Datasheet

Soldering Information - Hole Mounting (SIP version)
The product is intended for plated through hole mounting by wave or
manual soldering. The pin temperature is specifi ed to maximum to
270°C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat tempera-
ture of 150°C is suggested. When soldering by hand, care should be
taken to avoid direct contact between the hot soldering iron tip and
the pins for more than a few seconds in order to prevent overheating.
A no-clean fl ux is recommended to avoid entrapment of cleaning
fl uids in cavities inside the product or between the product and the
host board. The cleaning residues may affect long time reliability and
isolation voltage.
Delivery Package Information (SIP version)
The products are delivered in antistatic trays.
Tray Specifications
Material Antistatic Polyethylene foam
Surface resistance 10
5
< Ohms/square <10
11
Bakability The trays are not bakeable
Tray thickness 15 mm [0.709 inch]
Box capacity 100 products, 2 full trays/box)
Tray weight 35 g empty tray, 549 g full tray
OKDx-T/50-W12-C
50A Digital PoL DC-DC Converter Series
MDC_OKDx-T/50-W12-C.A04 Page 41 of 41
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Murata Power Solutions, Inc. makes no representation that the use of its products in the circuits described herein, or the use of other
technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply
the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Specifi cations are subject to change without
notice. © 2016 Murata Power Solutions, Inc.
Murata Power Solutions, Inc.
11 Cabot Boulevard, Mansfi eld, MA 02048-1151 U.S.A.
ISO 9001 and 14001 REGISTERED
This product is subject to the following operating requirements
and the Life and Safety Critical Application Sales Policy:
Refer to: http://www.murata-ps.com/requirements/