Datasheet
Table Of Contents
- Thermocouple EMF to Temperature Converter, ±1.5 °C Maximum Accuracy
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Typical Temperature Accuracy from NIST ITS-90 Database, Type K.
- FIGURE 2-2: Typical Temperature Accuracy from NIST ITS-90 Database, Type J.
- FIGURE 2-3: Typical Temperature Accuracy from NIST ITS-90 Database, Type N.
- FIGURE 2-4: Temperature Sensitivity with 18-Bit Resolution, Type K.
- FIGURE 2-5: Temperature Sensitivity with 18-Bit Resolution, Type J.
- FIGURE 2-6: Temperature Sensitivity with 18-Bit Resolution, Type N.
- FIGURE 2-7: Typical Temperature Accuracy from NIST ITS-90 Database, Type S.
- FIGURE 2-8: Typical Temperature Accuracy from NIST ITS-90 Database, Type R.
- FIGURE 2-9: Typical Temperature Accuracy from NIST ITS-90 Database, Type E.
- FIGURE 2-10: Temperature Sensitivity with 18-Bit Resolution, Type S.
- FIGURE 2-11: Temperature Sensitivity with 18-Bit Resolution, Type R.
- FIGURE 2-12: Temperature Sensitivity with 18-Bit Resolution, Type E.
- FIGURE 2-13: Typical Temperature Accuracy from NIST ITS-90 Database, Type T.
- FIGURE 2-14: Typical Temperature Accuracy from NIST ITS-90 Database, Type B.
- FIGURE 2-15: Input Offset Error Voltage (VIN+, VIN-).
- FIGURE 2-16: Temperature Sensitivity with 18-Bit Resolution, Type T.
- FIGURE 2-17: Temperature Sensitivity with 18-Bit Resolution, Type B.
- FIGURE 2-18: Full-Scale Gain Error.
- FIGURE 2-19: Input Noise, % of Full-Scale.
- FIGURE 2-20: Cold-Junction Sensor Temperature Accuracy.
- FIGURE 2-21: SDA and Alert Outputs, VOL across VDD.
- FIGURE 2-22: Integral Nonlinearity across VDD.
- FIGURE 2-23: Cold-Junction Sensor Temperature Accuracy Distribution.
- FIGURE 2-24: Alert Outputs, VOH across VDD.
- FIGURE 2-25: I2C Inactive IDD across VDD.
- FIGURE 2-26: I2C Active IDD across VDD.
- FIGURE 2-27: Shutdown Current, ISHDN across VDD.
- FIGURE 2-28: SDA, SCL and ADDR Input Pins Leakage Current, ILEAK across VDD.
- FIGURE 2-29: I2C Interface Clock Stretch Duration, tSTRETCH across VDD.
- FIGURE 2-30: Temperature Calculation Duration, tCALC change across VDD.
- 3.0 Pin Description
- 4.0 Serial Communication
- 4.1 2-Wire Standard Mode I2C Protocol-Compatible Interface
- TABLE 4-1: MCP9600 Serial Bus protocol descriptions
- FIGURE 4-1: Device Addressing.
- FIGURE 4-2: Clock Stretching.
- FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-4: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-5: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-6: Timing Diagram to Sequential Read all Registers Starting from TH Register.
- 5.0 Functional Description
- FIGURE 5-1: Functional Block Diagram.
- Register 5-1: REGISTER POINTER
- TABLE 5-1: Summary of Registers and Bit Assignments
- 5.1 Thermocouple Temperature Sensor Registers
- EQUATION 5-1: Temperature Conversion
- FIGURE 5-2: Thermocouple Register’s Block Diagram.
- Register 5-2: Thermocouple Temperature Register (Read only)
- EQUATION 5-2: Temperature Conversion
- FIGURE 5-3: Thermocouple Hot-Junction Register – TΔ Block Diagram.
- Register 5-3: HOT-Junction Temperature register (READ only)
- EQUATION 5-3: Temperature Conversion
- TABLE 5-2: Resolution vs. Conversion Time
- FIGURE 5-4: Thermocouple Cold-Junction Register – TC Block Diagram.
- Register 5-4: COLD-JUNCTION TEMPERATURE REGISTER
- TABLE 5-3: ADC Resolution
- FIGURE 5-5: Delta Sigma Analog to Digital Converter, ADC Core – Block Diagram.
