DAQ 6023E/6024E/6025E Multifunction I/O Devices User Manual
Table Of Contents
- 6023E/6024E/6025E User Manual
- Support
- Important Information
- Contents
- About This Manual
- Chapter 1 Introduction
- Chapter 2 Installation and Configuration
- Chapter 3 Hardware Overview
- Chapter 4 Signal Connections
- I/O Connector
- Analog Input Signal Overview
- Analog Input Signal Connections
- Analog Output Signal Connections
- Digital I/O Signal Connections
- Programmable Peripheral Interface (PPI)
- Power Connections
- Timing Connections
- Field Wiring Considerations
- Chapter 5 Calibration
- Appendix A Specifications
- Appendix B Custom Cabling and Optional Connectors
- Appendix C Common Questions
- Appendix D Technical Support Resources
- Glossary
- Index
- Figures
- Figure 1-1. The Relationship Between the Programming Environment, NI-DAQ, and Your Hardware
- Figure 3-1. PCI-6023E, PCI-6024E, PCI-6025E, and PXI-6025E Block Diagram
- Figure 3-2. DAQCard-6024E Block Diagram
- Figure 3-3. Dithering
- Figure 3-4. CONVERT* Signal Routing
- Figure 3-5. PCI RTSI Bus Signal Connection
- Figure 3-6. PXI RTSI Bus Signal Connection
- Figure 4-1. I/O Connector Pin Assignment for the 6023E/6024E
- Figure 4-2. I/O Connector Pin Assignment for the 6025E
- Figure 4-3. Programmable Gain Instrumentation Amplifier (PGIA)
- Figure 4-4. Summary of Analog Input Connections
- Figure 4-5. Differential Input Connections for Ground Referenced Signals
- Figure 4-6. Differential Input Connections for Nonreferenced Signals
- Figure 4-7. Single Ended Input Connections for Nonreferenced or Floating Signals
- Figure 4-8. Single Ended Input Connections for Ground Referenced Signals
- Figure 4-9. Analog Output Connections
- Figure 4-10. Digital I/O Connections
- Figure 4-11. Digital I/O Connections Block Diagram
- Figure 4-12. DIO Channel Configured for High DIO Power-up State with External Load
- Figure 4-13. Timing Specifications for Mode 1 Input Transfer
- Figure 4-14. Timing Specifications for Mode 1 Output Transfer
- Figure 4-15. Timing Specifications for Mode 2 Bidirectional Transfer
- Figure 4-16. Timing I/O Connections
- Figure 4-17. Typical Posttriggered Acquisition
- Figure 4-18. Typical Pretriggered Acquisition
- Figure 4-19. SCANCLK Signal Timing
- Figure 4-20. EXTSTROBE* Signal Timing
- Figure 4-21. TRIG1 Input Signal Timing
- Figure 4-22. TRIG1 Output Signal Timing
- Figure 4-23. TRIG2 Input Signal Timing
- Figure 4-24. TRIG2 Output Signal Timing
- Figure 4-25. STARTSCAN Input Signal Timing
- Figure 4-26. STARTSCAN Output Signal Timing
- Figure 4-27. CONVERT* Input Signal Timing
- Figure 4-28. CONVERT* Output Signal Timing
- Figure 4-29. SISOURCE Signal Timing
- Figure 4-30. WFTRIG Input Signal Timing
- Figure 4-31. WFTRIG Output Signal Timing
- Figure 4-32. UPDATE* Input Signal Timing
- Figure 4-33. UPDATE* Output Signal Timing
- Figure 4-34. UISOURCE Signal Timing
- Figure 4-35. GPCTR0_SOURCE Signal Timing
- Figure 4-36. GPCTR0_GATE Signal Timing in Edge Detection Mode
- Figure 4-37. GPCTR0_OUT Signal Timing
- Figure 4-38. GPCTR1_SOURCE Signal Timing
- Figure 4-39. GPCTR1_GATE Signal Timing in Edge Detection Mode
- Figure 4-40. GPCTR1_OUT Signal Timing
- Figure 4-41. GPCTR Timing Summary
- Figure B-1. 68 Pin E Series Connector Pin Assignments
- Figure B-2. 68 Pin Extended Digital Input Connector Pin Assignments
- Figure B-3. 50 Pin E Series Connector Pin Assignments
- Figure B-4. 50-Pin Extended Digital Input Connector Pin Assignments
- Tables
- Table 3-1. Available Input Configurations
- Table 3-2. Measurement Precision
- Table 3-3. Pins Used by PXI E Series Device
- Table 4-1. I/O Connector Details
- Table 4-2. I/O Connector Signal Descriptions
- Table 4-3. I/O Signal Summary
- Table 4-4. Port C Signal Assignments
- Table 4-5. Signal Names Used in Timing Diagrams
© National Instruments Corporation 5-1 6023E/6024E/6025E User Manual
5
Calibration
This chapter discusses the calibration procedures for your device. If you
are using the NI-DAQ device driver, that software includes calibration
functions for performing all of the steps in the calibration process.
Calibration refers to the process of minimizing measurement and output
voltage errors by making small circuit adjustments. For these devices, these
adjustments take the form of writing values to onboard calibration DACs
(CalDACs).
Some form of device calibration is required for all but the most forgiving
applications. If you do not calibrate your device, your signals and
measurements could have very large offset, gain, and linearity errors.
Three levels of calibration are available to you and described in this chapter.
The first level is the fastest, easiest, and least accurate, whereas the last
level is the slowest, most difficult, and most accurate.
Loading Calibration Constants
Your device is factory calibrated before shipment at approximately 25 °C
to the levels indicated in Appendix A, Specifications. The associated
calibration constants—the values that were written to the CalDACs to
achieve calibration in the factory—are stored in the onboard nonvolatile
memory (EEPROM). Because the CalDACs have no memory capability,
they do not retain calibration information when the device is unpowered.
Loading calibration constants refers to the process of loading the CalDACs
with the values stored in the EEPROM. NI-DAQ software determines
when this is necessary and does it automatically. If you are not using
NI-DAQ, you must load these values yourself.
In the EEPROM there is a user-modifiable calibration area in addition to
the permanent factory calibration area. This means that you can load the
CalDACs with values either from the original factory calibration or from a
calibration that you subsequently performed.