Data Sheet

Datasheet [Page 17]
EMB1082
▪ Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.
▪ Dry packaging products, the guarantee period should be from 6 months date of packing seal.
▪ Humidity indicator card is in the hermetic package.
Figure 7 Humidity Card
⚫ Humidity indicator card and drying situation:
▪ 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue
after unpacking;
▪ 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after
unpacking;
▪ 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after
unpacking;
▪ 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink
after unpacking.
⚫ Drying parameters:
▪ Drying temperature: 125℃±5℃；
▪ Alarm temperature: 130℃；
▪ SMT patch when the device cool down below 36℃ in natural condition;
▪ Dry times: 1;
▪ Please dry again if the module is unsoldering in 12 hours after last drying.
⚫ SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad
because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the
corresponding responsibility;
⚫ ESD protection is required before SMT;
⚫ SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile
diagram is shown in figure 10;