Datasheet

Soldering Information - Surface Mounting and Hole Mount
through Pin in Paste Assembly
The product is intended for forced convection or vapor phase refl ow
soldering in SnPb or Pb-free processes.
The refl ow profi le should be optimised to avoid excessive heating
of the product. It is recommended to have a suffi ciently extended
preheat time to ensure an even temperature across the host PWB and
it is also recommended to minimize the time in refl ow.
A no-clean fl ux is recommended to avoid entrapment of cleaning
fl uids in cavities inside the product or between the product and the
host board, since cleaning residues may affect long time reliability
and isolation voltage.
General reflow process specifications SnPb eutectic
Pb-free
Average ramp-up (T
PRODUCT
) 3°C/s max 3°C/s max
Typical solder melting (liquidus)
temperature
T
L
183°C 221°C
Minimum refl ow time above T
L
60 s 60 s
Minimum pin temperature T
PIN
210°C 235°C
Peak product temperature T
PRODUCT
225°C 260°C
Average ramp-down (T
PRODUCT
) 6°C/s max 6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
Minimum Pin Temperature Recommendations
Pin number 2B is chosen as reference location for the minimum pin
temperature recommendation since this will likely be the coolest
solder joint during the refl ow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in excess of the
solder melting temperature, (TL, 183°C for Sn63Pb37) for more than
60 seconds and a peak temperature of 220°C is recommended to
ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and fl ux system used on the host board, up to a recommended
maximum temperature of 245°C could be used, if the products are
kept in a controlled environment (dry pack handling and storage) prior
to assembly.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in excess of
the solder melting temperature (TL, 217 to 221°C for SnAgCu solder
alloys) for more than 60 seconds and a peak temperature of 245°C on
all solder joints is recommended to ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PWB near pin 10B is chosen as reference location
for the maximum (peak) allowed product temperature (TPRODUCT) since
this will likely be the warmest part of the product during the refl ow
process.
SnPb solder processes
For SnPb solder processes, the product is qualifi ed for MSL 1 accord-
ing to IPC/JEDEC standard J STD 020C.
During refl ow TPRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualifi ed for MSL 3
according to IPC/JEDEC standard J-STD-020C.
During refl ow TPRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free refl ow soldering processes are
delivered in standard moisture barrier bags according to IPC/JEDEC
standard J STD 033 (Handling, packing, shipping and use of moisture/
refl ow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering processes
requires dry pack storage and handling. In case the products have
been stored in an uncontrolled environment and no longer can be
considered dry, the modules must be baked according to J STD 033.
Thermocoupler Attachment
T
PRODUCT
maximum
T
PIN
minimum
Time
niP
prole
Product
prole
T
L
Time in
reow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Pin 10B for measurement of maximum
Product temperature T
PRODUCT
Pin 2B for measurement of minimum Pin (solder joint)
temperature T
PIN
OKDx-T/50-W12-C
50A Digital PoL DC-DC Converter Series
MDC_OKDx-T/50-W12-C.A04 Page 39 of 41
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