Data Sheet

INA193 , INA194 , INA195
INA196 , INA197 , INA198
SBOS307G –MAY 2004–REVISED JANUARY 2015 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply Voltage 18 V
Analog Inputs, V
IN+
, V
IN−
–18 18 V
Differential (V
IN+
) – (V
IN−
) –18 18 V
Common-Mode
(2)
–16 80 V
Analog Output, Out
(2)
GND – 0.3 (V+) + 0.3 V
Input Current Into Any Pin
(2)
5 mA
Operating Temperature –55 150 °C
Junction Temperature 150 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5mA.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±4000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101, ±1000
all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CM
Common-mode input voltage 12 V
V+ Operating supply voltage 12 V
T
A
Operating free-air temperature -40 125 ºC
7.4 Thermal Information
INA19x
THERMAL METRIC
(1)
DBV UNIT
5 PINS
R
θJA
Junction-to-ambient thermal resistance 221.7
R
θJC(top)
Junction-to-case (top) thermal resistance 144.7
R
θJB
Junction-to-board thermal resistance 49.7 °C/W
ψ
JT
Junction-to-top characterization parameter 26.1
ψ
JB
Junction-to-board characterization parameter 49.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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