 2310784 2312410 2312410 2310784 2312410 23
PAMS Technical Documentation C726 C729 C730 C731 C735 C736 C739 C740 C741 C755 C756 C758 C759 C760 C761 C763 C765 C766 C767 C768 C769 C770 C771 C772 C774 C775 C776 C780 C781 C782 C783 C784 C790 C791 C792 C793 C794 C795 C800 C801 C803 C804 C805 C806 C807 C808 C809 C810 2320516 2320520 2320544 2320744 2320544 2320522 2320584 2320522 2320544 2320544 2320584 2320560 2320584 2320544 2320516 2500708 2320584 2320518 2320560 2320554 2320584 2320584 2320544 2320524 2320544 2320518 2320508 2320536 2320536 2320546 23
PAMS Technical Documentation C820 C821 C822 C823 C824 C828 C829 C830 C831 C832 C840 C841 C842 C843 C844 C845 C846 C847 C848 C849 C850 C851 C862 C864 C865 L040 L140 L180 L270 L271 L272 L273 L511 L531 L532 L541 L542 L543 L544 L545 L551 L700 L710 L800 L801 L840 L841 B800 2320560 2310248 2320466 2310248 2320564 2610100 2320756 2320560 2610100 2320756 2320530 2610100 2320584 2320544 2320536 2320536 2320536 2320520 2320560 2320744 2320534 2320534 2320522 2320560 2320560 3606946 3606946 3606946 3641262 3641262 36
PAMS Technical Documentation G001 Z500 Z505 Z541 Z551 Z713 Z727 V110 V111 V141 V142 V143 V144 V145 V147 V148 V160 V161 V210 V250 V251 V252 V253 V254 V270 V501 V502 V503 V504 V511 V512 V521 V531 V532 V541 V701 V702 V710 V725 V736 V737 V738 V739 V740 V741 V755 V756 V765 4350017 4512055 4510035 4511028 4510009 4510037 4510037 4210020 4200877 4113828 4210020 4200226 4200226 4200909 4110126 4110074 4210100 4210100 4110014 4210100 4200909 4210102 4110014 4210050 4117998 4210015 4210102 4210100 4210066 4115802 42
PAMS Technical Documentation V766 V780 V781 V782 V790 V791 V792 V800 V801 V802 V840 V841 V842 D181 D184 D185 D191 D192 D200 D210 D211 D230 D231 N260 N270 N271 N551 N601 N790 N820 X100 X196 X501 4219908 4110014 4112464 4210050 4100285 4210102 4107040 4110081 4210066 4210066 4210066 4210066 4110018 4346010 4342282 4340201 4340126 4340126 4372231 4346012 4346010 4370092 4375937 4343132 4375050 4375052 4370091 4370095 4349576 4340021 5469792 5431718 9510143 9854056 Original 26/97 Transistor x 2 UMT1 Sch.
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