Datasheet

SCA100T Series
VTI Technologies Oy Subject to changes 17/18
www.vti.fi Doc. nr. 8261800 Rev.A
4.2 Reflow Soldering
The SCA100T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 17. Recommended SCA100T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature Sn-Pb Eutectic
Assembly
Pb-free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max. 3°C/second max.
Preheat
- Temperature min (T
smin
)
- Temperature max (T
smax
)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Tsmax to T, Ramp up rate 3°C/second max
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
183°C
60-150 seconds
217°C
60-150 seconds
Peak temperature (T
P
) 240 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak Temperature (T
P
) 10-30 seconds 20-40 seconds
Ramp-down rate 6°C/second max 6°C/second max
Time 25° to Peak temperature 6 minutes max 8 minutes max
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
• Preheating time and temperatures according to guidance from solder paste manufacturer.
• It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
• Wave soldering is not recommended.
• Ultrasonic cleaning is not allowed. The sensing element may be damaged by an ultrasonic
cleaning process.