- Register 5-5: SAMPLE: 24-bit Register
- 5.2 Sensor Status and Configuration Registers
- 5.3 Temperature Alert Registers
- TABLE 5-4: Alert Limit Registers
- Register 5-9: Alert Limits 1, 2, 3 and 4 registers
- FIGURE 5-8: Alert Limits Set to Detect TH and TC.
- FIGURE 5-9: Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.
- TABLE 5-5: Alert Hysteresis Registers
- Register 5-10: Alert 1, 2, 3 and 4 Hysteresis Register
- FIGURE 5-10: Graphical Description of Alert Output Hysteresis Direction.
- TABLE 5-6: Alert CONFIG. Registers
- Register 5-11: Alert 1, 2, 3 and 4 Configuration Register
- Register 5-12: Device ID and revision ID register
- 6.0 Application Information
- 6.1 Layout Considerations
- 6.2 Thermal Considerations
- 6.3 Device Features
- TABLE 6-2: Recommended Resistor Values for I2C Addressing
- FIGURE 6-4: I2C Address Selection Implementation.
- FIGURE 6-5: Thermocouple Input Stage.
- FIGURE 6-6: Adding Open-Circuit Detection Resistors.
- FIGURE 6-7: Adding a Low-Pass Filter.
- FIGURE 6-8: Adding Open-Circuit Detection Resistors with an Input Low-Pass Filter.
- FIGURE 6-9: Adding Ferrite Beads.
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
MCP9600
DS20005426B-page 4 2015-2016 Microchip Technology Inc.
Sensor Characteristics
T
C
and T
H
Temperature Resolution T
RES
— ±0.0625 — °C With max. Resolution
Sampling Rate (T
A
=+25°C) t
CONV
— 320 — ms 18-bit Resolution
— 80 — ms 16-bit Resolution
— 20 — ms 14-bit Resolution
— 5 — ms 12-bit Resolution
Temperature Calculation Time t
CALC
—12—msT
A
= +25°C
Thermocouple Input
Offset Error
V
OERR
—±2—µV
Offset Error Drift
V
OERR_DRF
—50—nV/°C
Full-Scale Gain Error
G
ERR
——±0.04%FST
A
= 0°C to +85°C
Full-Scale Gain Error Drift
G
ERR_DRF
— ±0.01 — %FS
Full-Scale Integral Nonlinearity INL — 10 — ppm
Voltage Resolution V
RES
— 2 — µV 18-bit Resolution
Differential Mode Range V
IN_DF
-250 — +250 mV ADC input range
Differential Mode Impedance Z
IN_DF
— 300 — k
Common-Mode Range V
IN_CM
V
DD
-0.3 — V
DD
+0.3 V (Note 3)
Common-Mode Impedance Z
IN_CM
—25—M
Common-Mode Rejection Ratio CMRR — 105 — dB
Power Supply Rejection Ratio PSRR — 60 — dB
Line Regulation V
Line_R
—0.2—°C/V
Alert 1, 2, 3, 4 Outputs
Low-Level Voltage V
OL
——0.4VI
OL
= 3 mA
High-Level Voltage V
OH
V
DD
-0.5
——VI
OH
= 3 mA
Operating Voltage and Current
Operating Voltage V
DD
2.7 — 5.5 V
I
2
C Inactive Current I
DD
—0.30.5mAV
DD
=3.3V, T
A
= 85°C
I
2
C Active Current or during t
CALC
—1.52.5mA
Shutdown Current I
SHDN
—2 5µAI
2
C Inactive
Power On Reset (POR) Thresholds V
POR
1.0 2.1 2.6 V Rising/Falling V
DD
Thermal Response
5x5 mm MQFN Package (Cold-Junction) t
RSP
— 3 — s Time to 63%, +25°C
(Air) to +125°C (oil
bath), 2x2 inch PCB
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD
= 2.7V to 5.5V, GND = Ground, T
A
= -40°C to +125°C
(where: T
A
=T
C
, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Note 1:
The T
_ACY
temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T
is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
2:
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mV
EMF
and -0.235mV
EMF
, respectively.
Type B measures down to 500°C or 1.242mV
EMF
(see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
3: Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.