Datasheet
Table Of Contents
- Thermocouple EMF to Temperature Converter, ±1.5 °C Maximum Accuracy
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Typical Temperature Accuracy from NIST ITS-90 Database, Type K.
- FIGURE 2-2: Typical Temperature Accuracy from NIST ITS-90 Database, Type J.
- FIGURE 2-3: Typical Temperature Accuracy from NIST ITS-90 Database, Type N.
- FIGURE 2-4: Temperature Sensitivity with 18-Bit Resolution, Type K.
- FIGURE 2-5: Temperature Sensitivity with 18-Bit Resolution, Type J.
- FIGURE 2-6: Temperature Sensitivity with 18-Bit Resolution, Type N.
- FIGURE 2-7: Typical Temperature Accuracy from NIST ITS-90 Database, Type S.
- FIGURE 2-8: Typical Temperature Accuracy from NIST ITS-90 Database, Type R.
- FIGURE 2-9: Typical Temperature Accuracy from NIST ITS-90 Database, Type E.
- FIGURE 2-10: Temperature Sensitivity with 18-Bit Resolution, Type S.
- FIGURE 2-11: Temperature Sensitivity with 18-Bit Resolution, Type R.
- FIGURE 2-12: Temperature Sensitivity with 18-Bit Resolution, Type E.
- FIGURE 2-13: Typical Temperature Accuracy from NIST ITS-90 Database, Type T.
- FIGURE 2-14: Typical Temperature Accuracy from NIST ITS-90 Database, Type B.
- FIGURE 2-15: Input Offset Error Voltage (VIN+, VIN-).
- FIGURE 2-16: Temperature Sensitivity with 18-Bit Resolution, Type T.
- FIGURE 2-17: Temperature Sensitivity with 18-Bit Resolution, Type B.
- FIGURE 2-18: Full-Scale Gain Error.
- FIGURE 2-19: Input Noise, % of Full-Scale.
- FIGURE 2-20: Cold-Junction Sensor Temperature Accuracy.
- FIGURE 2-21: SDA and Alert Outputs, VOL across VDD.
- FIGURE 2-22: Integral Nonlinearity across VDD.
- FIGURE 2-23: Cold-Junction Sensor Temperature Accuracy Distribution.
- FIGURE 2-24: Alert Outputs, VOH across VDD.
- FIGURE 2-25: I2C Inactive IDD across VDD.
- FIGURE 2-26: I2C Active IDD across VDD.
- FIGURE 2-27: Shutdown Current, ISHDN across VDD.
- FIGURE 2-28: SDA, SCL and ADDR Input Pins Leakage Current, ILEAK across VDD.
- FIGURE 2-29: I2C Interface Clock Stretch Duration, tSTRETCH across VDD.
- FIGURE 2-30: Temperature Calculation Duration, tCALC change across VDD.
- 3.0 Pin Description
- 4.0 Serial Communication
- 4.1 2-Wire Standard Mode I2C Protocol-Compatible Interface
- TABLE 4-1: MCP9600 Serial Bus protocol descriptions
- FIGURE 4-1: Device Addressing.
- FIGURE 4-2: Clock Stretching.
- FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-4: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-5: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
- FIGURE 4-6: Timing Diagram to Sequential Read all Registers Starting from TH Register.
- 5.0 Functional Description
- FIGURE 5-1: Functional Block Diagram.
- Register 5-1: REGISTER POINTER
- TABLE 5-1: Summary of Registers and Bit Assignments
- 5.1 Thermocouple Temperature Sensor Registers
- EQUATION 5-1: Temperature Conversion
- FIGURE 5-2: Thermocouple Register’s Block Diagram.
- Register 5-2: Thermocouple Temperature Register (Read only)
- EQUATION 5-2: Temperature Conversion
- FIGURE 5-3: Thermocouple Hot-Junction Register – TΔ Block Diagram.
- Register 5-3: HOT-Junction Temperature register (READ only)
- EQUATION 5-3: Temperature Conversion
- TABLE 5-2: Resolution vs. Conversion Time
- FIGURE 5-4: Thermocouple Cold-Junction Register – TC Block Diagram.
