Datasheet

Soldering Guidelines
Murata Power Solutions recommends the specifi cations below when installing these
converters. These specifi cations vary depending on the solder type. Exceeding these
specifi cations may cause damage to the product. Your production environment may differ
therefore please thoroughly review these guidelines with your process engineers.
Reflow Solder Operations for surface-mount products (SMT)
For Sn/Ag/Cu based solders:
Preheat Temperature Less than 1 ºC. per second
Time over Liquidus 45 to 75 seconds
Maximum Peak Temperature 260 ºC.
Cooling Rate Less than 3 ºC. per second
For Sn/Pb based solders:
Preheat Temperature Less than 1 ºC. per second
Time over Liquidus 60 to 75 seconds
Maximum Peak Temperature 235 ºC.
Cooling Rate Less than 3 ºC. per second
0
50
100
150
200
250
0 30 60 90 120 150 180 210 240 270 300
Time (sec)
Temperature (°C)
Preheating Zone
240 sec max
Soaking Zone
120 sec max
Reflow Zone
time above
217° C
45-75 sec
Peak Temp.
235-260° C
<1.5° C/sec
High trace = normal upper limit
Low trace = normal lower limit
Recommended Lead-free Solder Refl ow Profi le
CAUTION: Do not refl ow the DC-DC converter as follows, because the
DC-DC converter may fall from the substrate during refl owing.
Substrate
DC-DC Converter
0123456
0
2
4
6
8
10
12
14
16
Vin=14V / Vout=1V
Vin=4.5V / Vout=3.3V
Output Voltage (V)
Input Voltage (V)
Upper Limit
Lower Limit
5
6
7
8
9
10
11
12
13
14
15
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
without Sync (400kHz)
Sync 420kHz
Sync 520kHz
Sync 600kHz
Output Voltage (V)
Input Voltage (V)
Figure 8. Voltage Range Graph Figure 9 Voltage Range Graph (range expansion)
Voltage Range Graph
Please observe the limits below for voltage input and output ranges. These
limits apply at all output currents (Ta = 25°C).
OKL2-T/12-W12 Series
Programmable Output 12-Amp iLGA SMT PoL
DC-DC Converter Series
MDC_OKL2-T/12-W12.B02 Page 18 of 19
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