Datasheet

PERFORMANCE DATA
Maximum Current Temperature Derating at Sea Level
(VIN= 12V, VOUT = 2.5V)
Maximum Current Temperature Derating at Sea Level
(VIN= 12V, VOUT = 6V).
Maximum Current Temperature Derating at Sea Level
(VIN= 12V, VOUT = 1V).
2
3
4
5
6
7
8
9
10
11
12
20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (ºC)
Output Current (Amps)
Natural convection
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
1.5 m/s (300 LFM)
2.0 m/s (400 LFM)
2
3
4
5
6
7
8
9
10
11
12
20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (ºC)
Output Current (Amps)
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
1.5 m/s (300 LFM)
2.0 m/s (400 LFM)
2
3
4
5
6
7
8
9
10
11
12
1 6 11 16 21 26 31 36 41 46 51 56 61 66
Ambient Temperature (ºC)
Output Current (Amps)
Natural convection
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
1.5 m/s (300 LFM)
2.0 m/s (400 LFM)
Soldering Guidelines
Murata Power Solutions recommends the specifi cations below when installing these converters. These specifi cations vary depending on the solder type. Exceeding these specifi ca-
tions may cause damage to the product. Your production environment may differ; therefore please thoroughly review these guidelines with your process engineers.
Wave Solder Operations for through-hole mounted products (THMT)
For Sn/Ag/Cu based solders: For Sn/Pb based solders:
Maximum Preheat Temperature 115° C. Maximum Preheat Temperature 105° C.
Maximum Pot Temperature 270° C. Maximum Pot Temperature 250° C.
Maximum Solder Dwell Time 7 seconds Maximum Solder Dwell Time 6 seconds
OKR-T/10-W12 Series
Adjustable Output 10-Amp SIP-mount DC/DC Converters
MDC_OKR-T/10-W12 Series.A09 Page 6 of 10
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