Data Sheet
Copyright © Future Technology Devices International Limited 39
FT230X USB TO BASIC UART IC
Version 1.4
Document No.: FT_000566 Clearance No.: FTDI# 260
9.5 Solder Reflow Profile
The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
Critical Zone: when
T is in the range
T to T
Temperature, T (Degrees C)
Time, t (seconds)
25
P
T = 25º C to T
t
p
T
p
T
L
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S
Figure 9.5 FT230X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT230X is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (T
s
to T
p
)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (T
s
Min.)
- Temperature Max (T
s
Max.)
- Time (t
s
Min to t
s
Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
T
L
:
- Temperature (T
L
)
- Time (t
L
)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (T
p
)
260°C
240°C
Time within 5°C of actual Peak Temperature
(t
p
)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, T
p
8 minutes Max.
6 minutes Max.
Table 9.1 Reflow Profile Parameter Values