Product Specs

N27 Product Specifications

7.5 SMT Furnace Temperature Curve

Thin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow soldering

process to avoid poor solder joint caused by PCB bending.

Figure 7-3 SMT furnace temperature curve

Technical parameters:



Ramp up rate: 1 to 4°C/sec



Ramp down rate: -3 to -1°C/sec



Soaking zone: 150-180°C, Time: 60-100 s



Reflow zone: >220°C, Time: 40-90 s



Peak temperature: 235-245°C

Neoway will not provide a warranty for heat-responsive element abnormalities caused by improper

temperature control.

For information about cautions in N27 storage and mounting, refer to Neoway Module Reflow

Manufacturing Recommendations.

When manually desoldering the module, use heat guns with great opening, adjust the temperature to

245 degrees (depending on the type of the solder paste), and heat the module till the solder paste is

melt. Then remove the module using tweezers. Do not shake the module in high temperatures while

removing it. Otherwise, the components inside the module might get misplaced.