Datasheet

NO CLEAN, CLEAR RESIDUE CORED SOLDER
WIRE FLUXES
Properties of Multicore 400, 502, 505 and 511 solid flux
for cored solder wires
• Halide free version – Multicore 400
• Fast soldering – range of activities to suit all
applications
• copper, brass and nickel Good spread on
• Clear residues
• Heat stable – low spitting
e
ontain higher halide levels to maximise soldering power.
er improve residue appearance by reducing
e quantity.
ailable at 1% flux content (formerly
ulticore X-39).
le
EN
Wires”. A
ide range of wire diameters is available.
ontents and alloys may be manufactured
special order.
ethods and detailed test results
re available on request.
wires
l
nt “Properties of
lloys used in Cored Solder Wires”.
d
carefully selected
activators. In use t sin odour and
tit ar
PRODUCT RANGE
Multicore 400 is designed for users who require a halid
free formulation. The remaining products in the range
c
Multicore 400, 502, 505 and 511 cored wires are
manufactured with a range of flux contents. Although
users will normally be using products with a nominal flux
content of 3%, the superior performance of these products
may allow a lower flux content to be specified e.g 2.2%.
This will furth
th
For applications requiring low residue halide free fluxes,
Multicore 400 is av
M
Multicore 400, 502, 505 and 511 cored wires are availab
in a variety of alloys conforming to J-STD-006 and
29453 or alloys conforming to similar national or
international standards. For details refer to document
“Properties of Alloys used in Cored Solder
w
Alternative flux c
to
TECHNICAL SPECIFICATION
A full description of test m
a
Alloys: The alloys used for Multicore cored solder
conform to the purity requirements of the common
national and international standards. A wide range of wire
diameters is available manufactured to close dimensiona
tolerances. For details refer to docume
A
Flux: Multicore Multicore 400, 502, 505 and 511 soli
fluxes are based on modified rosins and
hey exhibit a mild ro
leave a small quan y of cle residue.
FLUX PROPERTIES
TEST 400 502 505 511
Acid Value, mg KOH/g 0 2 7 6 205-22 156-17 159-17 164-17
Halide content, % Zero 0.2 0.5 1.1
J-STD-004
Solder spread mm
-2
0
0
5
0
Corrosion Test
21
Pass
31
Pass
31
Pass
34
Pass
SIR Test (without
cleaning)
IPC-SF-818 Class 3
T-
ass
ass
Bellcore TR-NW
000078
P
P
Pass
Pass
Pass
Pass
Pass
Pass
Electromigration Test
g)
-NWT-
(without cleanin
Bellcore TR
000078
Pass
Pass
Pass
Pass
Classification
N29454-1 E
J-STD-004
IPC-SF-818
ROLO
LR3CN
1.1.3
1.1.2
ROM1
MR3CN
ROM1
MR3CN
ROM1
MR3CN
1.1.2
1.1.2
SPECIAL PROPERTIES
Multicore 400, 502, 505 and 511 cored solder wires are
designed to give fast and sustained wetting on both co
and brass. This can be demonstrated using spreading tests
on both substrates under standard conditions for the
Multicore products and comparable competitor pr
pper
oducts.
fter 5 seconds, area of spread is measured to form a
co
A
mparative index indicating total flux efficacy.
RELATIVE W RFORMETTING PE ANCE OF MULTICORE
AND HAL OMPE ODUCIDE FREE C TITOR PR TS*
PRODUCT F SPREADLUX AR OFEA , mm
2
CO T Oxidised
copper*
Oxidised NTEN
(%) brass
Multicore
400
2.2 222 209
Competitor A 3.5 191 140
Competitor B 2.5 202 140
*-oxidised for 1 hour @ 205°C
RELA ETT ORTIVE W ING PERF MANCE OF
MULT TSICORE AND COMPETITOR PRODUC *
F LUX HA E LID AREA OF
m
2
SP
m
READ
PRODUCT CO NT
(
CO Oxidised
copper*
Oxidised NTE
%)
NTENT
(%) brass
Multicore
502
2.7 0.2 220 160
Competitor E 2 0.4 200 150
Competitor F 2.4 0.4 190 180
Competitor
G
3.5 0.4 150 120
Competitor
H
2.7 0.5 230 150
Multicore 2.7
505
0.5 220 240
*-oxidised for 1 hour @ 205°C
Technical Data Sheet
Multicore
®
Cored Solder Wire Flux
400, 502, 505 & 511
August 2006
NOT FOR PRODUCT SPECIFICATIONS
E TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
NCE AND R
TH
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTA ECOMMENDA
PRODUCT.
TIONS ON SPECIFICATIONS FOR THIS