- Register 5-4: COLD-JUNCTION TEMPERATURE REGISTER
- TABLE 5-3: ADC Resolution
- FIGURE 5-5: Delta Sigma Analog to Digital Converter, ADC Core – Block Diagram.
- Register 5-5: SAMPLE: 24-bit Register
- 5.2 Sensor Status and Configuration Registers
- 5.3 Temperature Alert Registers
- TABLE 5-4: Alert Limit Registers
- Register 5-9: Alert Limits 1, 2, 3 and 4 registers
- FIGURE 5-8: Alert Limits Set to Detect TH and TC.
- FIGURE 5-9: Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.
- TABLE 5-5: Alert Hysteresis Registers
- Register 5-10: Alert 1, 2, 3 and 4 Hysteresis Register
- FIGURE 5-10: Graphical Description of Alert Output Hysteresis Direction.
- TABLE 5-6: Alert CONFIG. Registers
- Register 5-11: Alert 1, 2, 3 and 4 Configuration Register
- Register 5-12: Device ID and revision ID register
- 6.0 Application Information
- 6.1 Layout Considerations
- 6.2 Thermal Considerations
- 6.3 Device Features
- TABLE 6-2: Recommended Resistor Values for I2C Addressing
- FIGURE 6-4: I2C Address Selection Implementation.
- FIGURE 6-5: Thermocouple Input Stage.
- FIGURE 6-6: Adding Open-Circuit Detection Resistors.
- FIGURE 6-7: Adding a Low-Pass Filter.
- FIGURE 6-8: Adding Open-Circuit Detection Resistors with an Input Low-Pass Filter.
- FIGURE 6-9: Adding Ferrite Beads.
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
2015-2016 Microchip Technology Inc. DS20005426B-page 3
MCP9600
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
DD
............................................................................................................................................................................ 6.0V
Voltage at all Input/Output Pins......................................................................................................... GND – 0.3V to 6.0V
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
Junction Temperature (T
J
) .................................................................................................................................... +150°C
ESD Protection on all Pins (HBM:MM)........................................................................................................... (4 kV:300V)
Latch-up Current at each Pin ............................................................................................................................. ±100 mA
†Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD
= 2.7V to 5.5V, GND = Ground, T
A
= -40°C to +125°C
(where: T
A
=T
C
, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Thermocouple Sensor Measurement Accuracy
T
H
Hot-Junction Accuracy (V
DD
=3.3V)
T
H
=T
C
+T
∆
T
H_ACY
-1.5 ±0.5 +1.5 °C T
A
= 0°C to +85°C,
-3.0 ±1 +3.0 °C
T
A
= -40°C to +125°C
T
C
Cold-Junction Accuracy (V
DD
=3.3V) T
C_ACY
-1.0 ±0.5 +1.0 °C T
A
= 0°C to +85°C
-2.0 ±1 +2.0 °C T
A
= -40°C to +125°C
T
∆
Junctions Temperature Delta Accuracy
Type K: T
∆
= -200°C to +1372°C
V
EMF
range: -5.907 mV to 54.886 mV
T
∆_ACY
-0.5 ±0.25 +0.5 °C T
A
= 0°C to +85°C,
V
DD
=3.3V (Note 1)
Type J: T
∆
= -150°C to +1200°C
V
EMF
range: -3.336 mV to 47.476 mV
Type T: T
∆
= -200°C to +400°C
V
EMF
range: -5.603 mV to 20.81 mV
Type N: T
∆
= -150°C to +1300°C
V
EMF
range: -3.336 mV to 47.476 mV
Type E: T
∆
= -200°C to +1000°C
V
EMF
range: -8.825 mV to 76.298 mV
Type S: T
∆
= 250°C to +1664°C
V
EMF
range: -1.875 mV to 17.529 mV
T
A
= 0°C to +85°C,
V
DD
=3.3V (Note 1, 2)
Type B: T
∆
= 1000°C to +1800°C
V
EMF
range: -4.834 mV to 13.591 mV
Type R: T
∆
= 250°C to +1664°C
V
EMF
range: -1.923 mV to 19.732 mV
Note 1:
The T
_ACY
temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T
is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
2:
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mV
EMF
and -0.235mV
EMF
, respectively.
Type B measures down to 500°C or 1.242mV
EMF
(see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
3: Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.