Datasheet

LXDC3EP series
Micro DC-DC converter
17
Dec 2014
11.Reliability Tests
No. Items Specifications Test Methods QTY
Result
(NG)
1 Vibration
Resistance
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s
2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction
Total 6 h.
18
G
(0)
2 Deflection Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
18
G
(0)
3 Soldering strength
(Push Strength)
9.8 N Minimum Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
4 Solderability of
Termination
75% of the
terminations is to be
soldered evenly and
continuously.
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat : 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
18
G
(0)
5 Resistance to
Soldering Heat
(Reflow)
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 sec.
High Temperature : 220 °C
High Temp. Period : 20sec.
Peak Temperature : 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
18
G
(0)
Pushing Direction
Jig
Specimen