User's Manual Part 3

C–CCP Backplane Troubleshooting – continued
DRAFT
SCt4812T CDMA BTS Optimization/ATP
Mar 2001
6-14
Power Supply Module Interface
Each power supply module has a series of three different connectors to
provide the needed inputs/outputs to the C–CCP backplane. These
include a VCC/Ground input connector, a Harting style multiple pin
interface, and a +15 V/Analog Ground output connector. The C–CCP
Power Modules convert +27 or –48 Volts to a regulated +15, +6.5, and
+5.0 Volts to be used by the C–CCP shelf cards. In the –48 V BTS, the
LPA power modules convert –48 Volts to a regulated +27 Volts.
GLI2 Connector
This connector consists of a Harting 4SU digital connector and a
6–conductor coaxial connector for RDM distribution. The connectors
provide inputs/outputs for the GLI2s in the C–CCP backplane.
GLI2 Ethernet “A” and “B” Connections
These BNC connectors are located on the C–CCP backplane and routed
to the GLI2 board. This interface provides all the control and data
communications between the master GLI2 and the other GLI2, between
gateways, and for the LMF on the LAN.
BBX Connector
Each BBX connector consists of a Harting 2SU/1SU digital connector
and two 6–conductor coaxial connectors. These connectors provide DC,
digital, and RF inputs/outputs for the BBXs in the C–CCP backplane.
CIO Connectors
 RX RF antenna path signal inputs are routed through RX Tri–Filters
(on the I/O plate), and via coaxial cables to the two MPC modules –
the six “A” (main) signals go to one MPC; the six “B” (diversity) to
the other. The MPC outputs the low–noise–amplified signals via the
C–CCP backplane to the CIO where the signals are split and sent to
the appropriate BBX.
 A digital bus then routes the baseband signal through the BBX, to the
backplane, then on to the MCC slots.
 Digital TX antenna path signals originate at the MCCs. Each output
is routed from the MCC slot via the backplane appropriate BBX.
 TX RF path signal originates from the BBX, through the backplane to
the CIO, through the CIO, and via multi-conductor coaxial cabling to
the LPAs in the LPA shelf.
C–CCP Backplane
Troubleshooting Procedure
Table 6-15 through Table 6-24 provide procedures for troubleshooting
problems that appear to be related to a defective C–CCP backplane. The
tables are broken down into possible problems and steps that should be
taken in an attempt to find the root cause.
. . . continued on next page
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