Datasheet

These devices are intended for wave soldering or manual soldering.
They are not intended to be subject to surface mount processes under any circumstances.
The normal wave soldering process can be used with these devices where the device is subjected to a maximum wave temperature of 260°C for a period of
no more than 10 seconds. Within this time and temperature range, the integrity of the device’s plastic body will not be compromised and internal temperatures
within the converter will not exceed 175°C. Care should be taken to control manual soldering limits identical to that of wave soldering.
THROUGH-HOLE SOLDERING INFORMATION
PARAMETER CONDITIONS MIN TYP MAX UNITS
INPUT
Voltage Range 4.5 5 5.5 V
DC
10.8 12 13.2
13.5 15 16.5
Refl ected Ripple Current 35
1
mAp-p
ISOLATION
Rated Voltage 3000 V
DC
Test Voltage 60 Hz, 10 Seconds 8000 Vpk
Resistance 10 GΩ
Capacitance 10 pF
Leakage Current V
ISO= 240VAC, 60Hz 1.2 2 µArms
OUTPUT
Rated Power 4 W
Voltage Setpoint Accuracy ±3 ±5 %
Temperature Coeffi cient ±0.02 %/°C
Ripple & Noise BW = DC to 10MHz 100 mVp-p
BW = 10Hz to 2MHz 20 mVrms
Line Regulation High Line to Low Line ±1.5 %/% Vin
Load Regulation See performance curves
GENERAL
Switching Frequency 100 kHz
Package Weight 22 g
MTTF per MIL-HDBK-217, Rev. E Circuit Stress Method
Ground Benign T
A = +25°C 200,000 Hr
TEMPERATURE
Specifi cation -25 +70 °C
Operation -40 +85 °C
Storage -40 +110 °C
COMMON SPECIFICATIONS
Specifi cations typical at TA = +25°C, nominal input voltage, rated output current unless otherwise noted.
1. Refl ected ripple current is measured at 50% load with a 33uF capacitor across the input of the UUT.
TDC_HB04UC.D01 Page 3 of 4
HB04UC
4.0W Unregulated High Isolation DC/DC Converter
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