Specifications

Table Of Contents
AppendixCEnvironmentalInformation
24 MultiTechSystems,Inc.MultiModemCellUserGuide
MultiTechSystems,Inc.alsodeclaresithasbeendulydiligentinensuringthattheproductssuppliedare
compliantthroughaformalizedprocesswhichincludescollectionandvalidationofmaterialsdeclarationsand
selectivematerialsanalysiswhereappropriate.Thisdataiscontrolledasapartofaformalqualitysystemand
willbemadeavailableupo
nrequest.
RestrictionoftheUseofHazardousSubstances(RoHS)
MultiTechSystems,Inc.
CertificateofCompliance
2002/95/EC
MultiTechSystems,Inc.confirmsthatthisproductnowcomplieswiththechemicalconcentrationlimitations
setforthinthedirective2002/95/ECoftheEuropeanParliament(RestrictionOftheuseofcertainHa zardous
Substancesinelectricalandelectronicequipment‐RoHS)
TheseMultiTechSyste
ms,Inc.productsdonotcontainthefollowingbannedchemicals:
Lead,[Pb]<1000PPM
Mercury,[Hg]<1000PPM
HexavalentChromium,[Cr+6]<1000PPM
Cadmium,[Cd]<100PPM
PolybrominatedBiphenyl,[PBB]<1000PPM
PolybrominatedDiphenylEther,[PBDE]<1000PPM
MoistureSensitivityLevel(MSL)=1
MaximumSolderingte
mperature=260C(waveonly)
Notes:
1. LeadusageinsomecomponentsisexemptedbythefollowingRoHSannex;therefore,higherlead
concentrationcouldbefound.
a. Leadinhighmeltingtem peraturetypesolders(thatis,tinleadsolderalloyscontainingmorethan85%
lead).
b. Leadinelectronicceramicparts(forexample,piezoelectronicdevices).
2. MoistureSensitivityLevel(MSL)Analysisisbasedonthecomponents/materia l usedontheboard.