Datasheet

1. Standard Land Pattern Dimensions
A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip
inductor (chip coil) electrode.
(in mm)
c
a
b
Standard Land DimensionsSeries
LQH31M
1.5 4.5 1.0
LQM18N
LQM21N
0.7
1.0
2.2-2.6
1.8-2.0
3.0-4.0
0.7
1.2
LQM18N
LQM21N
LQH31M
LQH32M
Part Number
abc
Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator.
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
5.5
1.0
2.0
1.0
1.3 1.0
Flow
Reflow
7.5
1.5
3.0 1.5
1.5 1.5
LQH43M
LQH43N
2. Standard Soldering Conditions
(1) Soldering method
Chip inductor (Chip coils) can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux: Use rosin-based flux, but not strongly acidic flux (with
chlorine content exceeding 0.2wt%).
Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Soldering and Mounting
Inductor for Low Frequency Circuits
Continued on the following page.
107
Inductor for Low Frequency CircuitsRF Inductor
Soldering and Mounting
Inductor for Power Lines (Power Inductor)
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
O05E.pdf
Oct.13,2011