Datasheet

The HPR4XXC devices are intended for wave soldering or manual soldering.
They are not intended to be subject to surface mount processes under any circumstances.
The normal wave soldering process can be used with these devices where the device is subjected
to a maximum wave temperature of 260°C for a period of no more than 10 seconds. Within this
time and temperature range, the integrity of the device’s plastic body will not be compromised and
internal temperatures within the converter will not exceed 175°C. Care should be taken to control
manual soldering limits identical to that of wave soldering.
SOLDERING INFORMATION
SPECIFICATIONS, ALL MODELS
Specifications are at T
A
= +25°C nominal input voltage unless otherwise specified.
GENERAL
OUTPUT
PARAMETER CONDITIONS MIN TYP MAX UNITS
INPUT
Voltage Range 4.5 5 5.5 VDC
10.8 12 13.2 VDC
13.5 15 16.5 VDC
21.6 24 26.4 VDC
OUTPUT
Rated Power 750 mW
Voltage Setpoint Accuracy Rated Load, Nominal V
IN
±5 %
Ripple & Noise BW = DC to 10MHz 150 200 mVp-p
BW =10Hz to 2MHz 30 40 mVrms
Voltage (Over Input Voltage Range) 1mA to Rated Current, V
OUT
= 5V 4.75 7 VDC
1mA to Rated Current, V
OUT
= 12V 11.40 15 VDC
1mA to Rated Current, V
OUT
= 15V 14.25 18 VDC
Temperature Coefficent .01 .05 %/°C
REGULATION
Load Regulation (All other modes) Rated Load to 1mA Load 3 %
GENERAL
ISOLATION
Rated Voltage 1000 VDC
Test Voltage 60 Hz, 60 Seconds 3000 Vpk
Resistance 10 GΩ
Capacitance 25 100 pF
Leakage Current V
ISO
= 240VAC, 60Hz 2 7 µArms
Switching Frequency 170 kHz
Frequency Change Over Line and Load 24 %
Package Weight 3 g
MTTF per MIL-HDBK-217, Rev. F* Circuit Stress Method
Ground Benign T
A
= +25°C 7.9 MHr
TEMPERATURE
Specification -25 +25 +85 °C
Operation -40 +100 °C
Storage -40 +110 °C
2016-09-23 TDC_HPR4xxC.F01 Page 2 of 4
HPR4XXC
0.75 Watt Miniature SIP DC/DC Converter
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