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DMI (Digital Module Internal) Assembly Chapter 8: DMI R eplacement Procedures
• BTS Device Database Audit
• BTS Device Database Update
• Timing Initialization/V erification
• TX P ath Calibration Audit
• Spectral Purity TX Mask A TP (optional)
• W aveform Quality (Rho) A TP (optional)
• Code Domain P ower A TP (optional)
• FER T est
• Alarm V erification
Refer to the 1X UBS Macro BTS Optimization/A TP manual for the optimization procedures.
Dismantling the failed DMI assembly in the Field
P erform Procedure 8 -3Dismantling the failed DMI assembly in the Field on page 8 - 18 only if
it is desired to reclaim known good FRUs from the failed DMI assembly . This procedure must
be performed in a work area that meets the criteria described in DMI Preparation Area on
page 8 - 10 .
Procedure 8 -3 Dismantling the failed DMI assembly in the Field
IN THE DMI PREP ARA TION AREA
ESD handling precautions must be adhered to when handling and working on
the DMI assembly or the modem boards. W ear a conductiv e, high impedance
wrist str ap during handling. All work performed on the DMI assembly and modem
boards must be done in an ESD protected work area.
1
Remove the failed DMI assembly , with modems, from its packaging. Set the DMI assembly
handle side up (see Figure 8-1 Removing and installing Modem 1 on page 8- 13 ) onto a
clean, ESD protected surface.
Continued
8 -18 68P09283A64 -3
FOA SEP 2007