User's Manual Part 2

Preliminary Operations: Overview

Mar 2001

2-1

SCt4812T CDMA BTS Optimization/ATP

DRAFT

Introduction

This section first verifies proper frame equipage. This includes verifying

module placement, jumper, and dual in–line package (DIP) switch

settings against the site-specific documentation supplied for each BTS

application. Next, pre-power up and initial power-up procedures are

presented.

Cell Site Types

Sites are configured as Omni with a maximum of 4 carriers, 3–sectored

with a maximum of 4 carriers, and 6–sectored with a maximum of 2

carriers. Each type has unique characteristics and must be optimized

accordingly. For more information on the differences in site types, please

refer to the BTS/Modem Frame Hardware Installation manual.

CDF

The Cell-site Data File (CDF) contains site type and equipage data

information and passes it directly to the LMF during optimization. The

number of modem frames, C–CCP shelves, BBX boards, MCC boards

(per cage), and linear power amplifier assignments are some of the

equipage data included in the CDF.

Be sure that the correct bts–#.cdf and cbsc–#.cdf files are

used for the BTS. These should be the CDF files that are

provided for the BTS by the CBSC. Failure to use the

correct CDF files can cause system errors. Failure to use

the correct CDF files to log into a live (traffic carrying)

site can shut down the site.

IMPORTANT

Site Equipage Verification

Review the site documentation. Match the site engineering equipage data

to the actual boards and modules shipped to the site. Physically inspect

and verify the equipment provided for the BTS or Modem frame and

ancillary equipment frame.

Always wear a conductive, high impedance wrist strap

while handling any circuit card/module to prevent damage

by ESD. After removal, the card/module should be placed

on a conductive surface or back into the anti–static

shipping bag.

CAUTION

Initial Installation of

Boards/Modules

Follow the procedure in Table 2-1 to verify the initial installation of

boards/modules.

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