Installation Instructions

DMI (Digital Module Internal) Assembly Chapter 8: DMI R eplacement Procedures
DMI Preparation Area
The DMI preparation area should provide the following ESD protection and the proper
environmental conditions.
• ESD Protection:
Always wear a ground strap which must be connected to the electrostatic point on
the equipment.
Leave any conductive foam pieces on connectors or leads until the last moment.
Remove these pieces just before installing the device.
Do not wear outer clothing made of nylon or similar man made material. A cotton
overall is preferable.
If possible work on an grounded metal surface or anti -static mat. W ipe insulated
plastic work surfaces with an anti -static cloth before starting the operation.
All metal tools should be used and when not in use they should be placed on an
grounded surface.
T ake care when removing components connected to electrostatic sensitive devices.
These components may be providing protection to the device.
When mounted onto printed circuit boards (PCBs), MOS devices are normally less
susceptible to electrostatic damage. However PCBs should be handled with care,
preferably by their edges and not by their tracks and pins, they should be transferred
directly from their packing to the equipment (or the other way around) and never
left exposed on the workbench.
• Proper Environmental Conditions:
Preparation surface should be clean and dry .
Preparation environment should be clean and dry and provide protection such that
contaminates will not enter the equipment.
W ork environment should allow enough space and adequate lighting to accurately
align components during assembly .
DMI Field Preparation Procedure
P erform Procedure 8 -1 Preparing the replacement DMI assembly in the Field on page 8 - 11 in
the DMI preparation area. This procedure describes how to prepare a complete DMI assembly
from spares inventory that matches the failed DMI assembly . Up to two modems may be
installed into the DMI assembly . The following spares are required:
• DMI assembly without modem boards (Motorola model STLN6325) includes DMI chassis
with controller board, fans and front panel.
• CDMA 1X Modem Board (Motorola model SGLN6336); up to two modem boards as
required.
— AND/OR —
• EV -DO Modem Board (Motorola model SGLN6494); up to two modem boards as required.
8 -10 68P09283A64 -3
FOA SEP 2007