Datasheet

A-150
SC-1000/2000
ROTARY CODED SWITCHES
■標準仕様
STANDARD SPECIFICATIONS
回路構成
Circuit type
使用温度範囲
Operating temperature range
保存温度範囲
Storage temperature range
シー
Sealing
質 量
Net weight
BCD (Real code, complementary code)
BCH (Real code, complementary code)
40 ~ 85 °C
洗浄可能(詳細はA-198をご参照下
Washable (Please refer to A-198)
み無上部設定 
0.63 g
Without knob Top setting
み付上部設定 
0.73 g
With knob Top setting
み無側部設定 
0.76 g
Without knob Side setting
み付側部設定 
0.86 g
With knob Side setting
ポジシ
No. of positions
回転トルク
Adjustment torque
プ角度
Stepping angle
端子強度(スルーホールピンの
Terminal strength (Through hole pin only)
操作部強度(つみ付のみ)
Stop strength (With knob only)
はんだ付け
Solderability
はんだ
耐熱性
Soldering
heat
スルー
ホールピン
Through
hole pin
ガルング
Gull wing
固着性(ガウィング
Shear (Gull wing only)
耐基板曲げ性(ガウィング
Substrate bending (Gull wing only)
引きはが強さ(ガウィング
Pull-off strength (Gull wing only)
16 (SC-1000), 10 (SC-2000)
4 ~ 20 mN·m {41 ~ 204 gf·cm}
22.5° (SC-1000), 36° (SC-2000)
10 N {1.02 kgf}, 10 s
245
± 3 °C, 2 ~ 3 s
5 N {0.51 kgf}, 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf}, 10 s
10 N {1.02 kgf} minimum
接点定格
Contact rating
Non-switching
Switching
Minimum
接触抵抗
Contact resistance
絶縁抵抗
Insulation resistance
耐電圧
Dielectric strength
DC50 V 100 mA
DC5 V 100 mA
DC20 mV 1 μA
1000 MΩ (DC100 V) minimum
100 mΩ maximum
AC250 V, 60 s
耐衝撃性
Shock
耐湿性
Humidity
耐久性
Load life
耐熱性
High temperature exposure
耐寒性
Low temperature exposure
温度サ
Thermal shock
振幅
(Amplitude) 1.5 mm
(全振幅)
or
加速度
(Acceleration) 98 m/s
2
,
10-500-10 Hz, 3 directions for 2 h each
490 m/s
2
, 11 ms
6 directions for 3 times each
85 °C, 96 h
抵抗負荷
Resistance load DC50V 100mA
40 °C, 相対湿度
Relative humidity
90 ~ 95 %, 240 h
20000 steps
DC5 V, 100 mA
40 °C, 96 h
40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
耐溶剤性
(洗浄溶剤浸漬)
Solvent resistance
(Dipping)
剤:IPA(イソプロピアルル)
溶剤温度:23
±
5
°C
浸透時間:5
±
0.5分
Solvent : IPA (Isopropyl alchol)
Temperature : 23 ± 5 °C
Time : 5 ± 0.5 minutes
■機械的特性
MECHANICAL CHARACTERISTICS
■環境特性
ENVIRONMENTAL CHARACTERISTICS
■電気的特性
ELECTRICAL CHARACTERISTICS
耐振性
Vibration
{ } :
参考値 
Reference only
〈はんだ耐熱性評価用
Reflow profile for soldering heat evaluation
リフロー回数:2回 Reflow : two times maximum
Peak : 250
Over 230 °C
Pre Heating Zone
180 °C
(°C)
250
200
150
100
50
150 °C
90 ± 30 s
30 ± 10 s
Soldering Zone
Heating time
Temperature
°C
+5
0
フロー:260± 3°Cの槽内に端子先
端から基板の面まで5〜6
秒間浸漬を2回
Flow : 260 ± 3 °C as the temperature in
a pot of molten solder, immer-
sion from head of terminal to
backside of board 5 ~ 6 s, two
times maximum
手は
Manual soldering
380 ± 10 °C, 3 ~ 4 s
リフロー:ピーク温度255°C
(詳細は下記プル参照)
Reflow : Peak temperature 255 °C
(Please refer to the profile below.)
手は
Manual soldering
350 ± 10 °C, 3 ~ 4 s
௙ᵝࡣᨵၿࡢࡓࡵኚ᭦ࡉࢀࡿሙྜࡀ࠶ࡾࡲࡍࠋ Specifications are sub
j
ect to chan
g
e without notice.