Datasheet

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UEI15 Series
Isolated Wide Input Range 15-Watt DC/DC Converters
MDC_UEI15W.C14 Page 15 of 17
disabled when the On/Off is grounded or brought to within a low voltage (see
Specifi cations) with respect to –V
IN.
Negative-logic devices are on (enabled) when the On/Off is grounded or
brought to within a low voltage (see Specifi cations) with respect to –V
IN. The
device is off (disabled) when the On/Off is left open or is pulled high to +15V
DC
max. with respect to –V
IN.
Dynamic control of the On/Off function should be able to sink appropriate
signal current when brought low and withstand appropriate voltage when
brought high. Be aware too that there is a fi nite time in milliseconds (see
Specifi cations) between the time of On/Off Control activation and stable,
regulated output. This time will vary slightly with output load type and current
and input conditions.
There are three CAUTIONs for the On/Off Control:
CAUTION: To retain full output circuit isolation, control the On/Off from the in-
put side ONLY. If you must control it from circuits in the output, use some form
of optoisolation to the On/Off Control. This latter condition is unlikely because
the device controlling the On/Off would have to remain powered on and not be
powered from the converter.
CAUTION: While it is possible to control the On/Off with external logic if you
carefully observe the voltage levels, the preferred circuit is either an open
drain/open collector transistor, a switch or a relay (which can thereupon be
controlled by logic).
CAUTION: Do not apply voltages to the On/Off pin when there is no input
power voltage. Otherwise the converter may be permanently damaged.
Figure 7. Driving the On/Off Control Pin (suggested circuit)
ON/OFF CONTROL
CONTROL
+ Vcc
-VIN
Through-hole Soldering Guidelines
Murata Power Solutions recommends the TH soldering specifi cations below when install-
ing these converters. These specifi cations vary depending on the solder type. Exceeding
these specifi cations may cause damage to the product. Your production environment may
differ; therefore please thoroughly review these guidelines with your process engineers.
Wave Solder Operations for through-hole mounted products (THMT)
For Sn/Ag/Cu based solders:
Maximum Preheat Temperature 115° C.
Maximum Pot Temperature 270° C.
Maximum Solder Dwell Time 7 seconds
For Sn/Pb based solders:
Maximum Preheat Temperature 105° C.
Maximum Pot Temperature 250° C.
Maximum Solder Dwell Time 6 seconds
SMT Refl ow Soldering Guidelines
The surface-mount refl ow solder profi le shown below is suitable for SAC305 type lead-
free solders. This graph should be used only as a guideline. Many other factors infl uence
the success of SMT refl ow soldering. Since your production environment may differ,
please thoroughly review these guidelines with your process engineers.