Datasheet

NICHIA STS-DA1-1555A <Cat.No.110318>
13
RELIABILITY
(1) Tests and Results
Test
Reference
Standard
Test Conditions
Test
Duration
Failure
Criteria
#
Units
Failed/Tested
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
T
sld
=260°C, 10sec, 2reflows,
Precondition: 30°C, 70%RH, 168hr
#1 0/22
Solderability
(Reflow Soldering)
JEITA ED-4701
303 303A
T
sld
=245±5°C, 5sec,
Lead-free Solder(Sn-3.0Ag-0.5Cu)
#3 0/22
Thermal Shock
JEITA ED-4701
300 307
-40°C to 110°C, 1min dwell,
10sec transfer,
Precondition: 30°C, 70%RH, 168hr
100cycles #1 0/100
Temperature Cycle
JEITA ED-4701
100 105
-40°C(30min)~25°C(5min)~
110°C(30min)~25°C(5min)
100cycles #1 0/100
Moisture Resistance
(Cyclic)
JEITA ED-4701
200 203
25°C~65°C~-10°C, 90%RH,
24hr per cycle
10cycles #1 0/100
High Temperature
Storage
JEITA ED-4701
200 201
T
A
=110°C 1000hours #1 0/100
Temperature Humidity
Storage
JEITA ED-4701
100 103
T
A
=60°C, RH=90% 1000hours #1 0/100
Low Temperature
Storage
JEITA ED-4701
200 202
T
A
=-40°C 1000hours #1 0/100
Room Temperature
Operating Life
T
A
=25°C, I
F
=30mA 1000hours #2 0/100
High Temperature
Operating Life
T
A
=85°C, I
F
=25mA 1000hours #2 0/100
Temperature Humidity
Operating Life
60°C, RH=90%, I
F
=20mA 1000hours #2 0/100
Low Temperature
Operating Life
T
A
=-40°C, I
F
=20mA 1000hours #2 0/100
Permanence of Marking
JEITA ED-4701
500 501
Isopropyl Alcohol, 23±5°C,
Dipping Time: 5min
1time #1 0/22
Vibration
JEITA ED-4701
400 403
200m/s
2
, 100~2000~100Hz,
4cycles, 4min, each X, Y, Z
48minutes #1 0/10
Free Fall 3drops from a height of 75cm #1 0/10
Electrostatic Discharges
JEITA ED-4701
300 304
HBM, 2kV, 1.5k, 100pF, 3pulses,
alternately positive or negative
#1 0/22
NOTES:
Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria # Items Conditions Failure Criteria
Forward Voltage(V
F
) I
F
=20mA >U.S.L.×1.1
#1
Luminous Intensity(I
V
) I
F
=20mA <L.S.L.×0.7
Forward Voltage(V
F
) I
F
=20mA >U.S.L.×1.1
#2
Luminous Intensity(I
V
) I
F
=20mA <L.S.L.×0.5
#3 Solderability - Less than 95% solder coverage
U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit
(3) Reference
The projected average time to 70% lumen maintenance for this product is 50000 hours
under the conditions of Nichia reliability test: T
A
=25°C, I
F
=25mA, and 10000 hours under the conditions of Nichia reliability test:
T
A
=85°C, I
F
=25mA, Nichia standard circuit board. Test board: FR4 board thickness=1.6mm, copper layer thickness=35µm