Data Sheet
Table Of Contents
- Abstract
- Version history
- 1. Product Introduction
- 2. Pins and dimension
- 3. Electrical Parameters
- 4. RF parameters
- 5. Antenna Information
- 6. Assembly Information and Production Guidance
- 7. Reference Circuit
- 8. FCC and IC Information
- 9. Module MOQ and Package Information
- 10. Sales Information and Technical Support
Datasheet [Page 16]
EMB1082
6. Assembly Information and Production Guidance
Assembly Size
Figure 6 EWB1082 mechanical size (Unit: mm)
Production Guidance（Important）
⚫ The stamp hole package module produced by Mxchip must completely being patched by SMT machine
in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping
and drying before patch.
▪ Devices for SMT patch:
（1）Reflow soldering machine
（2）AOI detector
（3）Suction nozzle with 6-8mm caliber
▪ Device for drying:
（1）Cabinet type oven
（2）Anti-static and high thermos tolerant tray
（3）Anti-static and high thermos tolerant gloves
⚫ Conditions of product storage (Storage environment is shown in figure 8):