User's Manual

Internal Assembly Identification and Location68P09255A69-3
Aug 2002
1X SC4812ET Lite BTS Optimization/ATP Software Release 2.16.1.x
PRELIMINARY
1-25
Figure 1-6: SCCP Shelf, IS-95A/B and 1X Devices
FILLER
POWER 1 POWER 2
HSO/LFR CSM 1 CSM 2
CCD
AMR GLI
1 2
3 4
MCC
1 2 3
4 5 6
BBX
R1
SWITCH
1
2
1
2
1
2
MPC
MPC, EMPC
CSM
Power Supply Power Supply
MPC
CSM
CCDCCD
AMR
HSO
AMR
GLI2 GLI2
BBX2, BBX-1X
SWITCH
19mm Filler Panel
MCC8 E, MCC24E, MCC-1X
SC4812ETL0003-6
NOTES:
1. MCCs may be MCC8Es, MCC24Es,
or MCC-1Xs
2. BBXs may be BBX2s or BBX-1Xs
3. EMPC cards are used in slot MPC 2 in
companion frames to receive RX
diversity signals provided by the other
companion frame.
MCC8 E, MCC24E, MCC-1X
MCC8 E, MCC24E, MCC-1X MCC8 E, MCC24E, MCC-1X
BBX2, BBX-1X BBX2, BBX-1X
BBX2, BBX-1X BBX2, BBX-1X BBX2, BBX-1X BBX2, BBX-1X
FRAME 1
(starter and companion)
CIO
Span I/O Boards
The two span I/O boards, Span I/O A and Span I/O B (Figure 1-3),
provide the span line interface from the punchblock or the CSU
modules, if equipped, to the SCCP backplane.
Transmit & receive, non-duplexed, Receive filter, Dual
Directional Coupler (TRDC)
TRDCs provide separate, bandpass-filtered sector transmit and receive
paths. When TRDCs are used, separate transmit and receive antennas are
required for each sector. As with DRDCs, dual directional couplers for
each antenna path are incorporated in TRDCs to permit signal
monitoring by the RFDS.
1