User's Manual

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Internal Assembly Location and Identification – continued

PRELIMINARY

1X SCt4812ET Lite BTS Optimization/ATP

08/01/2001

1-22

FILLER

POWER 1 POWER 2

HSO/LFR CSM 1 CSM 2

CCD

AMR GLI2

1 2

3 4

MCC

1 2 3

4 5 6

BBX2

SWITCH

MPC

FILLER

POWER 1 POWER 2

HSO/LFR CSM 101 CSM 102

CCD

AMR

GLI2

101 102

MCC

101 102 103

BBX2

R101

SWITCH

102

MPC

101

102 103 104 104 105 106

MPC

CSM

Power Supply

MPC

CSM

CCDCCD

AMR

HSO

AMR

GLI2 GLI2

MCC8 E or MCC24

BBX2

SWITCH

19mm Filler Panel

BBX2

CIO

FRAME 1

FRAME 101

(Expansion Frame)

MCC8 E or MCC24 MCC8 E or MCC24

MCC8 E or MCC24

Figure 1-5: SCCP Shelf, IS–95A/B and 1X Devices

SC4812ETL0003–4

NOTES:

1. MCCs may be MCC8Es, MCC24s, or

MCC–1Xx

2. BBXx may be BBX2s or BBX–1Xs

Span I/O Boards

The two span I/O boards, Span I/O A and Span I/O B (Figure 1-3),

provide the span line interface from the punchblock or the CSU

modules, if equipped, to the SCCP backplane.

Transmit & receive, non–duplexed, Receive filter, Dual

Directional Coupler (TRDC)

TRDCs provide separate, bandpass–filtered sector transmit and receive

paths. When TRDCs are used separate transmit and receive antennas are

required for each sector. As with DRDCs, TRDCs dual directional

couplers for each antenna path which permit signal monitoring by the

RFDS.